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CN-122028570-A - LED packaging device

CN122028570ACN 122028570 ACN122028570 ACN 122028570ACN-122028570-A

Abstract

The invention relates to the technical field of semiconductor light emitting, and discloses an LED packaging device which comprises a bracket, an LED light emitting chip, a light-transmitting adhesive layer, a high-reflection adhesive layer and a lens. The LED light-emitting chip is arranged on the bracket and internally provided with a plurality of light scattering particles. The light-transmitting adhesive layer at least covers part of the upper surface of the LED light-emitting chip. The upper surface of the light-transmitting glue layer is diamond-shaped. The high-reflection adhesive layer is arranged on the support and at least covers the side face of the light-transmitting adhesive layer. A lens and a light-transmitting adhesive layer a cavity structure is arranged between the high-reflection adhesive layers. The lens includes a first optical interface and a second optical interface. The first optical interface is set to be a plane or a micro cambered surface, and the second optical interface is set to be a convex cambered surface. The light scattering particles are arranged in the light-transmitting glue layer, and the upper surface of the light-transmitting glue layer is diamond-shaped, so that a diamond-shaped light field with uniform light is realized. Through the setting of lens face formula, make the accurate light angle and the illumination intensity of presetting of realization, satisfy the needs of application scene. The LED packaging device also has the advantages of good spot edge cut-off, small volume and the like.

Inventors

  • YANG DAOQUN
  • HUANG WEI
  • CAO YUXING
  • LI XIANGYANG

Assignees

  • 深圳循光科技有限公司

Dates

Publication Date
20260512
Application Date
20241101

Claims (10)

  1. 1. An LED package device, comprising: A bracket (1); an LED light-emitting chip (2) which is arranged on the bracket (1); the LED light-emitting device comprises a light-transmitting adhesive layer (3), wherein a plurality of light scattering particles (31) are arranged in the light-transmitting adhesive layer (3), the light-transmitting adhesive layer (3) at least covers part of the upper surface of the LED light-emitting chip (2), and the upper surface of the light-transmitting adhesive layer (3) is diamond-shaped; the high-reflection adhesive layer (4) is arranged on the bracket (1), and the high-reflection adhesive layer (4) at least covers the side face of the light-transmitting adhesive layer (3); the lens (5) is arranged on the bracket (1), and a cavity structure (6) is arranged between the lens (5) and the light-transmitting adhesive layer (3) and between the lens and the high-reflection adhesive layer (4); The lens (5) comprises a first optical interface (51) close to the cavity structure (6) and a second optical interface (52) deviating from the first optical interface (51), wherein the first optical interface (51) is set to be a plane or a micro cambered surface, and the second optical interface (52) is set to be a convex cambered surface.
  2. 2. The LED package device according to claim 1, wherein on the lens (5), curvatures of an X-axis second cut line (521), a 45 ° axis second cut line (522), a Y-axis second cut line (523) are sequentially increased; The X axis is parallel to a first diagonal line of the diamond, the 45-degree axis is parallel to an axis forming an included angle of 45 degrees with the first diagonal line of the diamond, the Y axis is parallel to a second diagonal line of the diamond, and the lengths of the first diagonal line and the second diagonal line are L1 and L2 respectively, so that the condition that L1 is more than or equal to L2 is satisfied; the X-axis second section line (521) is a contour line of the intersection of the central ray of the LED light-emitting chip (2) and the plane of the X-axis with the second optical interface (52); The second section line (522) of the 45-degree axis is a contour line of the central ray of the LED light-emitting chip (2) and the intersection of the plane of the 45-degree axis and the second optical interface (52); The Y-axis second cut line (523) is a contour line of the central ray of the LED light-emitting chip (2) and the intersection of the plane of the Y-axis and the second optical interface (52).
  3. 3. The LED package device according to claim 2, wherein the opening diameters of the bottoms of the Y-axis second cut line (523), the X-axis second cut line (521), and the 45 ° axis second cut line (522) increase in order.
  4. 4. The LED package device according to claim 2 or 3, wherein the X-axis second cut line (521), the 45 ° axis second cut line (522), and the Y-axis second cut line (523) are binary N-th-order curves, and N is an integer of 2 or more.
  5. 5. The LED package device according to claim 4, wherein the binary N-th power curve is a binary 3-th power curve, the heights and lengths of the binary 3-th power curves of the X-axis second cut line (521) are H1 and W1, respectively, satisfying 0.1≤h2/w2≤1, and the heights and lengths of the binary 3-th power curves of the y-axis second cut line (523) are H2 and W2, respectively, satisfying 0.1≤h2/w2≤1.
  6. 6. The LED package device according to claim 5, wherein a ratio of a length of the first diagonal to a length of the binary 3-fold curve of the X-axis second cut line (521) satisfies 0.1L 1/W1 0.5, and a ratio of a length of the second diagonal to a length of the binary 3-fold curve of the Y-axis second cut line (523) satisfies 0.1L 2/W2 0.5.
  7. 7. The LED package device according to claim 2, wherein on the lens (5), curvatures of the X-axis first cut line (511), the 45 ° axis first cut line (512), the Y-axis first cut line (513) are uniform; The first X-axis sectioning line (511) is a contour line of the central ray of the LED light-emitting chip (2) and the intersection of the plane of the X-axis and the first optical interface (51); the first section line (512) of the 45-degree axis is a contour line of the intersection of the first optical interface (51) and the plane where the central ray of the LED light-emitting chip (2) and the 45-degree axis are located; the Y-axis first section line (513) is a contour line of the central ray of the LED light-emitting chip (2) and the intersection of the plane of the Y-axis and the first optical interface (51).
  8. 8. The LED package device according to claim 7, wherein the opening diameters of the bottoms of the Y-axis first cut line (513), the X-axis first cut line (511), and the 45 ° axis first cut line (512) increase in order.
  9. 9. The LED package device according to claim 2 or 3, wherein the X-axis first cut line (511), the 45 ° axis first cut line (512), and the Y-axis first cut line (513) are binary M-th power curves or normal function straight lines, and M is an integer of 2 or more.
  10. 10. The LED package device of claim 9, wherein the binary M-th power curve is a binary 2-th power curve, and the ratio F/D of the height to the length of the binary 2-th power curve is 0 to 0.3.

Description

LED packaging device Technical Field The invention belongs to the technical field of semiconductor light emitting, and particularly relates to an LED device. Background The LED light-emitting chips in the current market are basically in a distance shape, and are generally rectangular, round or oval light spots after light distribution. Some application scenes need diamond light fields, the prior art adopts diamond LED light-emitting chips to realize through secondary light distribution, but the special-shaped LED light-emitting chips are complex in production process and high in production cost, light spot edge cut-off performance after light distribution, light emitting uniformity are poor, light energy utilization rate is low, the size of the whole device is large, the requirements of application scenes are difficult to meet, even if a light source capable of emitting diamond light types is formed, a large amount of light exists outside a diamond range required by regulations, waste of light energy is caused, and the whole light energy utilization rate is low. Based on the above, the problem to be solved at present is to provide an LED packaging device which has diamond light spots, uniform light emission, high light energy utilization rate, good light spot edge cut-off, small size and low production cost. Disclosure of Invention The invention aims to provide an LED packaging device, which aims to solve the problems of uneven light emission, poor spot edge cut-off, large size and high production cost of a diamond light field in the prior art. The invention is embodied in a LED package device comprising: A bracket; The LED light-emitting chip is arranged on the bracket; The LED light-emitting chip comprises a light-transmitting adhesive layer, a light-transmitting adhesive layer and a light-emitting diode (LED) light-emitting chip, wherein a plurality of light scattering particles are arranged in the light-transmitting adhesive layer; The high-reflection adhesive layer is arranged on the bracket and at least covers the side face of the light-transmitting adhesive layer; The lens is arranged on the bracket, and a cavity structure is arranged between the lens and the light-transmitting adhesive layer as well as between the lens and the high-reflection adhesive layer; the lens comprises a first optical interface close to the cavity structure and a second optical interface deviating from the first optical interface, wherein the first optical interface is set to be a plane or a micro cambered surface, and the second optical interface is set to be a convex cambered surface. Further, on the lens, curvatures of the X-axis second cut line, the 45-degree axis second cut line and the Y-axis second cut line are sequentially increased; The X axis is parallel to a first diagonal line of the diamond, the 45-degree axis is parallel to an axis forming an included angle of 45 degrees with the first diagonal line of the diamond, the Y axis is parallel to a second diagonal line of the diamond, and the lengths of the first diagonal line and the second diagonal line are L1 and L2 respectively, so that the condition that L1 is more than or equal to L2 is satisfied; The X-axis second section line is a contour line of the intersection of the central ray of the LED light-emitting chip, the plane where the X-axis is located and the second optical interface; The second section line of the 45-degree axis is a contour line of the intersection of the central ray of the LED light-emitting chip and the plane where the 45-degree axis is located and the second optical interface; And the Y-axis second section line is an outline line of the intersection of the central ray of the LED light-emitting chip, the plane where the Y-axis is positioned and the second optical interface. Further, the opening diameters of the bottoms of the Y-axis second cut line, the X-axis second cut line, and the 45-degree axis second cut line are sequentially increased. Further, the X-axis second section line, the 45-degree axis second section line and the Y-axis second section line are binary N-th power curves, and N is an integer greater than or equal to 2. Further, the binary N-th power curve is a binary 3-th power curve, the height and the length of the binary 3-th power curve of the X-axis second sectioning line are H1 and W1 respectively, the H2/W2 is less than or equal to 0.1 and less than or equal to 1, and the height and the length of the binary 3-th power curve of the Y-axis second sectioning line are H2 and W2 respectively, and the H2/W2 is less than or equal to 0.1 and less than or equal to 1. Further, the ratio of the length of the first diagonal line to the length of the binary 3-degree curve of the X-axis second cut line is 0.1-L1/W1-0.5, and the ratio of the length of the second diagonal line to the length of the binary 3-degree curve of the Y-axis second cut line is 0.1-L2/W1-0.5. Further, on the lens, curvatures of the X-axis first section line, the