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CN-122028393-A - Sensor and method for manufacturing same sensor packaging method

CN122028393ACN 122028393 ACN122028393 ACN 122028393ACN-122028393-A

Abstract

The application relates to the technical field of sensors, in particular to a sensor and a packaging method of the sensor, wherein a power supply layer is arranged in a circuit board, a first clamping groove is formed in the left side of the circuit board, a second clamping groove is formed in the right side of the circuit board, and at least one of the first clamping groove and the second clamping groove exposes the power supply layer; the chip is connected to the upper end of the circuit board, the shielding cover comprises a body part, a first clamping arm and a second clamping arm, at least part of the body part and the circuit board are arranged at intervals vertically and oppositely, the chip is arranged between the body part and the circuit board, the first clamping arm is connected to the left side of the body part, the second clamping arm is connected to the right side of the body part, the first clamping arm is provided with a first clamping protrusion, at least part of the first clamping protrusion is clamped in a first clamping groove, the second clamping arm is provided with a second clamping protrusion, at least part of the second clamping protrusion is clamped in a second clamping groove, and at least one of the first clamping protrusion and the second clamping protrusion is in conductive contact with the power supply layer, so that the sensor is beneficial to miniaturization.

Inventors

  • CHEN SHANHENG

Assignees

  • 讯芯电子科技（中山）有限公司

Dates

Publication Date
20260512
Application Date
20251215

Claims (10)

  1. 1. A sensor, characterized in that it comprises a circuit board (1), a chip (2) and a shield (3); A power supply layer (1013) is arranged in the circuit board (1), a first clamping groove (11) is formed in the left side of the circuit board (1), a second clamping groove (12) is formed in the right side of the circuit board (1), and at least one of the first clamping groove (11) and the second clamping groove (12) exposes the power supply layer (1013); the chip (2) is connected to the circuit board (1) at the upper end of the circuit board (1); The shielding cover (3) comprises a body part (31), a first clamping arm (32) and a second clamping arm (33), at least part of the body part (31) and the circuit board (1) are arranged at intervals in an up-down mode, the chip (2) is arranged between the body part (31) and the circuit board (1), the first clamping arm (32) is connected to the left side of the body part (31), the second clamping arm (33) is connected to the right side of the body part (31), the first clamping arm (32) is provided with a first clamping protrusion (321), at least part of the first clamping protrusion (321) is clamped in the first clamping groove (11), at least part of the second clamping arm (33) is clamped in the second clamping groove (12), and at least one of the first clamping protrusion (321) and the second clamping protrusion (331) is in conductive contact with the power supply layer (1013).
  2. 2. The sensor according to claim 1, characterized in that the front side of the circuit board (1) is provided with a third clamping groove (13), and the rear side of the circuit board (1) is provided with a fourth clamping groove (14); The shielding cover (3) further comprises a third clamping arm (34) and a fourth clamping arm (35), the third clamping arm (34) is connected to the front side of the body portion (31), the fourth clamping arm (35) is connected to the rear side of the body portion (31), the third clamping arm (34) is provided with a third clamping protrusion, at least part of the third clamping protrusion is clamped in the third clamping groove (13), the fourth clamping arm (35) is provided with a fourth clamping protrusion, and at least part of the fourth clamping protrusion is clamped in the fourth clamping groove (14).
  3. 3. The sensor according to claim 2, wherein the body portion (31) comprises a top plate (311) and a side wall plate (312), the top plate (311) and the circuit board (1) are arranged at intervals in an up-down opposite mode, the upper end of the side wall plate (312) is connected to the top plate (311), the lower end of the side wall plate (312) is abutted to the circuit board (1), the top plate (311), the side wall plate (312) and the circuit board (1) enclose a containing cavity, and the chip (2) is arranged in the containing cavity; The first clamping arm (32), the second clamping arm (33), the third clamping arm (34) and the fourth clamping arm (35) are all connected to the side coaming (312).
  4. 4. The sensor according to claim 3, wherein the first card protrusion (321) includes a first contact surface (3211), a first guide surface (3212), and a second guide surface (3213), the first contact surface (3211) is planar, the first contact surface (3211) abuts the power supply layer (1013), the first guide surface (3212) is disposed obliquely upward and downward, a lower end of the first guide surface (3212) extends to the first card arm (32), an upper end of the first guide surface (3212) extends rightward and upward to the first contact surface (3211), the second guide surface (3213) is disposed obliquely upward and downward, an upper end of the second guide surface (3213) extends to the first card arm (32), and a lower end of the first guide surface (3212) extends rightward and downward to the first contact surface (3211); The second clamping protrusion (331) comprises a second contact surface (3311), a third guide surface (3312) and a fourth guide surface (3313), the second contact surface (3311) is a plane, the second contact surface (3311) is abutted against the power supply layer (1013), the third guide surface (3312) is arranged in an up-down inclined mode, the lower end of the third guide surface (3312) extends to the second clamping arm (33), the upper end of the third guide surface (3312) extends to the second contact surface (3311) leftwards and upwards, the fourth guide surface (3313) is arranged in an up-down inclined mode, the upper end of the fourth guide surface (3313) extends to the second clamping arm (33), and the lower end of the fourth guide surface (3313) extends to the first contact surface (3211) leftwards and downwards.
  5. 5. A method of packaging a sensor according to any one of claims 1 to 4, comprising the steps of: Step S1, preparing a mother board (100), wherein the mother board (100) comprises a substrate layer (101) and at least one first conductive layer (102), and the first conductive layer (102) is attached to the upper end and/or the lower end of the substrate layer (101); S2, processing at least one row of first hole bodies (103) on the motherboard (100), wherein one row of first hole bodies (103) comprises a plurality of first hole bodies (103) distributed at left and right intervals, the motherboard (100) between two adjacent left and right first hole bodies (103) forms a base unit (500), the base layer (101) is provided with a first side surface (1011) and a second side surface (1012) which enclose the first hole bodies (103), and the first side surface (1011) and the second side surface (1012) are arranged at left and right opposite intervals; Step S3, copper plating the motherboard (100), and forming a power supply layer (1013) on the first side (1011) and the second side (1012), wherein the power supply layer (1013) is connected with the first conductive layer (102); A step S4 of attaching a first supporting layer (200) to the upper end of the motherboard (100) and attaching a second supporting layer (300) to the lower end of the motherboard (100), wherein the first supporting layer (200) is provided with a plurality of second hole bodies (201), the second hole bodies (201) are arranged in advance or are arranged after the first supporting layer (200) is attached to the motherboard (100), the second hole bodies (201) are vertically opposite to the first hole bodies (103), the second hole bodies (201) are communicated with the first hole bodies (103), the left side walls of the second hole bodies (201), the first side surfaces (1011) and the second supporting layer (300) are enclosed into a second clamping groove (12), and the right side walls of the second hole bodies (201), the second side surfaces (1012) and the second supporting layer (300) are enclosed into a first clamping groove (11); Step S5, connecting a chip (2) on each base unit (500); S6, firstly, shielding covers (3) are covered on the outer sides of the chips (2), the first clamping convex parts (321) are clamped into the first clamping grooves (11) through the second hole bodies (201), the second clamping convex parts (331) are clamped into the second clamping grooves (12) through the second hole bodies (201), then, each base unit (500) is divided, or firstly, each base unit (500) is divided, then, shielding covers (3) are covered on the outer sides of the chips (2), and the first clamping convex parts (321) are clamped into the first clamping grooves (11), and the second clamping convex parts (331) are clamped into the second clamping grooves (12).
  6. 6. The method of packaging a sensor according to claim 5, wherein the first conductive layer (102) is provided at both the upper and lower ends of the base layer (101), the first support layer (200) includes a first insulating layer (203) provided at the upper end of the motherboard (100) and a second conductive layer (204) provided at the upper end of the first insulating layer (203), and the second support layer (300) includes a second insulating layer (303) provided at the lower end of the motherboard (100) and a third conductive layer (304) provided at the lower end of the second insulating layer (303); The step S4 comprises the steps of forming a second communication hole (202) which penetrates through the second conductive layer (204) and the first insulating layer (203) vertically, enabling the lower end of the second communication hole (202) to extend to the first conductive layer (102) located at the upper end of the substrate layer (101), forming a third communication hole (302) on the third conductive layer (304) and the second insulating layer (303), enabling the upper end of the third communication hole (302) to extend to the first conductive layer (102) at the lower end of the substrate layer (101), and plating copper on the hole walls of the second communication hole (202) and the hole walls of the third communication hole (302).
  7. 7. The method according to claim 5, wherein in the step S6, the first engaging protrusion (321) engages with the first engaging groove (11), and the lower end of the side wall plate (312) abuts against the upper end of the upper support layer.
  8. 8. The method for packaging a sensor according to claim 5, wherein the second supporting layer (300) has a plurality of third holes (301), the second holes (201) are disposed opposite to the third holes (301), the first clamping protrusions (321) are clamped into the first clamping grooves (11) while the lower ends of the first clamping arms (32) penetrate into the third holes (301), and the second clamping protrusions (331) are clamped into the second clamping grooves (12) while the lower ends of the second clamping arms (33) penetrate into the third holes (301).
  9. 9. The method of packaging a sensor according to claim 5, wherein in the step S2, a plurality of rows of first holes (103) are formed in the motherboard (100), each row of first holes (103) being arranged in a front-back interval, the step S2 further comprises forming a plurality of fourth holes (206) in the motherboard (100), the fourth holes (206) being disposed between two adjacent base units (500) in front-back direction, the base layer (101) having a third side and a fourth side surrounding the fourth holes (206), the third side and the fourth side being arranged in front-back opposition; In the step S4, the first supporting layer (200) has a plurality of fifth hole bodies, the fifth hole bodies are vertically opposite to the fourth hole body (206), the fifth hole bodies are communicated with the fourth hole body (206), a third clamping groove (13) is defined by a front side wall of the fifth hole body, the third side surface and the second supporting layer (300), and a fourth clamping groove (14) is defined by a rear side wall of the fifth hole body, the fourth side surface and the second supporting layer (300); the step S6 comprises the steps of clamping the third clamping convex part into the third clamping groove (13), and inserting the fourth clamping convex part into the fourth clamping groove (14).
  10. 10. The method according to claim 9, wherein the second supporting layer (300) has a plurality of sixth holes, the fifth holes are disposed opposite to the sixth holes, the third clamping arm (34) penetrates the sixth holes while the third clamping protrusion is clamped into the third clamping groove (13), and the fourth clamping arm (35) penetrates the sixth holes while the fourth clamping protrusion is clamped into the fourth clamping groove (14) in step S6.

Description

Sensor and method for manufacturing same sensor packaging method Technical Field The application relates to the technical field of sensors, in particular to a sensor and a packaging method of the sensor. Background The detection sensor has weak signals, high working frequency and sensitivity to electromagnetic interference or is in a strong interference environment, and a shielding cover is required to be arranged in the packaging process to be lower than external electromagnetic interference and/or prevent self electromagnetic radiation from leaking. The Chinese patent with the bulletin number of CN219660296U discloses an EMC shielding cover and a circuit board mounting structure, wherein a flange structure is arranged at the lower end of the shielding cover and riveted on the circuit board, the flange structure occupies the space of the circuit board, the packaging requirement of a small sensor cannot be met, the shielding cover cannot be removed from the circuit board after being mounted, and the chip in the shielding cover cannot be maintained subsequently. The invention patent of China with the application publication number of CN108633240A discloses a shielding cover and an electronic device, wherein the shielding cover comprises a frame body and a cover body, the frame body is fixed on a circuit board in a welding mode, and a welding node simultaneously realizes the electric connection between the frame body and the circuit board, so that the circuit board can supply power to the frame body, the cover body is clamped on the frame body, and when a chip needs to be maintained, the cover body can be detached from the frame body. However, the frame body needs to be welded on the circuit board, the solder at the welding point is easy to overflow, if the chip in the shielding frame is connected on the circuit board by a lead bonding mode, the lead needs to be ensured to be far away from the welding point, so the distance between the chip in the shielding cover and the side wall of the shielding cover needs to be far away, and the overflow of the solder to the lead is avoided. Disclosure of Invention The application aims to solve the technical problems that the existing sensor is large in occupied space due to the arrangement mode of a shielding cover, and the packaging requirement of a small sensor cannot be met. In order to solve the technical problems, the application provides a sensor, which comprises a circuit board, a chip and a shielding cover; A power supply layer is arranged in the circuit board, a first clamping groove is formed in the left side of the circuit board, a second clamping groove is formed in the right side of the circuit board, and at least one of the first clamping groove and the second clamping groove exposes the power supply layer; The chip is connected to the upper end of the circuit board; The shielding cover comprises a body part, a first clamping arm and a second clamping arm, at least part of the body part and the circuit board are arranged at intervals up and down, the chip is arranged between the body part and the circuit board, the first clamping arm is connected to the left side of the body part, the second clamping arm is connected to the right side of the body part, the first clamping arm is provided with a first clamping protrusion, at least part of the first clamping protrusion is clamped in the first clamping groove, the second clamping arm is provided with a second clamping protrusion, at least part of the second clamping protrusion is clamped in the second clamping groove, and at least one of the first clamping protrusion and the second clamping protrusion is in conductive contact with the power supply layer. In some embodiments, the front side of the circuit board is provided with a third clamping groove, and the rear side of the circuit board is provided with a fourth clamping groove; The shielding cover further comprises a third clamping arm and a fourth clamping arm, wherein the third clamping arm is connected to the front side of the body part, the fourth clamping arm is connected to the rear side of the body part, the third clamping arm is provided with a third clamping protrusion, at least part of the third clamping protrusion is clamped in the third clamping groove, the fourth clamping arm is provided with a fourth clamping protrusion, and at least part of the fourth clamping protrusion is clamped in the fourth clamping groove. In some embodiments, the body part comprises a top plate and a side wall plate, the top plate and the circuit board are arranged at intervals in an up-down opposite mode, the upper end of the side wall plate is connected to the top plate, the lower end of the side wall plate is abutted against the circuit board, the top plate, the side wall plate and the circuit board enclose a containing cavity, and the chip is arranged in the containing cavity; the first clamping arm, the second clamping arm, the third clamping arm and the fourth cl