CN-122028625-A - Display device and method for manufacturing display device

Abstract

The invention provides a display device and a method for manufacturing the same. In a method for manufacturing a display device, a processing substrate is prepared, wherein a1 st bottom electrode, a2 nd bottom electrode, and a 3 rd bottom electrode are formed, and a overhanging-shaped partition wall is formed, a1 st laminated film including a1 st organic layer, a1 st upper electrode, and a1 st upper layer is formed on the 1 st bottom electrode, the 2 nd bottom electrode, and the 3 rd bottom electrode with the partition wall as a mask, a1 st sealing layer is formed on the 1 st laminated film, the partition wall is covered with the 1 st sealing layer, a1 st resist patterned in a predetermined shape is formed on the 1 st sealing layer, the 1 st resist is patterned as a mask, a part of the partition wall surrounding the 2 nd bottom electrode and the 3 rd bottom electrode is exposed, a water plasma treatment is performed on the processing substrate with the 1 st resist as a mask, the 1 st laminated film is patterned, the 2 nd bottom electrode and the 3 rd bottom electrode are exposed, and the 1 st resist is removed.

Inventors

• SHAN XIAXUE

Assignees

• 株式会社迈格诺皓特

Dates

Publication Date

20260512

Application Date

20251107

Priority Date

20241112

Claims (20)

1. 1.A method for manufacturing a display device, characterized in that, Preparing a processing substrate, wherein a1 st bottom electrode, a 2 nd bottom electrode and a 3 rd bottom electrode are formed above the substrate, and a cantilever-shaped partition wall is formed to surround the 1 st bottom electrode, the 2 nd bottom electrode and the 3 rd bottom electrode respectively, Forming a1 st laminated film including a1 st organic layer, a1 st upper electrode, and a1 st upper clad layer on the 1 st lower electrode, the 2 nd lower electrode, and the 3 rd lower electrode using the partition wall as a mask, Forming a1 st seal layer on the 1 st laminated film, and covering the partition wall with the 1 st seal layer, Forming a1 st resist patterned in a prescribed shape on the 1 st sealing layer, Patterning the 1 st sealing layer using the 1 st resist as a mask to expose a portion of the partition wall surrounding the 2 nd lower electrode and the 3 rd lower electrode, respectively, The water plasma treatment is carried out on the treated substrate, Patterning the 1 st laminated film using the 1 st resist as a mask to expose the 2 nd lower electrode and the 3 rd lower electrode, The 1 st resist is removed.
2. 2. The method of manufacturing a display device according to claim 1, wherein, The step of forming the partition wall includes a step of forming an axial layer using an aluminum-based material, In the water plasma treatment, an aluminum oxide film is formed on the side surface of the shaft layer.
3. 3. The method of manufacturing a display device according to claim 2, wherein, The step of forming the partition wall includes a step of forming a top layer using a titanium-based material, The top layer being located above the shaft layer, having a lower surface protruding from the side of the shaft layer, In the water plasma treatment, a titanium oxide film is formed on the lower surface.
4. 4. The method of manufacturing a display device according to claim 1, wherein, The step of preparing the processing substrate includes a step of forming an inorganic insulating layer having openings overlapping the 1 st bottom electrode, the 2 nd bottom electrode, and the 3 rd bottom electrode after forming the 1 st bottom electrode, the 2 nd bottom electrode, and the 3 rd bottom electrode, The step of forming the partition wall includes a step of forming a base layer on the inorganic insulating layer, a step of forming an axial layer on the base layer, and a step of forming a top layer on the axial layer, the base layer and the top layer being formed so as to protrude from side surfaces of the axial layer.
5. 5. The method of manufacturing a display device according to claim 4, wherein, In the water plasma treatment, an oxide film is formed on the entire surface of the side surface of the partition wall surrounding the 2 nd bottom electrode and the 3 rd bottom electrode, respectively.
6. 6. The method of manufacturing a display device according to claim 4, wherein, The 1 st laminated film covers the bottom layer and covers the 1 st part of the side surface of the shaft layer connected to the bottom layer, exposes the 2 nd part of the side surface of the shaft layer connected to the top layer, In the water plasma treatment, an oxide film is formed on the 2 nd portion of the partition wall surrounding the 2 nd lower electrode and the 3 rd lower electrode, respectively.
7. 7. The method of manufacturing a display device according to claim 6, wherein, The step of patterning the 1 st laminated film includes a step of removing the 1 st upper electrode exposed from the 1 st resist, In the step of removing the 1 st upper electrode, the 1 st portion of the partition wall surrounding the 2 nd lower electrode and the 3 rd lower electrode is removed, a cavity is formed in the axial layer, and the underlayer is exposed in the cavity.
8. 8. The method for manufacturing a display device according to claim 7, wherein, In the step of removing the 1 st resist, the cavity is expanded.
9. 9. The method of manufacturing a display device according to claim 4, wherein, The underlayer is formed of an oxide conductive material.
10. 10. The method of manufacturing a display device according to claim 1, wherein, The step of forming the 1 st lower electrode, the 2 nd lower electrode and the 3 rd lower electrode includes a step of forming oxide conductive layers on the respective surfaces, The method for manufacturing a display device further includes a step of performing a water plasma treatment after patterning the 1 st laminated film.
11. 11. The method of manufacturing a display device according to claim 1, wherein, Further comprising a step of forming a2 nd laminated film and a2 nd sealing layer on the 2 nd laminated film, wherein the 2 nd laminated film comprises a2 nd organic layer, a2 nd upper electrode and a2 nd upper clad layer and is positioned on the 2 nd lower electrode, After patterning of the 2 nd sealing layer, the treated substrate is subjected to a water plasma treatment.
12. 12. The method for manufacturing a display device according to claim 11, wherein, Further comprising a step of forming a 3 rd laminated film and a 3 rd sealing layer on the 3 rd laminated film, wherein the 3 rd laminated film comprises a 3 rd organic layer, a 3 rd upper electrode and a 3 rd upper clad layer and is positioned on the 3 rd lower electrode, After patterning the 3 rd seal layer, patterning the 3 rd laminated film is performed without performing water plasma treatment on the treated substrate.
13. 13. A display device is characterized by comprising: A substrate; An inorganic insulating layer disposed above the substrate; a1 st display element configured to display a1 st color; A 2 nd display element configured to display a 2 nd color different from the 1 st color; a 3 rd display element configured to display a 3 rd color different from the 1 st color and the 2 nd color; A partition wall which is disposed on the inorganic insulating layer, has conductivity, surrounds the 1 st display element, the 2 nd display element, and the 3 rd display element, and is formed in a cantilever shape; A1 st sealing layer covering the 1 st display element; A2 nd sealing layer covering the 2 nd display element, and A 3 rd sealing layer covering the 3 rd display element, The partition wall includes a bottom layer disposed on the inorganic insulating layer, an axial layer disposed on the bottom layer, and a top layer disposed on the axial layer, The two ends of the bottom layer and the top layer respectively protrude from the side surface of the shaft layer, The shaft layer has a hollow recessed with respect to the side surface surrounding the 2 nd display element and the 3 rd display element, respectively, and exposing the bottom layer.
14. 14. The display device of claim 13, wherein the display device comprises a display device, The shaft layer does not have a hollow recessed with respect to the side surface surrounding the 1 st display element.
15. 15. The display device of claim 13, wherein the display device comprises a display device, The 2 nd display element is provided with a2 nd upper electrode electrically connected to the partition wall, The 3 rd display element is provided with a 3 rd upper electrode electrically connected to the partition wall, The 2 nd upper electrode and the 3 rd upper electrode extend to the cavity, respectively.
16. 16. The display device of claim 13, wherein the display device comprises a display device, The 1 st display element is provided with a1 st upper electrode electrically connected to the partition wall, The 2 nd display element is provided with a2 nd upper electrode electrically connected to the partition wall, The contact area of the 2 nd upper electrode and the bottom layer is larger than that of the 1 st upper electrode and the bottom layer.
17. 17. The display device of claim 16, wherein the display device comprises, The 3 rd display element is provided with a 3 rd upper electrode electrically connected to the partition wall, The contact area of the 3 rd upper electrode and the bottom layer is larger than that of the 1 st upper electrode and the bottom layer.
18. 18. The display device of claim 13, wherein the display device comprises a display device, The shaft layer is made of an aluminum material, and has an aluminum oxide film on the side surface surrounding the 2 nd display element and the 3 rd display element, respectively.
19. 19. The display device of claim 18, wherein the display device comprises, The top layer is formed of a titanium-based material, and has a titanium oxide film on a lower surface protruding from the side surface of the shaft layer.
20. 20. The display device of claim 19, wherein the display device comprises, The 2 nd sealing layer and the 3 rd sealing layer are respectively contacted with the aluminum oxide film and the titanium oxide film.

Description

Display device and method for manufacturing display device Cross-reference to related applications The present application claims priority based on japanese patent application No. 2024-197541 filed on 11/12 of 2024, and the entire contents of the description of the present application are incorporated herein by reference. Technical Field Embodiments of the present invention relate to a display device and a method for manufacturing the display device. Background In recent years, display devices in which Organic Light Emitting Diodes (OLEDs) are applied as display elements have been put into practical use. The display element includes a pixel circuit including a thin film transistor, a lower electrode connected to the pixel circuit, an organic layer covering the lower electrode, and an upper electrode covering the organic layer. The organic layer includes a functional layer such as a hole transport layer and an electron transport layer in addition to the light-emitting layer. In the process of manufacturing such a display element, a technique of suppressing a decrease in reliability is required. Disclosure of Invention An object of the embodiments is to provide a display device and a method of manufacturing the display device, which can suppress a decrease in reliability. In general, according to one embodiment, a method for manufacturing a display device includes preparing a processing substrate including a 1 st bottom electrode, a 2 nd bottom electrode, and a 3 rd bottom electrode formed over a substrate, forming a cantilever-shaped partition wall surrounding the 1 st bottom electrode, the 2 nd bottom electrode, and the 3 rd bottom electrode, respectively, using the partition wall as a mask, forming a 1 st laminated film including a 1 st organic layer, a 1 st upper electrode, and a 1 st upper coating layer over the 1 st bottom electrode, forming a 1 st sealing layer over the 1 st laminated film, covering the partition wall with the 1 st sealing layer, forming a 1 st resist patterned in a predetermined shape over the 1 st sealing layer, patterning the 1 st resist as a mask, exposing a portion of the partition wall surrounding the 2 nd bottom electrode and the 3 rd bottom electrode, respectively, laminating the processing substrate with the 1 st sealing layer, forming a 1 st sealing layer over the 1 st sealing layer, patterning the 1 st resist as a mask, and removing the 1 st sealing layer, and removing the 1 st electrode. According to another embodiment, a display device includes a substrate, an inorganic insulating layer disposed above the substrate, a1 st display element configured to display a1 st color, a 2 nd display element configured to display a 2 nd color different from the 1 st color, a 3 rd display element configured to display a 3 rd color different from the 1 st color and the 2 nd color, a partition wall disposed on the inorganic insulating layer and having conductivity to surround the 1 st display element, the 2 nd display element, and the 3 rd display element, respectively, and formed in a overhanging shape, a1 st seal layer covering the 1 st display element, a 2 nd seal layer covering the 2 nd display element, and a 3 rd seal layer covering the 3 rd display element, the partition wall having a bottom layer disposed on the inorganic insulating layer, a shaft layer disposed on the bottom layer, and a top layer disposed on the shaft layer, both ends of the bottom layer and the top layer being protruded from a side surface of the shaft layer, the shaft layer protruding from the shaft layer and the hollow layer having a recess to expose the side surface of the hollow 2 nd display element, respectively. According to the embodiments, a display device and a method of manufacturing the display device can be provided, which can suppress a decrease in reliability. Drawings Fig. 1 is a diagram showing an example of the display device DSP. Fig. 2 is a diagram showing an example of the layout of the sub-pixels SP1, SP2, and SP3 constituting one pixel PX. Fig. 3 is a diagram for explaining an example of the pixel PX. Fig. 4 is a schematic cross-sectional view of the display device DSP along the line a-B in fig. 2. Fig. 5A is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5B is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5C is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5D is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5E is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5F is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5G is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5H is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5I is a diagram for explaining a method of manufacturing the display device DSP. Fig. 5J is a diagram for explainin