CN-122028380-A - Liquid cooling module and electronic equipment

CN122028380ACN 122028380 ACN122028380 ACN 122028380ACN-122028380-A

Abstract

The invention discloses a liquid cooling module and electronic equipment, and relates to the technical field of heat dissipation, wherein the liquid cooling module comprises a first cover plate, a first runner plate, a second cover plate and a driving piece, the first cover plate is made of transparent materials, the first runner plate is arranged on one side of the first cover plate and is provided with a first runner hole penetrating in the thickness direction, the conductivity of the second cover plate is more than or equal to 10 4 S/m, the second cover plate is arranged on one side of the first runner plate, which is opposite to the first cover plate, the first runner plate and the second cover plate are jointly enclosed to form a closed first runner, the first runner is configured to accommodate liquid working media, the driving piece is arranged on one side of the first cover plate or the second cover plate, which is opposite to the first runner, and the driving piece is configured to drive the liquid working media in the first runner to flow. The technical scheme provided by the invention can realize the integration of heat dissipation, electromagnetic shielding, visual appreciation and other functions, and is beneficial to the ultrathin design of electronic equipment.

Inventors

LI KE
YU QUANYAO
ZHAO TAOCHENG

Assignees

歌尔股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260331

Claims (10)

1. The utility model provides a liquid cooling module, is applied to electronic equipment, its characterized in that includes: the first cover plate is made of transparent material; The first runner plate is arranged on one side of the first cover plate and is provided with a first runner hole penetrating in the thickness direction; The conductivity of the second cover plate is more than or equal to 10 4 S/m, the second cover plate is arranged on one side of the first flow passage plate, which is opposite to the first cover plate, and the first cover plate, the first flow passage plate and the second cover plate are jointly enclosed to form a closed first flow passage, and the first flow passage is configured to contain liquid working medium, and The driving piece is arranged on one side of the first cover plate or the second cover plate, which is opposite to the first runner plate, and the driving piece is configured to drive the liquid working medium in the first runner to flow.
2. The liquid cooling module according to claim 1, wherein a heat source contact area and a non-heat source contact area are formed on a surface of the second cover plate facing away from the first flow channel plate, and the heat source contact area is configured to be arranged corresponding to a heat generating device of the electronic apparatus; The second cover plate is provided with a heat-insulating coating in the non-heat source contact area.
3. The liquid cooling module according to claim 2, wherein the second cover plate is provided with through holes in the heat source contact area, and the first runner holes are spaced apart from the through holes; the liquid cooling module further comprises a soaking plate, and the soaking plate is arranged in the through hole and connected with the first flow channel plate.
4. The liquid cooling module according to claim 1, wherein the inner surface of the first cover plate is further provided with a thermochromic coating, and the thermochromic coating has a color change threshold of 45 ℃ to 60 ℃; And/or the thermochromic coating comprises thermochromic microcapsules, wherein the particle size of the thermochromic microcapsules is 1-3 μm.
5. The liquid cooling module according to any one of claims 1 to 4, wherein the first cover plate is made of a transparent plastic material or a glass material; And/or, the second cover plate is made of a metal material or a composite material, and the composite material comprises a conductive material.
6. An electronic device comprising the liquid cooling module according to any one of claims 1 to 5.
7. The electronic device of claim 6, wherein the electronic device comprises a rear cover, the first cover plate being exposed to form the rear cover.
8. The electronic device of claim 6, further comprising a middle frame, wherein the middle frame comprises a first frame part and a second frame part, the second frame part is connected to the inner side of the first frame part, both sides of the first frame part and the second frame part form a step structure, the second cover plate is arranged on one side of the second frame part, and the driving piece is arranged on one side of the second cover plate facing away from the first flow channel plate and is positioned on the inner side of the second frame part; and a circulation cavity is arranged in the first frame body part along the circumferential direction, and is communicated with the first flow passage, so that the liquid working medium circularly flows between the first flow passage and the circulation cavity.
9. The electronic device of claim 8, wherein the liquid cooling module further comprises a second heat dissipation structure, the second heat dissipation structure is disposed on a side of the middle frame facing away from the second cover plate and is located on the other side of a heat generating component in the electronic device; the second heat dissipation structure comprises a third cover plate, a second runner plate and a fourth cover plate which are sequentially stacked, the second runner plate is provided with a second runner hole penetrating in the thickness direction, and the third cover plate, the second runner plate and the fourth cover plate are jointly enclosed to form a closed second runner; A communication column is arranged on one side, facing the second frame body, of the third cover plate, and the communication column is positioned on the inner side of the second frame body and connected with the second cover plate; The first communication hole and the second communication hole which penetrate along the axial direction are formed in the communication column at intervals, and two ends of the first communication hole and two ends of the second communication hole are respectively communicated with the first runner and the second runner.
10. The electronic device of claim 9, wherein the second heat dissipation structures are provided in plurality and are respectively provided corresponding to a plurality of heat generating devices of the electronic device; The communication columns are arranged between the third cover plate and the second cover plate of each second heat dissipation structure, so that the liquid working medium circularly flows between each second flow passage and the first flow passage.

Description

Liquid cooling module and electronic equipment Technical Field The invention relates to the technical field of heat dissipation, in particular to a liquid cooling module and electronic equipment. Background Along with the trend of increasingly thinning and thinning of terminal products such as smart phones, tablet computers and wearable devices, how to maintain high-performance heat dissipation while maintaining an ultrathin body has become a key problem to be solved in industry. Although the liquid cooling technology is widely applied to the heat dissipation of electronic equipment, in the prior art, the liquid cooling module has the defects that on one hand, a user cannot intuitively see the dynamic visual effect caused by the liquid flowing in the liquid cooling module, on the other hand, the liquid cooling module has single function and only has a heat dissipation function, and if the electromagnetic shielding requirement needs to be met, an independent electromagnetic shielding structural member needs to be additionally arranged, so that the design not only can lead to complex internal structure layout and lower space utilization rate, but also is unfavorable for the ultrathin design of the electronic equipment. Disclosure of Invention The invention mainly aims to provide a liquid cooling module and electronic equipment, which aim to realize the integration of heat dissipation, electromagnetic shielding, visual appreciation and other multifunctional functions, and simultaneously are beneficial to the ultrathin design of the electronic equipment. In order to achieve the above object, the present invention provides a liquid cooling module, which is applied to an electronic device, and includes: the first cover plate is made of transparent material; The first runner plate is arranged on one side of the first cover plate and is provided with a first runner hole penetrating in the thickness direction; The conductivity of the second cover plate is more than or equal to 10 4 S/m, the second cover plate is arranged on one side of the first flow passage plate, which is opposite to the first cover plate, and the first cover plate, the first flow passage plate and the second cover plate are jointly enclosed to form a closed first flow passage, and the first flow passage is configured to contain liquid working medium, and The driving piece is arranged on one side of the first cover plate or the second cover plate, which is opposite to the first runner plate, and the driving piece is configured to drive the liquid working medium in the first runner to flow. In an embodiment, a heat source contact area and a non-heat source contact area are formed on the surface of the second cover plate facing away from the first runner plate, the heat source contact area is configured to be arranged corresponding to a heat generating device of the electronic equipment, and a heat insulating coating is arranged on the non-heat source contact area of the second cover plate. In an embodiment, the second cover plate is provided with a through hole in the heat source contact area, and the first runner hole and the through hole are arranged at intervals; the liquid cooling module further comprises a soaking plate, and the soaking plate is arranged in the through hole and connected with the first flow channel plate. In one embodiment, the inner surface of the first cover plate is further provided with a thermochromic coating, and the thermochromic coating has a color change threshold of 45-60 ℃; And/or the thermochromic coating comprises thermochromic microcapsules, wherein the particle size of the thermochromic microcapsules is 1-3 μm. In one embodiment, the first cover plate is made of a transparent plastic material or a glass material; And/or, the second cover plate is made of a metal material or a composite material, and the composite material comprises a conductive material. The invention also provides electronic equipment comprising the liquid cooling module. In one embodiment, the electronic device includes a rear cover, and the first cover plate is exposed to form the rear cover. In an embodiment, the electronic device further includes a middle frame, the middle frame includes a first frame portion and a second frame portion, the second frame portion is connected to an inner side of the first frame portion, two sides of the first frame portion and two sides of the second frame portion form a step structure, the second cover plate is disposed on one side of the second frame portion, and the driving member is disposed on one side of the second cover plate facing away from the first runner plate and is located on an inner side of the second frame portion; and a circulation cavity is arranged in the first frame body part along the circumferential direction, and is communicated with the first flow passage, so that the liquid working medium circularly flows between the first flow passage and the circulation cavity. In an embodiment, th