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CN-122028607-A - Display panel, preparation method thereof and display device

CN122028607ACN 122028607 ACN122028607 ACN 122028607ACN-122028607-A

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The manufacturing method of the display panel comprises the steps of manufacturing a substrate, forming an isolation structure on one side of the substrate, forming a plurality of isolation openings by surrounding the isolation structure, and forming a light emitting device on one side of the substrate, wherein the light emitting device comprises a first light emitting device and a second light emitting device. A first protective layer is formed in a portion of the isolation opening prior to fabrication of the first light emitting device. The first protective layer is removed before the second light emitting device is fabricated. The invention protects other opening structures and other protective layers of the light-emitting device by arranging the protective layers, and prevents the influence of subsequent processing on other structures, thereby solving the problem of dark spots of pixels.

Inventors

  • LIU QINGGANG

Assignees

  • 合肥维信诺科技有限公司

Dates

Publication Date
20260512
Application Date
20241111

Claims (13)

  1. 1. A method for manufacturing a display panel, comprising: Preparing a substrate; forming an isolation structure on one side of the substrate, wherein the isolation structure is enclosed to form a plurality of isolation openings; Forming a light emitting device on one side of the substrate, the light emitting device including a first light emitting device and a second light emitting device; forming a first protective layer in a part of the isolation opening before preparing the first light emitting device; At least a portion of the first protective layer is removed prior to preparing the second light emitting device.
  2. 2. The method of manufacturing a display panel according to claim 1, further comprising: Forming an encapsulation layer on one side of the light emitting device away from the substrate; Preferably, the encapsulation layer is prepared by an atomic layer deposition process.
  3. 3. The method for manufacturing a display panel according to claim 2, wherein, The light emitting device further includes a third light emitting device, the isolation opening including a first opening, a second opening, and a third opening; The step of preparing a light emitting device at one side of the substrate includes: preparing the first light emitting device in the first opening; Preparing the second light emitting device in the second opening; Preparing the third light emitting device in the third opening; Preferably, the step of preparing the first light emitting device in the first opening includes forming the first protective layer in the second opening and the third opening; Preferably, the step of preparing the second light emitting device in the second opening comprises forming a second protective layer on a side of the encapsulation layer facing away from the substrate and in the third opening, or Removing the first protection layer in the second opening, reserving the first protection layer in the third opening, and forming a second protection layer corresponding to the first light-emitting device on one side of the encapsulation layer away from the substrate; Preferably, the step of preparing the second light emitting device in the second opening includes removing the second protective layer; preferably, before the step of preparing the third light emitting device in the third opening, a third protective layer is formed on the side of the encapsulation layer facing away from the substrate, or Removing the first protective layer or the second protective layer in the third opening, reserving the second protective layer corresponding to the first light emitting device, and forming a third protective layer corresponding to the second light emitting device on one side of the packaging layer away from the substrate; Preferably, the step of preparing the third light emitting device in the third opening includes removing the third protective layer.
  4. 4. The method for manufacturing a display panel according to claim 3, The distance between one end of the first protective layer, the second protective layer and the third protective layer, which is far away from the substrate, and the substrate is greater than the distance between one end of the isolation structure, which is far away from the substrate, and the substrate.
  5. 5. The method for manufacturing a display panel according to claim 3, The materials of the first protective layer, the second protective layer and the third protective layer comprise organic materials; Preferably, the materials of the first protective layer, the second protective layer and the third protective layer include photoresist.
  6. 6. The method for manufacturing a display panel according to claim 3, The step of forming the encapsulation layer on the side of the light emitting device facing away from the substrate includes: Forming a first packaging part on one side of the first light emitting device, which is away from the substrate; forming a second packaging part on one side of the second light emitting device, which is away from the substrate; forming a third packaging part on one side of the third light emitting device, which is away from the substrate; Preferably, the material of the encapsulation layer includes at least one of an inorganic material and a metal oxide; Preferably, the material of the encapsulation layer includes at least one of silicon oxide, silicon nitride, or aluminum oxide.
  7. 7. The method for manufacturing a display panel according to claim 6, wherein, The step of forming a first package portion on a side of the first light emitting device facing away from the substrate includes: Forming a first material layer on one side of the first light emitting device, which is away from the substrate, before removing the first protective layer; Removing the first material layer corresponding to the second opening and the third opening to form the first encapsulation part; the step of forming a second package portion on a side of the second light emitting device facing away from the substrate includes: forming a second material layer on one side of the second light emitting device facing away from the substrate before removing the second protective layer; removing the second material layer corresponding to the first opening and the third opening to form the second packaging part; The step of forming a third package portion on a side of the third light emitting device facing away from the substrate includes: Forming a third material layer on one side of the third light emitting device away from the substrate; and removing the third material layer corresponding to the first opening and the second opening to form the third packaging part.
  8. 8. The method for manufacturing a display panel according to claim 7, The step of forming a first package portion on a side of the first light emitting device facing away from the substrate further includes: forming a first lithography layer on a side of the first material layer facing away from the substrate, the first lithography layer corresponding to the first opening, prior to the step of removing the first material layer corresponding to the second opening and the third opening; Removing the first material layer and the first light emitting device which are not covered by the first photoetching layer through an etching process; the step of forming a second encapsulation portion on a side of the second light emitting device facing away from the substrate further includes: Forming a second lithography layer on a side of the second material layer facing away from the substrate, the second lithography layer corresponding to the second opening, prior to the step of removing the second material layer corresponding to the first opening and the third opening; removing the second material layer and the second light emitting device uncovered by the second photolithography layer by an etching process; the step of forming a third package portion on a side of the third light emitting device facing away from the substrate further includes: Forming a third photoetching layer on one side of the third material layer, which faces away from the substrate, before the step of removing the third material layer corresponding to the first opening and the second opening, wherein the third photoetching layer corresponds to the third opening; and removing the third material layer and the third light emitting device which are not covered by the third photolithography layer through an etching process.
  9. 9. The method for manufacturing a display panel according to claim 8, wherein, Removing the first protection layer by an ashing process and/or a stripping process; the step of removing the second protection layer comprises removing the second protection layer and the second photoetching layer through an ashing process and/or a stripping process; the step of removing the third protection layer includes removing the third protection layer and the third photolithography layer through an ashing process and/or a stripping process.
  10. 10. The method for manufacturing a display panel according to claim 3, The materials of the first, second and third light emitting devices are at least partially different; Preferably, the wavelength of light emitted by the first light emitting device is greater than the wavelength of light emitted by the second light emitting device; Preferably, the wavelength of light emitted by the second light emitting device is greater than the wavelength of light emitted by the third light emitting device.
  11. 11. The method for manufacturing a display panel according to claim 1, wherein, The step of forming the isolation structure on one side of the substrate further comprises the following steps: forming a first electrode layer on one side of the substrate, the first electrode layer including a plurality of first electrodes; A pixel defining layer is formed on one side of the substrate, the pixel defining layer covering the first electrode layer, the pixel defining layer including a plurality of pixel openings, the pixel openings corresponding to the first electrodes.
  12. 12. A display panel, which is characterized in that, the display panel is manufactured by the manufacturing method of the display panel according to any one of claims 1 to 11.
  13. 13. A display device comprising a display panel as claimed in claim 12.

Description

Display panel, preparation method thereof and display device Technical Field The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. Background An Organic Light-Emitting Diode (OLED) is an Organic thin film electroluminescent device, which has the advantages of low power consumption, high brightness, wide viewing angle, high contrast ratio, and flexible display, and has been widely used in electronic display products. However, the current display panel is easy to have a problem of dark pixel points when in use. Disclosure of Invention The invention aims to provide a display panel, a preparation method thereof and a display device, which are used for solving the technical problem that the prior display panel is easy to generate dark pixel points when in use. The invention provides a manufacturing method of a display panel, which comprises the steps of manufacturing a substrate, forming an isolation structure on one side of the substrate, forming a plurality of isolation openings by surrounding the isolation structure, and forming a light emitting device on one side of the substrate, wherein the light emitting device comprises a first light emitting device and a second light emitting device. A first protective layer is formed in a portion of the isolation opening prior to fabrication of the first light emitting device. At least a portion of the first protective layer is removed prior to preparing the second light emitting device. Further, the manufacturing method of the display panel further comprises the step of forming an encapsulation layer on one side, away from the substrate, of the light-emitting device. Preferably, the encapsulation layer is prepared by an atomic layer deposition process. Further, the light emitting device further includes a third light emitting device, and the isolation opening includes a first opening, a second opening, and a third opening. The step of preparing a light emitting device at one side of the substrate includes preparing the first light emitting device in the first opening, preparing the second light emitting device in the second opening, and preparing the third light emitting device in the third opening. Preferably, the step of preparing the first light emitting device in the first opening includes forming the first protective layer in the second opening and the third opening. Preferably, the step of preparing the second light emitting device in the second opening comprises forming a second protection layer on one side of the encapsulation layer away from the substrate and in the third opening, or removing the first protection layer in the second opening, retaining the first protection layer in the third opening, and forming a second protection layer corresponding to the first light emitting device on one side of the encapsulation layer away from the substrate. Preferably, the step of preparing the second light emitting device in the second opening includes removing the second protective layer. Preferably, before the step of preparing the third light emitting device in the third opening, a third protection layer is formed on one side of the first light emitting device and the second light emitting device, which is away from the substrate, or the first protection layer or the second protection layer in the third opening is removed, the second protection layer corresponding to the first light emitting device is reserved, and a third protection layer corresponding to the second light emitting device is formed on one side of the encapsulation layer, which is away from the substrate. Preferably, the step of preparing the third light emitting device in the third opening includes removing the third protective layer. Further, a distance between one end of the first protective layer, the second protective layer and the third protective layer, which is away from the substrate, and the substrate is greater than a distance between one end of the isolation structure, which is away from the substrate, and the substrate. Further, the materials of the first protective layer, the second protective layer and the third protective layer include organic materials. Preferably, the materials of the first protective layer, the second protective layer and the third protective layer include photoresist. Further, the step of forming the packaging layer on the side, away from the substrate, of the light emitting device comprises the steps of forming a first packaging part on the side, away from the substrate, of the first light emitting device, forming a second packaging part on the side, away from the substrate, of the second light emitting device, and forming a third packaging part on the side, away from the substrate, of the third light emitting device. Preferably, the material of the encapsulation layer includes at least one of an inorganic material and a metal oxide. Preferably, the material of the encapsulat