CN-122028680-A - Glue pouring device, semiconductor device and thickness detection method

Abstract

The glue punching device comprises one or more glue punching platforms, a glue punching mechanism, one or more thickness detection components and a thickness detection component, wherein the glue punching platform is used for bearing a chip product area of a packaged structure after plastic packaging, the glue punching mechanism is arranged above the glue punching platform and comprises a pressing assembly, the pressing assembly is used for fixing the edge of the chip product area of the packaged structure borne on the glue punching platform, and the thickness detection component is fixedly connected with the glue punching mechanism or the glue punching platform and is used for obtaining the thickness of the chip product area. The embodiment of the invention can enable the thickness detection component to detect the thickness of the chip product area of the packaging structure under the condition of low warp curvature of the packaging structure, thereby being beneficial to reducing the influence of the warp curvature on the thickness detection result, further improving the accuracy of the thickness detection result of the chip product area and correspondingly improving the accuracy of the thickness detection result of the packaging structure.

Inventors

• CHEN LANGLANG
• REN YU
• JIN HUIXIANG

Assignees

• 长电科技(江阴)有限公司

Dates

Publication Date

20260512

Application Date

20260210

Claims (20)

1. 1. A glue dispensing apparatus comprising: one or more glue punching platforms for bearing the chip product area of the encapsulated structure after plastic encapsulation; The glue pouring mechanism is arranged above the glue pouring platform and comprises a pressing assembly, and the pressing assembly is used for fixing the edge of the chip product area of the packaging structure borne on the glue pouring platform; and the thickness detection parts are fixedly connected with the glue injecting mechanism or the glue injecting platform and are used for acquiring the thickness of the chip product area.
2. 2. The glue dispensing apparatus of claim 1, wherein one end of the thickness detection member has a detection probe positioned above the glue dispensing platform and oriented toward the chip product area, the detection probe being fixedly mounted to the press assembly.
3. 3. The adhesive dispensing apparatus of claim 2, wherein the compression assembly comprises gate cutting platens in one-to-one correspondence with the adhesive dispensing platforms, the gate cutting platens comprising a platen body comprising a first face and a second face disposed opposite one another, the first face facing the adhesive dispensing platform; The detection probe is fixedly arranged on the pressing plate body at the side part of the protruding part.
4. 4. A glue dispensing apparatus as defined in claim 3 wherein said platen body of said boss side portion has a mounting hole therethrough; The detection probe passes through the mounting hole so as to be exposed on the first face of the boss side portion, and the other end of the thickness detection member is fixedly mounted on the second face.
5. 5. A glue dispensing apparatus as claimed in claim 3 or 4, wherein the thickness detection means is a contact displacement sensor and the detection probes of the thickness detection means are located directly above the corresponding positions to be detected.
6. 6. The glue dispensing apparatus of claim 5, wherein the detection probe protrudes from a surface of the boss.
7. 7. The adhesive dispensing device of claim 1, wherein the number of thickness detection members is plural and is adapted to detect plural locations of the same chip product area.
8. 8. A glue dispensing apparatus as claimed in claim 2, wherein the detection probes of the thickness detection means are located directly above the corresponding positions to be detected.
9. 9. The adhesive dispensing device of claim 8 wherein a plurality of said thickness sensing members are located directly above any one of said adhesive dispensing platforms, and wherein among said plurality of thickness sensing members directly above any one of said adhesive dispensing platforms, the projected pattern of said sensing probe of at least one of said thickness sensing members is located in a central region of said adhesive dispensing platform to obtain the thickness of the central region in said chip product area, and the projected pattern of said sensing probe of at least one of said thickness sensing members is located in a region proximate to the edge of said adhesive dispensing platform to obtain the thickness of the region proximate to the edge in said chip product area.
10. 10. The paste ejection apparatus according to claim 9, wherein among the plurality of thickness detection members directly above any one of the paste ejection platforms, a projected pattern of the detection probe of one of the thickness detection members is located in a central region of the paste ejection platform, and projected patterns of the detection probes of the remaining plurality of thickness detection members are located in a region near an edge of the paste ejection platform.
11. 11. The glue dispensing apparatus of claim 10 wherein the glue dispensing platform is rectangular in shape; The number of the thickness detection parts right above any one of the glue pouring platforms is 5, the projection patterns of the detection probes of one of the thickness detection parts are located in the central area of the glue pouring platform, the projection patterns of the detection probes of the other four thickness detection parts are in one-to-one correspondence with the top angles of the glue pouring platform, and the projection patterns are located in areas close to the top angles of the glue pouring platform respectively.
12. 12. The apparatus of claim 1, further comprising a cooling mechanism mounted above the dispensing platform and fixedly coupled to the pressing assembly.
13. 13. The adhesive dispensing device of claim 1, further comprising a controller coupled to the thickness detection member.
14. 14. The glue dispensing apparatus of claim 13, wherein the controller is further coupled to a statistical process control system; Or alternatively The glue device also comprises an indication component which is coupled with the controller.
15. 15. The glue dispensing apparatus of claim 14, wherein in the case where the glue dispensing apparatus further comprises an indicator member, the indicator member comprises one or both of an indicator light and a buzzer.
16. 16. A semiconductor packaging apparatus comprising the paste ejection device of any one of claims 1 to 15.
17. 17. A thickness detection method, comprising: providing a glue dispensing device according to any one of claims 1-16; Providing a packaging structure after plastic packaging, and placing the packaging structure on a glue punching platform of the glue punching device; fixing the edge of the chip product area carried by the glue-pouring platform through the pressing assembly; and after the edge of the chip product area is fixed, detecting the thickness of the chip product area through the thickness detection component so as to obtain the thickness of the chip product area.
18. 18. The thickness detection method according to claim 17, wherein the step of performing thickness detection on the chip product region by the thickness detection means to obtain the thickness of the chip product region comprises: Detecting the thickness of the chip product area through the thickness detection component to obtain a detection result; performing data processing on the detection result to obtain the thickness of the chip product area; Or alternatively The step of detecting the thickness of the chip product region by the thickness detecting means to obtain the thickness of the chip product region includes: And detecting the thickness of the chip product area through the thickness detection component to obtain a detection result, wherein the detection result is the thickness of the chip product area.
19. 19. The method of thickness inspection according to claim 18, wherein in the step of providing the paste ejection apparatus, the pressing assembly includes a gate-cutting platen including a platen body including a first face and a second face disposed opposite to each other, the first face facing the paste ejection stage, and a convex portion on an edge region of the first face for pressing an edge of the chip product region of the package structure carried by the paste ejection stage, the thickness inspection member is a contact displacement sensor, an inspection probe of the thickness inspection member is located directly above a corresponding position to be inspected, one end of the thickness inspection member has an inspection probe located above the paste ejection stage and facing the chip product region, and the inspection probe is fixedly mounted on the platen body on a side of the convex portion; In the step of providing the encapsulated structure, the encapsulated structure comprises a lead frame and a plastic encapsulation body positioned on the lead frame, wherein the plastic encapsulation body exposes the edge of the lead frame; in the step of fixing the edge of the chip product area carried by the glue-punching platform, the protruding part is pressed and exposed out of the lead frame of the plastic package colloid; Acquiring the height difference between the bottom of the detection probe and the surface of the protruding part, wherein the height difference is a negative value when the detection probe protrudes out of the surface of the protruding part, is a positive value when the detection probe is trapped in the surface of the protruding part, and is zero when the bottom of the detection probe is flush with the surface of the protruding part; In the step of obtaining the detection result, the thickness of the plastic package colloid is obtained; The step of processing the detection result to obtain the thickness of the chip product area comprises the steps of adding the thickness of the lead frame, the displacement distance of the detection probe and the height difference, and taking the sum as the thickness of the chip product area.
20. 20. The thickness detection method according to claim 19, wherein in the step of providing the paste ejection device, the detection probe protrudes from a surface of the protruding portion; in the step of obtaining the height difference, the height difference is a negative value.

Description

Glue pouring device, semiconductor device and thickness detection method Technical Field The embodiment of the invention relates to the field of semiconductor manufacturing, in particular to a glue punching device, semiconductor equipment and a thickness detection method. Background Along with the development of electronic products, the importance of packaging technology is increasing, and electronic components are packaged by plastic packaging colloid (such as epoxy resin and other organic glue) so as to protect the electronic components and reduce the probability of oxidation or corrosion of the electronic components. In addition, in order to ensure the reliability of the chip product, each parameter of the packaging structure needs to be detected in the packaging process. However, the current method for inspecting the package structure still needs to be improved. Disclosure of Invention The embodiment of the invention provides a glue injecting device, semiconductor equipment and a thickness detection method, so as to improve the accuracy of a thickness detection result of a packaging structure. In order to solve the problems, the embodiment of the invention provides a glue pouring device which comprises one or more glue pouring platforms, a glue pouring mechanism, one or more thickness detection components and one or more thickness detection components, wherein the glue pouring platforms are used for bearing chip product areas of a packaged structure after plastic packaging, the glue pouring mechanism is arranged above the glue pouring platforms and comprises a pressing assembly, the pressing assembly is used for fixing edges of the chip product areas of the packaged structure borne on the glue pouring platforms, and the thickness detection components are fixedly connected with the glue pouring mechanism or the glue pouring platforms and are used for obtaining the thickness of the chip product areas. Optionally, one end of the thickness detecting component is provided with a detecting probe located above the glue injecting platform and facing the chip product area, and the detecting probe is fixedly installed on the pressing assembly. The pressing assembly comprises gate cutting pressing plates which are in one-to-one correspondence with the glue flushing platforms, the gate cutting pressing plates comprise pressing plate bodies, protruding portions and detection probes, the pressing plate bodies comprise first faces and second faces which are arranged in a back-to-back mode, the first faces face the glue flushing platforms, the protruding portions are located on edge areas of the first faces and used for pressing edges of chip product areas borne on the glue flushing platforms, and the detection probes are fixedly mounted on the pressing plate bodies on the side portions of the protruding portions. Optionally, the pressing plate body at the side of the protruding part is provided with a mounting hole penetrating through the pressing plate body, the detection probe penetrates through the mounting hole to be exposed on the first face of the side of the protruding part, and the other end of the thickness detection component is fixedly mounted on the second face. Optionally, the thickness detection component is a contact displacement sensor, and the detection probe of the thickness detection component is located right above the corresponding position to be detected. Optionally, the detection probe protrudes from the surface of the protruding portion. Optionally, the number of the thickness detecting parts is plural, and the thickness detecting parts are used for detecting plural positions of the same chip product area. Optionally, the detection probe of the thickness detection component is located directly above a corresponding position to be detected. Optionally, a plurality of thickness detection components are arranged right above any one of the glue injecting platforms, and among the plurality of thickness detection components right above any one of the glue injecting platforms, the projection pattern of the detection probe of at least one of the thickness detection components is located in the central area of the glue injecting platform to obtain the thickness of the central area in the chip product area, and the projection pattern of the detection probe of at least one of the thickness detection components is located in the area close to the edge of the glue injecting platform to obtain the thickness of the area close to the edge in the chip product area. Optionally, in the plurality of thickness detection components directly above any one of the glue dispensing platforms, a projection pattern of the detection probe of one of the thickness detection components is located in a central area of the glue dispensing platform, and projection patterns of the detection probes of the other plurality of thickness detection components are located in an area close to an edge of the glue dispensing platform. Optio