Search

CN-122028573-A - LED display array and preparation method thereof

CN122028573ACN 122028573 ACN122028573 ACN 122028573ACN-122028573-A

Abstract

The invention discloses an LED display array and a preparation method thereof, and relates to the field of LED display, wherein the preparation method of the LED display array comprises the following steps of providing a substrate, an LED chip and a control chip; the LED packaging method comprises the steps of placing a plurality of control chips on a first surface of a substrate, enabling port electrodes of the control chips to be in contact with the first surface, placing a plurality of LED chips on the first surface of the substrate to form a single-color LED group formed by a plurality of LED chips with the same luminous color, arranging a packaging body which is used for packaging all the control chips and the LED chips outside the substrate, and preparing an upper wiring layer and a lower wiring layer on the upper surface and the lower surface of the packaging body respectively. The preparation process of the LED display array is simpler, reliable protection can be realized on the control chip and the LED chip, and the use reliability and the product quality of the product are improved.

Inventors

  • QU HONGXIA
  • GUO CHUANG

Assignees

  • 苏州中科光聚技术有限公司

Dates

Publication Date
20260512
Application Date
20260108

Claims (19)

  1. 1. The preparation method of the LED display array is characterized by comprising the following steps of: s1, providing a substrate (6), an LED chip (1) and a control chip (2), wherein the LED chip (1) comprises an electrode pair, and the electrode pair comprises a first electrode (10) and a second electrode (11) which are positioned on two opposite sides of the LED chip (1); S2, placing a plurality of control chips (2) on a first surface (60) of the substrate (6), enabling port electrodes (20) of the control chips (2) to be in contact with the first surface (60), and placing a plurality of LED chips (1) on the first surface (60) of the substrate (6) to form a single-color LED group formed by a plurality of LED chips (1) with the same luminous color, wherein each control chip (2) corresponds to at least one single-color LED group; s3, arranging packaging bodies (3) which cover all the control chips (2) and the LED chips (1) outside the substrate (6); S4, respectively preparing an upper wiring layer (51) and a lower wiring layer (52) on the upper surface and the lower surface of the packaging body (3), wherein the control chips (2) are electrically connected with the corresponding monochromatic LED groups and the control chips (2) through the lower wiring layers (52).
  2. 2. The method of manufacturing an LED display array according to claim 1, wherein in the step S2, when a plurality of LED chips (1) are placed on the first surface (60) of the substrate (6), the plurality of LED chips (1) of the same emission color are randomly scattered in the same target area (61) to form a single-color LED group composed of the plurality of LED chips (1) of the same emission color, the LED chips (1) of which the second electrode (11) is in contact with the first surface (60) are referred to as effective LED chips (1 a), and the LED chips (1) of which the second electrode (11) is not in contact with the first surface (60) are referred to as ineffective LED chips (1 b).
  3. 3. The method for manufacturing the LED display array according to claim 1, wherein in the step S2, each control chip (2) is correspondingly provided with three single-color LED groups, and the light emitting colors of the LED chips (1) contained in the three single-color LED groups corresponding to the same control chip (2) are different.
  4. 4. The method of manufacturing an LED display array according to claim 1, wherein in the step S2, each single-color LED group has not less than 8 LED chips (1).
  5. 5. The method for manufacturing the LED display array according to claim 2, wherein in the step S2, the step of randomly dispersing the plurality of LED chips (1) of the same emission color in the same target area (61) includes pouring the plurality of LED chips (1) of the same emission color in the target area (61).
  6. 6. The method for manufacturing the LED display array according to claim 1, wherein in the step S2, randomly dispersing the plurality of LED chips (1) of the same emission color in the same target area (61) includes: placing a plurality of LED chips (1) with the same luminous color in a liquid to form LED slurry; The LED paste is transferred to the target area (61).
  7. 7. A method of manufacturing an LED display array according to claim 6, characterized in that the LED paste is transferred to the target area (61) by means of screen printing or embossing or spraying or printing.
  8. 8. The method for manufacturing the LED display array according to claim 1, wherein the upper wiring layer (51) includes an upper conductive line (510) and an upper insulating layer (511), the lower wiring layer (52) includes a lower conductive line (520) and a lower insulating layer (521), and the step S4 of manufacturing the upper wiring layer (51) and the lower wiring layer (52) on the upper surface and the lower surface of the package body (3) includes the steps of: Removing the substrate (6) to expose the second electrode (11) of the active LED chip (1 a) and the port electrode (20) of the control chip (2); Preparing an upper conductive line (510) and a lower conductive line (520) on the upper surface and the lower surface of the package body (3), respectively, wherein the lower surface is the surface of the package body (3) exposing the port electrode (20) of the control chip (2); -preparing a first metallized via (50) connecting the upper conductive trace (510) and the lower conductive trace (520); An upper insulating layer (511) and a lower insulating layer (521) are respectively prepared on the upper surface and the lower surface of the package body (3), and the upper insulating layer (511) covers the surface of the upper conductive line (510), and the lower insulating layer (521) covers the surface of the lower conductive line (520).
  9. 9. The method for manufacturing an LED display array according to claim 8, wherein the lower conductive line (520) includes a power supply line (5200), a ground line (5201), a signal line (5202) and a connection line (5203), the control chip (2) is electrically connected to the power supply line (5200) and the ground line (5201), a plurality of the control chips (2) are connected in series through the signal line (5202) to transmit digital signals, the second electrode (11) of the active LED chip (1 a) is connected to the control chip (2) through the connection line (5203), and the first electrode (10) of the active LED chip (1 a) is connected to the power supply line (5200) or the ground line (5201) through the upper conductive line (510) and the first metallized via (50).
  10. 10. The method for manufacturing the LED display array according to claim 8, wherein the step S4 further includes the step of thinning the upper surface of the package body (3) to expose the first electrode (10) of the LED chip (1) before the step of manufacturing the upper conductive trace (510).
  11. 11. The method of manufacturing an LED display array according to any of the claims 1 to 10, characterized in that the center of gravity of the LED chip (1) is close to the second electrode (11); the LED chip (1) comprises a metallic mass connected to its second electrode (11), and/or, The cross-sectional area of the end of the second electrode (11) of the LED chip (1) is larger than the cross-sectional area of the end of the first electrode (10).
  12. 12. The method of manufacturing an LED display array according to any one of claims 1 to 10, wherein the LED chip (1) is rectangular or square; the LED chip (1) comprises two groups of electrode pairs, the second electrodes (11) of the two groups of electrode pairs being positioned on two adjacent surfaces of the LED chip (1), or The LED chip (1) comprises three groups of electrode pairs, and second electrodes (11) of the three groups of electrode pairs are positioned on three adjacent surfaces of the LED chip (1).
  13. 13. An LED display array, comprising: A plurality of single-color LED groups, each single-color LED group comprising a plurality of LED chips (1) of the same emission color, the LED chips (1) comprising an electrode pair comprising a first electrode (10) and a second electrode (11) on opposite sides of the LED chips (1); The control chip (2) comprises a plurality of port electrodes (20), and each control chip (2) is correspondingly provided with at least one single-color LED group; the packaging body (3) is coated outside the control chip (2) and all the LED chips (1); an upper wiring layer (51) provided on the upper surface of the package (3), and And a lower wiring layer (52) provided on the lower surface of the package (3), wherein the control chip (2) and the corresponding single-color LED group and the plurality of control chips (2) are electrically connected through the lower wiring layer (52).
  14. 14. An LED display array according to claim 13, characterized in that the positions and attitudes of the LED chips (1) of the single color LED group are random, the LED chips (1) of which the second electrode (11) is on the same plane as the port electrode (20) are called active LED chips (1 a), the LED chips (1) of which the second electrode (11) is not on the same plane as the port electrode (20) are called inactive LED chips (1 b), and the control chip (2) is electrically connected with the second electrode (11) of the active LED chips (1 a) of the single color LED group corresponding thereto.
  15. 15. An LED display array according to claim 13, characterized in that a plurality of said control chips (2) are connected in series to deliver digital signals.
  16. 16. An LED display array according to claim 15, wherein the plurality of port electrodes (20) of the control chip (2) comprises a first signal transmission electrode (200) and a second signal transmission electrode (201) for signal transmission, the first signal transmission electrode (200) of the former control chip (2) and the second signal transmission electrode (201) of the latter control chip (2) being electrically connected.
  17. 17. The LED display array of claim 16, wherein the lower wiring layer (52) comprises a lower conductive trace (520) and a lower insulating layer (521) covering the lower conductive trace (520), the lower conductive trace (520) comprising a power supply line (5200), a ground line (5201), a signal line (5202) and a connection line (5203); the first signal transmission electrode (200) of the former control chip (2) and the second signal transmission electrode (201) of the latter control chip (2) are connected through the signal line (5202); The control chip (2) is connected with the power supply line (5200) and the ground line (5201); The upper wiring layer (51) comprises an upper conductive line (510) electrically connected with the first electrode (10) of the effective LED chip (1 a) and an upper insulating layer (511) coating the upper conductive line (510), and the upper conductive line (510) is connected with the power supply line (5200) or the ground line (5201) through a first metallized via (50) passing through the package body (3).
  18. 18. The LED display array of claim 17, wherein said lower wiring layer (52) comprises a power supply port pad (523), a ground port pad (524) and a signal port pad (525) exposed to said lower insulating layer (521), said power supply port pad (523) being electrically connected to said power supply line (5200) for connecting an external power source, said ground port pad (524) being electrically connected to said ground line (5201), said signal port pad (525) being electrically connected to a first signal transmission electrode (200) of a first one of said control chips (2) for inputting a control signal.
  19. 19. An LED display array according to any one of claims 13 to 18, wherein each control chip (2) is provided with three groups of single-colour LEDs, each group having a different colour of emission from the LED chip (1).

Description

LED display array and preparation method thereof Technical Field The invention relates to the technical field of LED display, in particular to an LED display array and a preparation method thereof. Background The display screen comprises a large number of LED chips, and rich visual information is displayed by driving the LED chips to emit light. At present, some LED display arrays emit light through row-column signal lines by scanning driving corresponding LED chips, and each LED chip cannot be independently controlled to emit light through digital signals. In addition, when the display screen is manufactured, each LED chip needs to be accurately placed at a designated position through a huge amount of transfer equipment, the transfer precision requirement is high, and the efficiency is low. In addition, the reliability requirement on the LED chip is very high, if the quality problem exists in the LED chip, the screen can generate bad points such as black points or bright points, and the display effect is influenced. Some LED display arrays include a circuit board for preparing lines and a plurality of LED chip packaging units distributed on the circuit board in an array manner, the LED chip packaging units comprise packaged LED chips and a plurality of exposed bonding pads, the LED chip packaging units are required to be connected to the circuit board in a piece-beating manner, the preparation process is complex, the product quality is easily influenced by the welding quality between the LED chip packaging units and the circuit board, and each LED chip packaging unit needs to occupy a certain volume, so that the area of the circuit board is larger, and the product size is larger. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art. The foregoing is provided merely to facilitate the understanding of the principles of the application and is not admitted to be prior art by the foregoing disclosure. Disclosure of Invention The invention aims to provide an LED display array and a preparation method thereof, so as to improve the working reliability of the LED display array. In order to achieve the above object, in a first aspect, the present invention provides a method for manufacturing an LED display array, which is characterized by comprising the following steps: S1, providing a substrate, an LED chip and a control chip, wherein the LED chip comprises an electrode pair, and the electrode pair comprises a first electrode and a second electrode which are positioned on two opposite sides of the LED chip; S2, placing a plurality of control chips on the first surface of the substrate, wherein port electrodes of the control chips are in contact with the first surface, and placing a plurality of LED chips on the first surface of the substrate to form a single-color LED group consisting of a plurality of LED chips with the same luminous color, wherein each control chip corresponds to at least one single-color LED group; s3, arranging packaging bodies for coating all the control chips and the LED chips outside the substrate; s4, respectively preparing an upper wiring layer and a lower wiring layer on the upper surface and the lower surface of the packaging body, wherein the control chips are electrically connected with the corresponding monochromatic LED groups and the control chips through the lower wiring layers. Further, in the step S2, when a plurality of LED chips are placed on the first surface of the substrate, the plurality of LED chips of the same emission color are randomly scattered in the same target area to form a single-color LED group composed of the plurality of LED chips of the same emission color, the LED chips of which the second electrode is in contact with the first surface are called active LED chips, and the LED chips of which the second electrode is not in contact with the first surface are called inactive LED chips. Further, in step S2, each control chip is correspondingly provided with three single-color LED groups, and the light emitting colors of the LED chips contained in the three single-color LED groups corresponding to the same control chip are different. Further, in the step S2, each of the single-color LED groups has not less than 8 LED chips. Further, in the step S2, the step of randomly dispersing the plurality of LED chips with the same light emission color in the same target area comprises the step of pouring the plurality of LED chips with the same light emission color in the target area. Further, in the step S2, randomly dispersing the plurality of LED chips with the same emission color in the same target area includes: placing a plurality of LED chips with the same luminous color in liquid to form LED slurry; The LED paste is transferred to the target area. Further, the LED paste is transferred to the target area by means of screen printing or embossing or spraying or printing. Further, the upper wiring layer