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CN-122028406-A - Swing arm type die bonder and swing arm position determining method

CN122028406ACN 122028406 ACN122028406 ACN 122028406ACN-122028406-A

Abstract

The invention belongs to the technical field of die bonding, and particularly discloses a swing arm die bonder and a swing arm position determining method, comprising four swing arm assemblies, wherein each swing arm assembly comprises a swing arm, a spindle motor for driving the swing arm to rotate and a telescopic unit connected with an output shaft of the spindle motor, and a die taking suction nozzle is connected to the output shaft of the telescopic unit; the device comprises a frame, four swing arm assemblies, a plurality of fixing units and a plurality of fixing units, wherein the four swing arm assemblies are arranged on the frame and are arranged in a rectangular array, and mirror image swing arm movements of the four swing arm assemblies form dynamic balance in the die bonding process. The invention can restrain the vibration of the machine and improve the die bonding precision of the die bonder.

Inventors

  • LIANG RUI
  • SU GUOQIANG
  • DING JINYU

Assignees

  • 成都鸿睿光电科技有限公司

Dates

Publication Date
20260512
Application Date
20260413

Claims (10)

  1. 1. The utility model provides a swing arm formula die bonder which characterized in that includes: Each swing arm assembly comprises a swing arm, a spindle motor for driving the swing arm to rotate and a telescopic unit connected with an output shaft of the spindle motor, and a crystal taking suction nozzle is connected to the output shaft of the telescopic unit; The device comprises a frame, four swing arm assemblies, a plurality of fixing units and a plurality of fixing units, wherein the four swing arm assemblies are arranged on the frame and are arranged in a rectangular array, and mirror image swing arm movements of the four swing arm assemblies form dynamic balance in the die bonding process.
  2. 2. The swing arm type die bonder according to claim 1, further comprising a control system for synchronously controlling the four swing arm assemblies to perform mirror image swing arm movements, wherein the control system is electrically connected with the spindle motor and the telescopic unit and is used for driving the spindle motor and the telescopic unit to move.
  3. 3. The swing arm type die bonder according to claim 1, wherein the frame comprises a machine table, a supporting frame and a tool table, the machine table is located above the tool table, the supporting frame is supported at the bottom of the machine table, four swing arm assemblies are all installed on the machine table, a wafer carrying table is installed on a die picking station of the tool table, and a substrate carrying table is installed on a die bonding station of the tool table.
  4. 4. A swing arm type die bonder according to claim 3, wherein four swing arm assemblies are arranged in pairs, a die bonding station is corresponding between each pair of the swing arm assemblies, two sides of each pair of the swing arm assemblies respectively correspond to a die picking station, two swing arm assemblies located on a diagonal line are identical in the movement direction of the swing arm, and two adjacent swing arm assemblies are opposite in the movement direction of the swing arm.
  5. 5. A swing arm type die bonder according to claim 3, wherein the tool table is provided with a Y-axis linear motor and an X-axis linear motor for driving the wafer stage and the substrate stage to move linearly along the Y-axis and linearly along the X-axis.
  6. 6. The swing arm type die bonder according to claim 4, wherein an adjusting mechanism is provided on the frame, four swing arm assemblies are provided in pairs, and the adjusting mechanism is used for driving each pair of swing arm assemblies to slide horizontally along the frame in opposite directions or back to adjust the distance between each pair of swing arm assemblies.
  7. 7. The swing arm type die bonder according to claim 6, wherein the adjusting mechanism comprises two groups of double-threaded screw rods, four groups of sliding blocks and a driving unit for driving the two groups of double-threaded screw rods to synchronously rotate, a sliding groove is formed in the frame, the double-threaded screw rods are rotatably installed in the sliding groove, the four groups of sliding blocks are respectively connected with spindle motors in the four swing arm assemblies, the sliding blocks are in sliding fit with the sliding grooves, and the two groups of double-threaded screw rods are respectively in threaded fit with the sliding blocks on the spindle motors in each pair of swing arm assemblies.
  8. 8. The swing arm type die bonder according to claim 7, wherein the driving unit comprises a rack, two gears and a pushing member, the two gears are fixedly connected with one ends of the two groups of double-threaded screw rods respectively, a guide groove is horizontally formed in the rack, one side of the rack is connected with a guide block, the guide block is in sliding fit with the guide groove, the rack is meshed with the two gears, and the pushing member is used for driving the rack to slide.
  9. 9. A method for determining a position of a swing arm die bonder, for determining a target distance between each pair of swing arm assemblies in the swing arm die bonder according to any one of claims 1 to 8, comprising: S1, determining an influence factor mainly influencing the position configuration of a swing arm assembly and acquiring the influence factor, wherein the influence factor comprises the actual distance of the swing arm assembly, the target distance of the swing arm assembly, the pixel distance, the mirror symmetry error, the distance matching error and the alignment precision error; S2, establishing a swing arm position optimization configuration model, encoding the actual distance of the swing arm assemblies, the target distance of the swing arm assemblies, the pixel distance, the mirror symmetry error, the distance matching error and the alignment precision error, and solving the target distance between each pair of swing arm assemblies based on a genetic algorithm; and S3, controlling the adjusting mechanism to drive the swing arm assemblies to move to the target positions according to the obtained target distance between each pair of the swing arm assemblies.
  10. 10. The method for determining the position of the swing arm die bonder according to claim 9, wherein the specific step of S2 is: S2.1, setting the iteration times of a genetic algorithm and the number of individuals to be solved in each generation of population; S2.2, establishing a swing arm position optimization configuration model, wherein the swing arm position optimization configuration model comprises an objective function and total constraint conditions; s2.3, coding the actual distance of the swing arm assembly, the target distance of the swing arm assembly, the pixel distance, the mirror symmetry error and the alignment accuracy error to obtain a coding value of an individual to be solved, randomly generating an initial population formed by a plurality of individuals to be solved based on a total constraint condition, enabling the initial population to be a parent population, enabling the individuals to be solved in the parent population to be parent individuals, wherein the coding value of each parent individual comprises coding the actual distance of the swing arm assembly, the target distance of the swing arm assembly, the pixel distance, the mirror symmetry error and the alignment accuracy error; s2.4, substituting the coding values of the individuals of the parent population into a simulation system to perform position simulation to obtain actual position parameters of the swing arm assembly, wherein the actual position parameters are simulation results of the position simulation; S2.5, calculating an objective function value of each individual in the parent population according to each simulation result, and then calculating and sequencing an fitness value of each individual in the parent population according to a fitness function; S2.6, saving parent individuals with the maximum fitness value of the previous M parent individuals in the parent population, selecting parent individuals from all parent individuals except the parent individuals with the maximum fitness value of the previous M parent individuals through roulette, performing cross mutation operation to obtain child individuals, calculating fitness values of the child individuals after cross mutation, sequencing, reinserting the child individuals into the parent population according to the fitness values, selecting a set number of individuals to be solved to form a new parent population, and returning to S2.4; S2.7, repeating the steps S2.4-S2.6 until the iteration times or the objective function value is within a specified threshold range, wherein the final obtained parent population is a feasible solution set, and the parent individuals in the parent population are feasible individuals.

Description

Swing arm type die bonder and swing arm position determining method Technical Field The invention relates to the technical field of die bonding, in particular to a swing arm die bonder and a swing arm position determining method. Background The swing arm type die bonder is mainly applied to a chip mounting link in a semiconductor packaging test stage, a chip is grabbed from a cut wafer through a swing arm and is arranged at a position corresponding to a PCB, and the chip and the PCB are welded by soldering tin. The die bonding head mechanism is used as a core mechanism for the operation of the die bonder, has the main functions of driving the swing arm to rotate 180 degrees back and forth and to shift vertically so as to accurately absorb chips and fixed chips, and is key equipment of semiconductor packaging die bonding links such as Mini-LED, microLED, IC chips, discrete devices and the like. The novel high-precision die bonder is a key for ensuring the die bonding yield and speed and effectively controlling the cost, and the Mini-LED die bonding is a key link of the packaging process, and the main difficulty is high-speed and high-precision die bonding. Currently, a MiniLED direct display product in the industry mostly adopts a swing arm type die bonder to bond dies, and a swing arm assembly is usually directly fixed on a servo motor to form an L shape, and rotates 180 degrees to perform picking and placing actions. Because the die-bonding swing arm is a rigid mechanism similar to a cantilever beam, residual vibration can be generated due to inertia during rapid movement, so that the machine table vibrates, and defects such as precision deviation and the like are generated. The motor is particularly important as a core component of the die bonder, and directly influences the die bonder yield and speed. At present, a voice coil motor and a direct current motor which are used by most of the die bonders in China directly drive a swing arm and a suction nozzle to operate, and the problems of insufficient force control precision, large inertia and the like generally exist, so that the performance and the service life of the die bonders are affected. If a thick marble machine is used to improve the vibration problem, the cost is too high, and the vibration problem is not solved effectively. The equipment precision is reduced to cause the LED to generate offset, the electrode welding yield is reduced, the current is weakened to cause the LED to be weakly lightened or vanishing, and the factor is huge after the welding is finished to cause the loss because of being unable to be repaired in a targeted way. Disclosure of Invention The invention provides a swing arm type die bonder, which aims to inhibit the vibration of a machine and improve the die bonding precision of the die bonder. The invention is realized by the following technical scheme that the swing arm type die bonder comprises: Each swing arm assembly comprises a swing arm, a spindle motor for driving the swing arm to rotate and a telescopic unit connected with an output shaft of the spindle motor, and a crystal taking suction nozzle is connected to the output shaft of the telescopic unit; The device comprises a frame, four swing arm assemblies, a plurality of fixing units and a plurality of fixing units, wherein the four swing arm assemblies are arranged on the frame and are arranged in a rectangular array, and mirror image swing arm movements of the four swing arm assemblies form dynamic balance in the die bonding process. Compared with the prior art, the scheme has the following advantages and beneficial effects: In the scheme, four swing arm assemblies are arranged in a rectangular array and do mirror image swing arm movement, so that inertia forces generated by each swing arm in the high-speed reciprocating movement process are mutually offset, and the dynamic balance of the equipment main body is realized. The two swing arms on the diagonal line have the same movement direction, the movement directions of the two adjacent swing arms are opposite to each other, a symmetrical stress structure is formed, when the swing arms move inwards, the generated inertial force is opposite in direction and equal in size, the inertial force is offset on the frame, the resultant force born by the frame is approximately zero, and the vibration of the machine in the die bonding process is obviously restrained. In this scheme, through suppressing the frame vibration, reduce the precision skew because of vibration leads to, ensure the positioning accuracy of solid brilliant first mechanism, get the alignment precision promotion of brilliant suction nozzle and crystal grain like this, get brilliant success rate improvement, and the swing arm rotatory 180 back, get the counterpoint precision promotion of bonding pad on brilliant suction nozzle and the PCB board, solid brilliant position deviation reduces to the solid brilliant precision of solid brilliant machine has ef