CN-122028676-A - Dicing apparatus and wafer processing method

Abstract

The invention provides a dicing device and a wafer processing method, which can reduce the influence of a protective film on a dicing process and can also inhibit the increase of processing cost. The dicing device includes a dicing section that dice a wafer having a water-insoluble protective film on a surface thereof, an ultraviolet irradiation section that irradiates the protective film diced by the dicing section with ultraviolet light to denature the protective film into water-soluble protective film, and a cleaning section that cleans the protective film denatured into water-soluble protective film to remove the protective film from the wafer.

Inventors

• SHIMIZU TSUBASA

Assignees

• 株式会社东京精密

Dates

Publication Date

20260512

Application Date

20251030

Priority Date

20241107

Claims (8)

1. 1. A dicing device is provided with a dicing unit that dice a wafer having a water-insoluble protective film on the surface, an ultraviolet irradiation unit that irradiates the protective film diced by the dicing unit with ultraviolet light to modify the protective film to be water-soluble, and a cleaning unit that cleans the protective film modified to be water-soluble to remove the protective film from the wafer.
2. 2. The cutting device of claim 1, wherein, The ultraviolet irradiation section is configured to be movable to a position facing a cleaning table of the cleaning section and irradiates a surface of the wafer conveyed to the cleaning section with ultraviolet rays.
3. 3. The cutting device of claim 1, wherein, The dicing apparatus includes a first conveying mechanism that conveys the wafer to the dicing section, and a second conveying mechanism that conveys the wafer from the dicing section to the cleaning section.
4. 4. The cutting device according to claim 3, wherein, The ultraviolet irradiation unit is mounted on the second conveying mechanism.
5. 5. A method for processing a wafer, comprising a step of attaching a water-insoluble protective film to the surface of a wafer, a step of dicing the wafer to which the protective film is attached, a step of irradiating the protective film with ultraviolet rays to denature the protective film into water-soluble form, and a step of cleaning the protective film denatured into water-soluble form to remove the protective film from the wafer.
6. 6. The process according to claim 5, wherein, The wafer is cleaned between the dicing and the irradiation of the ultraviolet rays to remove the chips.
7. 7. A process according to claim 5 or 6, wherein, The ultraviolet irradiation part is moved to a position opposite to a cleaning table of the cleaning part, and irradiates the surface of the wafer conveyed to the cleaning part with ultraviolet rays to the protective film.
8. 8. A process according to claim 5 or 6, wherein, The wafer is transported to a dicing section where the dicing is performed by a first transport arm, and the wafer is transported from the dicing section to a cleaning section by a second transport arm.

Description

Dicing apparatus and wafer processing method Technical Field The invention relates to a dicing apparatus and a wafer processing method. Background In the semiconductor manufacturing process, a dicing apparatus that cuts a semiconductor wafer in units of chips is used (for example, see patent document 1). The dicing apparatus has a blade rotating at a high speed, and cuts the wafer by moving the blade along the streets. The semiconductor wafer cut out in the chip unit is transferred to a cleaning section thereof, cleaned, and then returned to the cassette. In the cutting step of the dicing apparatus, it is necessary to apply a protective film to the surface of the semiconductor wafer so as not to expose the surface of the semiconductor wafer, in order to prevent the chips from adhering to the surface of the semiconductor wafer. As the protective film at this time, there are a water-soluble protective film and a water-insoluble protective film. In the method of applying the water-soluble protective film, it is necessary to apply the water-soluble protective film thickly so as not to cause the surface of the semiconductor wafer to be exposed by dissolution of the water-soluble protective film during the cutting process. Such a thick protective film may affect the accuracy of the cutting process. On the other hand, the method of applying the water-insoluble protective film can make the film thickness smaller than the water-soluble protective film, but requires a cleaning process with a special chemical solution after the cutting process is completed. The cleaning process using a special chemical solution has a problem that the processing cost increases and the size of the cutting device increases. [ Prior Art literature ] [ Patent literature ] [ Patent document 1] Japanese patent laid-open No. 11-102966 Disclosure of Invention Technical problem to be solved by the invention The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a dicing apparatus and a wafer processing method that can reduce the influence of a protective film on a dicing process and can also suppress an increase in processing cost. Technical scheme for solving problems The dicing device includes a dicing section that dice a wafer having a water-insoluble protective film on a surface thereof, an ultraviolet irradiation section that irradiates the protective film diced by the dicing section with ultraviolet light to modify the protective film to be water-soluble, and a cleaning section that cleans the protective film modified to be water-soluble to remove the protective film from the wafer. The method for processing a wafer comprises a step of attaching a water-insoluble protective film to the surface of the wafer, a step of dicing the wafer to which the protective film is attached, a step of irradiating the protective film with ultraviolet rays to denature the protective film into water-soluble form, and a step of cleaning the protective film denatured into water-soluble form to remove the protective film from the wafer. Effects of the invention According to the present invention, it is possible to provide a dicing apparatus and a wafer processing method that reduce the influence of a protective film on a dicing process and also suppress an increase in processing cost. Drawings Fig. 1A is an external perspective view of a cutting device 1 of the first embodiment. Fig. 1B is a schematic diagram illustrating an internal structure of the cutting device 1 of the first embodiment. Fig. 2 illustrates an example of the structure of the cleaning unit 17. Fig. 3 illustrates an example of the protective film 31 formed in a roll shape. Fig. 4 illustrates a sequence of processing the wafer W using the dicing apparatus 1. Fig. 5 illustrates a sequence of processing the wafer W using the dicing apparatus 1. Fig. 6 is a perspective view of the cutting device 1 of the second embodiment. Fig. 7 is a perspective view of the second conveying mechanism 14 in a state of holding the UV illumination section 18A. Fig. 8 is a perspective view of the second conveying mechanism 14 in a state of holding the UV illumination section 18B. Detailed Description The present embodiment will be described below with reference to the drawings. While the drawings illustrate embodiments in accordance with the principles of the present disclosure, the embodiments are merely for the purpose of understanding the present disclosure and are in no way intended to be limiting. The description of the present specification is merely a typical example, and does not limit the claims or application examples of the present disclosure in any way. In the present embodiment, the present disclosure has been described in sufficient detail for a person skilled in the art to practice the present disclosure, but other mounting and modes are possible, and it is to be understood that the composition, structure, and substitution of va