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CN-122028382-A - Temperature equalizing plate and electronic equipment

CN122028382ACN 122028382 ACN122028382 ACN 122028382ACN-122028382-A

Abstract

The invention discloses a temperature equalizing plate and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, wherein the temperature equalizing plate comprises a first cover plate, a second cover plate and an intermediate layer arranged between the first cover plate and the second cover plate, the intermediate layer is provided with a plurality of concave areas, each concave area and the first cover plate and/or the second cover plate are enclosed to form a gas channel, the intermediate layer between two adjacent gas channels forms a liquid channel, the temperature equalizing plate is further provided with a first communication channel for communicating a plurality of gas channels, and the liquid channels, the gas channels and the first communication channel are all positioned on the same plane. The temperature equalizing plate can meet the limit space requirement of ultra-thin equipment, simultaneously realize that a plurality of gas channels realize continuous flow through the first communication channel, ensure that the phase change working medium can be circulated in an ultra-thin plane in a high-efficiency and continuous manner, and improve the heat transfer performance of the temperature equalizing plate.

Inventors

  • QIAO LIN
  • YU QUANYAO

Assignees

  • 歌尔科技有限公司

Dates

Publication Date
20260512
Application Date
20260331

Claims (10)

  1. 1. The temperature equalization plate is characterized by comprising a first cover plate, a second cover plate and an intermediate layer arranged between the first cover plate and the second cover plate, wherein the intermediate layer is provided with a plurality of concave areas, each concave area and the first cover plate and/or the second cover plate are enclosed to form a gas channel, and a liquid channel is formed by the intermediate layer between two adjacent gas channels; The temperature equalization plate is further provided with a first communication channel which is communicated with the plurality of gas channels, and the plurality of liquid channels, the plurality of gas channels and the first communication channel are all located on the same plane.
  2. 2. The temperature equalization plate according to claim 1, wherein the recessed area is a groove structure formed by recessing a surface of the intermediate layer facing the first cover plate or the second cover plate; or, the concave area is a through hole structure penetrating through the middle layer.
  3. 3. The temperature uniformity plate according to claim 1, wherein said intermediate layer is further provided with a second communication channel communicating with a plurality of said liquid channels, and a plurality of said liquid channels, a plurality of said gas channels, said first communication channel and said second communication channel are all located on the same plane.
  4. 4. The temperature equalization plate according to claim 3, wherein the intermediate layer comprises an outer frame portion and a plurality of branch portions arranged on the inner side of the outer frame portion, the outer frame portion forms the second communication channel, each branch portion forms the liquid channel, the plurality of branch portions extend along a first direction and are arranged at intervals along a second direction, the first direction is perpendicular to the second direction, and a concave area is formed between two adjacent branch portions; the outer frame part is provided with a first side edge and a second side edge which are spaced along the first direction and are opposite; one end of each of the plurality of branch parts is connected with the first side edge so as to enable the second communication channel to be communicated with the plurality of liquid channels, and the other end of each of the plurality of branch parts is spaced from the second side edge to form the first communication channel in a matching way; Or, the plurality of branch portions include with a plurality of first branch portions that first side is connected and with a plurality of second branch portions that the second side is connected, first branch portion with the second branch portion is followed the second direction is arranged in turn, every first branch portion keep away from the one end of first side with the second side interval is in order to form one first communication channel, every second branch portion keep away from the one end of second side with first side interval is in order to form one first communication channel.
  5. 5. The temperature uniformity plate according to claim 3, wherein said intermediate layer comprises a connecting portion and a plurality of branch portions, said connecting portion forming said second communication channel, each of said branch portions forming one of said liquid channels, one end of each of said plurality of branch portions being connected to said connecting portion so that said second communication channel communicates with said plurality of liquid channels, and said recessed area being formed between two adjacent branch portions; And one ends of the branch parts, which are far away from the connecting parts, are spaced from the peripheries of the first cover plate and the second cover plate, so that the first cover plate, the second cover plate and the middle layer are enclosed to form the first communication channel.
  6. 6. The isopipe of claim 5 wherein the isopipe has a square shape, the first and second cover plates having two long sides extending in a first direction and two short sides extending in a second direction, the first direction being perpendicular to the second direction; The connecting part is positioned at one end of the middle layer, the plurality of branch parts extend along the first direction and are distributed at intervals along the second direction, and the outer periphery of the middle layer is spaced from the two long sides and the two short sides, so that the first cover plate, the second cover plate and the middle layer are enclosed to form the first communication channel; Or, the connecting portion is located the middle part of intermediate level, a plurality of branch portion's one end connect in the periphery of connecting portion, and a plurality of branch portion's the other end is all along first direction is extended to follow the second direction interval arrangement, a plurality of branch portion keep away from connecting portion's one end all with two long limit and two the equal interval of minor face, so that first apron with the second apron with the intermediate level encloses and closes and form first intercommunication passageway.
  7. 7. The temperature uniformity plate according to claim 4 or 5, wherein the cross-sectional shape of the branching portion along the direction of the uniform Wen Banhou degrees is a circle, an ellipse, a polygon or a special shape.
  8. 8. The temperature equalization plate according to any one of claims 1-6, wherein the first cover plate comprises a first plate body and a first surrounding wall surrounding the edge of the first plate body, the second cover plate comprises a second plate body and a second surrounding wall surrounding the edge of the second plate body, the first surrounding wall is connected with the second surrounding wall, and the middle layer is sandwiched between the first plate body and the second plate body; The first surrounding wall and the second surrounding wall are connected through any one of laser welding, brazing, diffusion welding, resistance welding, tight fit or gluing; And/or the middle layer is connected with the first plate body and the second plate body through gluing or resistance welding; And/or the surface of the first plate body and/or the surface of the second plate body facing the middle layer is provided with a hydrophilic layer or a capillary structure.
  9. 9. The temperature equalization plate of any one of claims 1 to 6, wherein said intermediate layer is a capillary structure formed by electrochemical deposition, metal powder sintering, screen printing, wire mesh, copper wire braiding processes; and/or the first cover plate and the second cover plate are made of the same material or different materials, the material of the first cover plate and/or the second cover plate is at least one of a metal layer and a high polymer material layer, and the high polymer material layer is at least one of polyethylene terephthalate, polyethylene naphthalate, polypropylene, cycloolefin copolymer, polytetramethylpentene, polyimide, polymethyl methacrylate, polyphenylene sulfide, polyether ether ketone, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer and butadiene-styrene copolymer; And/or the thickness of the intermediate layer is 0.08-0.4 mm; And/or the thickness of the first cover plate is 0.02 mm-0.05 mm; and/or the thickness of the second cover plate is 0.02 mm-0.05 mm.
  10. 10. An electronic device comprising the temperature equalizing plate according to any one of claims 1 to 9.

Description

Temperature equalizing plate and electronic equipment Technical Field The invention relates to the technical field of electronic equipment heat dissipation, in particular to a temperature equalizing plate and electronic equipment using the same. Background With the development of electronic devices such as smart phones, tablet computers, and ultra-thin notebook computers toward high performance, high integration, and light and thin, the heat flux density of internal chips (such as CPU and GPU) is rapidly increased, and the heat dissipation problem has become a key bottleneck for restricting the performance and reliability of the devices. Vapor Chamber (VC) is widely used in heat dissipation systems of the above devices as a high-efficiency two-phase heat transfer device due to its excellent isothermal and heat diffusion capabilities. In the related art, the soaking plate mostly adopts a stacking structure of 'gas-liquid different surfaces', namely a vapor cavity and a liquid cavity in the soaking plate are stacked along the thickness direction of the soaking plate and are positioned on different planes. The thickness of this structure can be about 0.3mm. However, when the thickness of the vapor chamber is further compressed to 0.3mm or less, the respective thicknesses of the vapor chamber and the liquid chamber are extremely reduced, resulting in a significant reduction in the sectional areas of the vapor flow path and the liquid return path, so that the flow resistance increases sharply. The phase change circulation efficiency of the working medium can be seriously deteriorated, so that the heat transfer performance (such as heat conductivity and maximum heat transfer power) of the vapor chamber is greatly reduced, and the heat dissipation requirement of the high-heat-flow chip cannot be met. Therefore, it is necessary to provide a novel temperature equalizing plate to solve the above problems. Disclosure of Invention The invention aims to provide a temperature equalizing plate and electronic equipment, which aim to solve the problem that the thickness of the temperature equalizing plate cannot be reduced in the prior art under the condition that the thermal performance of the temperature equalizing plate is not reduced, the temperature equalizing plate not only can keep excellent heat transfer performance, the limit space requirement of ultra-thin equipment can be met, a plurality of gas channels can flow continuously through the first communication channel, efficient and continuous circulation of the phase change working medium in an ultra-thin plane is ensured, and the heat transfer performance of the temperature equalization plate is improved. In order to achieve the above-mentioned objective, the present invention provides a temperature equalization plate, which includes a first cover plate, a second cover plate, and an intermediate layer disposed between the first cover plate and the second cover plate, wherein the intermediate layer is provided with a plurality of recessed areas, each recessed area and the first cover plate and/or the second cover plate enclose a gas channel, and the intermediate layer between two adjacent gas channels forms a liquid channel; The temperature equalization plate is further provided with a first communication channel which is communicated with the plurality of gas channels, and the plurality of liquid channels, the plurality of gas channels and the first communication channel are all located on the same plane. In an embodiment, the concave area is a groove structure formed by concave surface of the middle layer facing the first cover plate or the second cover plate; or, the concave area is a through hole structure penetrating through the middle layer. In an embodiment, the middle layer is further provided with a second communication channel for communicating a plurality of liquid channels, and the liquid channels, the gas channels, the first communication channel and the second communication channel are all located on the same plane. In an embodiment, the middle layer includes an outer frame portion and a plurality of branch portions disposed inside the outer frame portion, the outer frame portion forms the second communication channel, each branch portion forms the liquid channel, the plurality of branch portions extend along a first direction and are arranged at intervals along a second direction, the first direction is perpendicular to the second direction, and a concave area is formed between two adjacent branch portions; the outer frame part is provided with a first side edge and a second side edge which are spaced along the first direction and are opposite; one end of each of the plurality of branch parts is connected with the first side edge so as to enable the second communication channel to be communicated with the plurality of liquid channels, and the other end of each of the plurality of branch parts is spaced from the second side edge to form the first comm