CN-122028671-A - Method, device, storage medium, equipment and product for generating cutting track alignment mark

CN122028671ACN 122028671 ACN122028671 ACN 122028671ACN-122028671-A

Abstract

The present disclosure relates to a scribe line alignment mark generation method, apparatus, storage medium, device, and product. The method comprises the steps of obtaining a basic component database of a basic component of the cutting path alignment mark, wherein the basic component database comprises description information of various basic components of the cutting path alignment mark, establishing a placement rule of the basic component of the cutting path alignment mark of each laminated layer of a chip according to the basic component database, and generating the cutting path alignment mark of each laminated layer of the chip according to the placement rule. The embodiment of the disclosure can reduce the error risk of the alignment mark of the cutting channel and improve the design efficiency and the production yield of the chip.

Inventors

Zhuang Boqing
XING ZEGUANG
SU XIAOXI
SUN MINGCONG

Assignees

成都新紫光半导体科技有限公司

Dates

Publication Date: 20260512
Application Date: 20241104

Claims (10)

1. A method for generating a scribe line alignment mark, the method comprising: Acquiring a basic component database of the cutting-path alignment mark basic component, wherein the basic component database comprises description information of various different cutting-path alignment mark basic components; according to the basic component database, setting up a rule for setting up a cutting path alignment mark basic component of each laminated chip; and generating a cutting path alignment mark of each lamination of the chip according to the placement rule.
2. The method of claim 1, wherein prior to said creating placement rules for street alignment mark base components for each stack of chips from said base component database, said method further comprises: And encoding each cutting path alignment mark basic component and adding description information to establish the basic component database, wherein different cutting path alignment mark basic components correspond to different component encoding and description information.
3. The method of claim 1, wherein establishing the placement rules of the scribe line alignment mark base components for each stack of chips based on the base component database comprises: Establishing a mapping relation between each lamination of the chip and codes of each cutting path alignment mark basic component in the basic component database; establishing an alignment criterion of each lamination of the chip; And establishing description information, width information and interval information of each lamination of the chip.
4. The method of claim 1, wherein establishing the placement rules of the scribe line alignment mark base components for each stack of chips based on the base component database comprises: And establishing a placement rule of the cutting path alignment mark basic components of each lamination by using a spreadsheet according to the basic component database, wherein the spreadsheet comprises an Excel table.
5. The method of claim 1, wherein generating the scribe line alignment marks for each stack of chips comprises: reading the arrangement rule of the cutting path alignment mark basic components of each laminated layer of the chip by using a script file to generate a drawing intermediate file; and generating the cutting path alignment marks of each lamination of the chip by using drawing software according to the drawing intermediate file and the database.
6. The method of any of claims 1-5, wherein the descriptive information includes at least one of a shape, a component name, size information, and a data stream type of the scribe line alignment mark basic component.
7. A scribe line alignment mark generating apparatus, comprising: the acquisition module is used for acquiring a basic component database of the cutting-path alignment mark basic component, wherein the basic component database comprises description information of various different cutting-path alignment mark basic components; the establishing module is used for establishing the arrangement rule of the cutting path alignment mark basic components of each laminated chip according to the basic component database; and the generating module is used for generating the cutting path alignment marks of each lamination of the chip according to the placement rule.
8. A non-transitory computer readable storage medium having stored thereon a computer program, characterized in that the program when executed by a processor realizes the steps of the method according to any of claims 1-6.
9. An electronic device, comprising: A memory having a computer program stored thereon; a processor for executing the computer program in the memory to implement the steps of the method of any one of claims 1-6.
10. A computer program product comprising a computer program, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1-6.

Description

Method, device, storage medium, equipment and product for generating cutting track alignment mark Technical Field The disclosure relates to the technical field of chips, and in particular relates to a method, a device, a storage medium, equipment and a product for generating a dicing street alignment mark. Background In the prior art related to chip design and production technology, different scribe line alignment marks (marks) are generally calculated and drawn on peripheral scribe lines manually, and need to be repeatedly communicated and modified by a team, which is time-consuming and laborious, and is prone to error and omission. Disclosure of Invention In order to solve the technical problems, the present disclosure provides a method, an apparatus, a storage medium, a device and a product for generating a scribe line alignment mark. According to a first aspect of an embodiment of the present disclosure, there is provided a scribe line alignment mark generation method, the method including: Acquiring a basic component database of the cutting-path alignment mark basic component, wherein the basic component database comprises description information of various different cutting-path alignment mark basic components; according to the basic component database, setting up a rule for setting up a cutting path alignment mark basic component of each laminated chip; and generating a cutting path alignment mark of each lamination of the chip according to the placement rule. Optionally, before the rule of placing the dicing street alignment mark basic assembly of each stack of chips is established according to the basic assembly database, the method further includes: And encoding each cutting path alignment mark basic component and adding description information to establish the basic component database, wherein different cutting path alignment mark basic components correspond to different component encoding and description information. Optionally, the establishing a rule for placing the dicing street alignment mark basic component of each stack of chips according to the basic component database includes: Establishing a mapping relation between each lamination of the chip and codes of each cutting path alignment mark basic component in the basic component database; establishing an alignment criterion of each lamination of the chip; And establishing description information, width information and interval information of each lamination of the chip. Optionally, the establishing a rule for placing the dicing street alignment mark basic component of each stack of chips according to the basic component database includes: And establishing a placement rule of the cutting path alignment mark basic components of each lamination by using a spreadsheet according to the basic component database, wherein the spreadsheet comprises an Excel table. Optionally, the generating the scribe line alignment mark of each stack of chips includes: reading the arrangement rule of the cutting path alignment mark basic components of each laminated layer of the chip by using a script file to generate a drawing intermediate file; and generating the cutting path alignment marks of each lamination of the chip by using drawing software according to the drawing intermediate file and the database. Optionally, the description information includes at least one of a shape, a component name, size information, and a data stream type of the scribe line alignment mark basic component. According to a second aspect of embodiments of the present disclosure, there is provided a dicing street alignment mark generating apparatus, the apparatus including: the acquisition module is used for acquiring a basic component database of the cutting-path alignment mark basic component, wherein the basic component database comprises description information of various different cutting-path alignment mark basic components; the establishing module is used for establishing the arrangement rule of the cutting path alignment mark basic components of each laminated chip according to the basic component database; and the generating module is used for generating the cutting path alignment marks of each lamination of the chip according to the placement rule. According to a third aspect of embodiments of the present disclosure, there is provided a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the method of any of the first aspects. According to a fourth aspect of embodiments of the present disclosure, there is provided an electronic device, comprising: A memory having a computer program stored thereon; A processor for executing the computer program in the memory to implement the steps of the method of any of the first aspects. According to a fifth aspect of embodiments of the present disclosure, there is provided a computer program product comprising a computer program which, when e