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CN-122028681-A - Electronic component mounting apparatus

CN122028681ACN 122028681 ACN122028681 ACN 122028681ACN-122028681-A

Abstract

The invention provides an electronic component mounting device, which can reduce the possibility of transverse rotation of electronic components mounted on a tray and remove a protective sheet covering the tray. The electronic component mounting apparatus includes a supply unit for holding a plurality of trays on which electronic components and protective sheets covering the electronic components are placed in a stacked state, a stage for receiving the trays one by one from below the supply unit and conveying the trays from the supply unit to a position where the electronic components are picked up, a head for picking up the electronic components placed on the trays at the position where the electronic components are picked up, a press-bonding unit for receiving the electronic components from the head and press-bonding the electronic components to a substrate, and a removing unit provided on a path of the stage for conveying the trays from the supply unit to the position where the electronic components are picked up and removing the protective sheets from the conveyed trays.

Inventors

  • Hirose just Guyana

Assignees

  • 芝浦机械电子装置株式会社

Dates

Publication Date
20260512
Application Date
20221014
Priority Date
20211028

Claims (9)

  1. 1. An electronic component mounting apparatus comprising: a supply unit that holds a plurality of trays on which electronic components are mounted and which cover protective sheets for the electronic components in a stacked state; A stage that receives the trays one by one from below the supply unit and conveys the trays from the supply unit to a position where the electronic components are picked up; A head for picking up the electronic parts mounted on the tray at a position for picking up the electronic parts; a crimping part that receives the electronic part from the head and crimps the electronic part to a substrate; A removing part arranged on a path of the tray from the supplying part to the position of picking up the electronic parts, for removing the protective sheet from the tray conveyed by the supplying part, and And a sheet detection unit that is provided between the supply unit and the removal unit on the path and detects the protective sheet on the tray that moves in the horizontal direction.
  2. 2. The electronic component mounting apparatus according to claim 1, further comprising a removal detecting portion provided between the removing portion and a position where the electronic component is picked up on the path, and detecting whether the protective sheet is removed.
  3. 3. The electronic component mounting apparatus according to claim 1, wherein The removing part is an adsorption part for adsorbing and holding the protective sheet by negative pressure.
  4. 4. The electronic component mounting apparatus according to claim 3, wherein The suction part approaches the protective sheet and stops at a predetermined height to generate negative pressure.
  5. 5. The electronic component mounting apparatus according to claim 3, wherein The suction part is close to the protective sheet while generating negative pressure.
  6. 6. The electronic component mounting apparatus according to any one of claims 3 to 5, further comprising: A recovery box for recovering the protection sheet, The recovery box is arranged right below the adsorption part.
  7. 7. The electronic component mounting apparatus according to claim 1, wherein The removing portion is an adhesive portion for adhesively holding the protective sheet by an adhesive sheet.
  8. 8. The electronic component mounting apparatus according to claim 1, wherein The removing part is an air flow generating part for removing the protective sheet by air flow.
  9. 9. The electronic component mounting apparatus according to claim 1, wherein The removing portion is a chuck portion for removing the protective sheet.

Description

Electronic component mounting apparatus The application is a divisional application of the original application number 202211258961.3, the application day 2022, the 10 th month 14 th day, and the name of the application is an electronic component mounting device. Technical Field The present invention relates to an electronic component mounting apparatus. Background In the manufacturing process of a display panel constituting a display device such as a liquid crystal display, there is a process of mounting chip-shaped electronic components such as a driving integrated circuit (INTEGRATED CIRCUIT, IC) on a glass substrate constituting the display panel. Such mounting is called Chip On Glass (COG) mounting, and in COG mounting, an electronic component mounting apparatus called COG mounting apparatus is used. The supply unit for electronic components in the COG mounting device is configured by stacking a plurality of trays for accommodating electronic components. Specifically, a plurality of trays containing electronic components are stacked in a groove formed in an upper surface of the tray. In addition, in the stacked trays, a protective sheet such as protective paper for protecting electronic components may be present between the trays. The protective sheet is a hindrance when picking up electronic parts, and therefore requires a step of removing stacked trays layer by layer and removing them one by a human hand. Thereafter, the trays are stacked again to serve as a supply portion for the electronic parts. In such a step of removing the protective sheet, the electronic component may be damaged by the vibration generated by contact with the tray, or the tray may be turned upside down, and the electronic component may be lost, because the electronic component may be turned inside the groove. In order to solve such problems, it is studied to mechanically remove the protective sheet at the time of picking up the electronic parts, instead of removing the protective sheet by using a human hand in advance. For example, as shown in patent document 1, first, a protective sheet of a tray placed on the uppermost layer is removed by vacuum suction, and then, electronic components accommodated in the tray are picked up in sequence. In addition, when the uppermost tray becomes empty, the empty tray is picked up and removed. Then, the stacked trays are lifted up, the protective sheet placed on the next-layer tray is removed, and the electronic parts accommodated in the trays are picked up in sequence. This pick-up continues until all of the trays are empty. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 9-55598 Disclosure of Invention Problems to be solved by the invention However, in the uppermost layer of the stacked trays, there are cases where the height position of the upper surface thereof is deviated or the upper surface thereof is inclined due to the skew of each tray or the accumulation of dimensional errors. In this case, the height position at which the electronic component is picked up may be unstable, and the electronic component may not be picked up, or may not be sufficiently held even if the electronic component may be picked up, and may fall down during conveyance, resulting in loss of the electronic component. In addition, the removing portion such as the suction nozzle lowered to remove the protective sheet collides with the upper surface of the tray, and the electronic component is turned inside the groove due to the vibration generated at this time, which may cause a trouble in pickup. The invention provides an electronic component mounting device, which can reliably pick up electronic components mounted on a tray and remove a protective sheet covering the tray. Technical means for solving the problems In order to achieve the above object, an electronic component mounting apparatus according to the present invention includes a supply unit that holds a plurality of trays on which electronic components and protective sheets covering the electronic components are stacked, a stage that receives the trays one by one from below the supply unit and conveys the trays from the supply unit to a position where the electronic components are picked up, a head that picks up the electronic components mounted on the trays at the position where the electronic components are picked up, a pressure-bonding unit that receives the electronic components from the head and pressure-bonds the electronic components to a substrate, and a removal unit that is provided on a path of the stage that conveys the trays from the supply unit to the position where the electronic components are picked up, and that removes the protective sheets from the tray that is conveyed. ADVANTAGEOUS EFFECTS OF INVENTION The invention can reliably pick up the electronic parts mounted on the tray and remove the protective sheet covering the tray. Drawings Fig. 1 is a perspective view showing a tray suitable for use