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CN-122028674-A - Semiconductor device and working method thereof

CN122028674ACN 122028674 ACN122028674 ACN 122028674ACN-122028674-A

Abstract

The application provides a semiconductor device and a working method thereof, wherein the semiconductor device comprises a processing tank and a heat conduction component arranged in the processing tank, the heat conduction component divides the interior of the processing tank into a first chamber for containing first liquid and a second chamber for containing second liquid, and the first chamber and the second chamber are respectively communicated with a process tank. The semiconductor device provided by the application enables the first liquid in the first chamber and the second liquid in the second chamber to exchange heat energy through the heat conduction component, and helps the first liquid to heat up and the second liquid to cool down, so that the overall energy consumption required by the semiconductor device for adjusting the temperature of the process liquid contained in the semiconductor device is reduced.

Inventors

  • PAN DONGLIN
  • YU LIYANG

Assignees

  • 上海光通信有限公司

Dates

Publication Date
20260512
Application Date
20241111

Claims (10)

  1. 1. A semiconductor device includes a processing tank, wherein a heat conduction member is provided in the processing tank, the heat conduction member divides the interior of the processing tank into a first chamber containing a first liquid and a second chamber containing a second liquid, the first chamber and the second chamber are respectively communicated with the processing tank, The first chamber comprising a first chamber inlet for introducing a process liquid into the first chamber and a first chamber outlet connected to the process tank via a first pipe, the first pipe comprising a first water pump allowing the process liquid to flow from the first chamber to the process tank via the first pipe, The second chamber comprises a second chamber inlet and a second chamber outlet, the second chamber inlet is connected with the process tank through a second pipeline, the second pipeline comprises a second water pump, the second water pump enables the process liquid to flow from the process tank to the second chamber, and the second chamber outlet is used for discharging the process liquid.
  2. 2. The semiconductor device of claim 1, further comprising: The heater is arranged on the first pipeline and used for heating the process liquid in the first pipeline to the process temperature; the first temperature sensor is arranged on the first pipeline and used for detecting the first temperature of the process liquid in the first pipeline; A process cooling water system disposed within the second chamber for reducing the temperature of the process fluid within the second chamber to a discharge temperature; A second temperature sensor disposed in the second chamber for detecting a second temperature of the process fluid in the second chamber, and And the controller is electrically connected with the heater, the first temperature sensor, the process cooling water system and the second temperature sensor.
  3. 3. The semiconductor device of claim 2, wherein the controller is configured to: Activating the heater in response to the first temperature being below the process temperature, and The process cooling water system is started in response to the second temperature being above the discharge temperature.
  4. 4. The semiconductor device according to claim 2, wherein the discharge temperature is 20 to 60 ℃ and the process temperature is 80 to 120 ℃.
  5. 5. The semiconductor device of claim 2, wherein the controller is further electrically connected to the first water pump and the second water pump.
  6. 6. The semiconductor device of claim 5, wherein the controller is configured to: Starting the first water pump in response to the condition of changing liquid being met, and And starting the second water pump in response to the process tank completing the process.
  7. 7. The semiconductor device according to claim 6, wherein the liquid change condition is that a change value of the second temperature in 1 minute is less than 2 ℃ and the process tank does not contain the process liquid.
  8. 8. The semiconductor device according to claim 1, wherein the second chamber is provided inside the first chamber, and wherein a cavity wall of the second chamber is constituted only by the heat conductive member; or, the second chamber is disposed inside the first chamber, and a part of a wall of the second chamber is constituted by the heat conductive member and the other part is constituted by a wall of the processing tank.
  9. 9. A method of operating a semiconductor apparatus, wherein the semiconductor apparatus comprises a processing tank having a heat conducting member disposed therein, the heat conducting member dividing the interior of the processing tank into a first chamber containing a first liquid and a second chamber containing a second liquid, the first and second chambers being respectively in communication with the processing tank, the first chamber comprising a first chamber inlet for introducing a process liquid into the first chamber and a first chamber outlet connected to the processing tank via a first pipe, the first pipe comprising a first water pump, the second chamber comprising a second chamber inlet connected to the processing tank via a second pipe, the second pipe comprising a second water pump, the second chamber outlet for discharging the process liquid, a heater disposed on the first pipe for heating the process liquid within the first pipe to a process temperature, and a process cooling water system disposed within the second chamber for reducing the temperature of the second liquid to the process temperature, The working method comprises the following steps: determining a first temperature of a process fluid within the first conduit; determining a second temperature of the process fluid in the second chamber; Activating the heater in response to the first temperature being below the process temperature, and The process cooling water system is started in response to the second temperature being above the discharge temperature.
  10. 10. The method of operating a semiconductor device as recited in claim 9, further comprising the steps of: Starting the first water pump in response to the condition of changing liquid being met, and In response to the process tank completing the process, activating the second water pump, The liquid changing condition is that the change value of the second temperature in 1 minute is less than 2 ℃, and the process tank does not contain the process liquid.

Description

Semiconductor device and working method thereof Technical Field The application relates to the technical field of semiconductor manufacturing processes, in particular to semiconductor equipment and a working method thereof. Background Wet clean (wet clean) is an indispensable key process step in semiconductor manufacturing. In some situations, the wet cleaning process requires that the temperature of the process liquid be above 80 ℃, so that the process liquid needs to be preheated before entering the process chamber, and the process waste liquid before being discharged after the process is finished is preheated, and a large amount of energy waste exists in the process. Disclosure of Invention The application provides a semiconductor device, which comprises a processing tank, wherein a heat conduction component is arranged in the processing tank, the heat conduction component divides the interior of the processing tank into a first chamber containing first liquid and a second chamber containing second liquid, the first chamber and the second chamber are respectively communicated with the processing tank, the first chamber comprises a first chamber inlet and a first chamber outlet, the first chamber inlet is used for introducing process liquid into the first chamber, the first chamber outlet is connected to the processing tank through a first pipeline, the first pipeline comprises a first water pump, the first water pump enables the process liquid to flow from the first chamber to the processing tank through the first pipeline, the second chamber comprises a second chamber inlet and a second chamber outlet, the second chamber inlet is connected with the processing tank through a second pipeline, the second pipeline comprises a second water pump, and the second water pump enables the process liquid to flow from the processing tank to the second chamber, and the second chamber outlet is used for discharging the process liquid. Optionally, the semiconductor device further comprises a heater disposed on the first pipeline for heating the process liquid in the first pipeline to a process temperature, a first temperature sensor disposed on the first pipeline for detecting the first temperature of the process liquid in the first pipeline, a process cooling water system disposed in the second chamber for reducing the temperature of the process liquid in the second chamber to a discharge temperature, a second temperature sensor disposed in the second chamber for detecting the second temperature of the process liquid in the second chamber, and a controller electrically connected to the heater, the first temperature sensor, the process cooling water system, and the second temperature sensor. Optionally, the controller is configured to activate the heater in response to the first temperature being below the process temperature and to activate the process cooling water system in response to the second temperature being above the discharge temperature. Optionally, the discharge temperature is 20-60 ℃, and the process temperature is 80-120 ℃. Optionally, the controller is further electrically connected to the first water pump and the second water pump. Optionally, the controller is further configured to activate the first water pump in response to a change condition being met, and to activate the second water pump in response to the process tank completing a process. Optionally, the liquid change condition is that the change value of the second temperature in 1 minute is less than 2 ℃, and the process tank does not contain the process liquid. Optionally, the second chamber is arranged inside the first chamber, and the cavity wall of the second chamber is only formed by the heat conducting component, or the second chamber is arranged inside the first chamber, and one part of the cavity wall of the second chamber is formed by the heat conducting component, and the other part of the cavity wall of the second chamber is formed by the wall of the treatment tank. In another aspect, the application also provides a method of operating a semiconductor device comprising a processing tank having a thermally conductive member disposed therein, the thermally conductive member dividing the interior of the processing tank into a first chamber containing a first liquid and a second chamber containing a second liquid, the first and second chambers respectively communicating with the processing tank, the first chamber comprising a first chamber inlet for introducing a process liquid into the first chamber and a first chamber outlet connected to the processing tank via a first conduit, the first conduit comprising a first water pump, the second chamber comprising a second chamber inlet connected to the processing tank via a second conduit, the second conduit comprising a second water pump, the second chamber outlet for discharging the process liquid, a heater disposed on the first conduit for heating the process liquid within the first condu