Search

CN-122028688-A - Silicon wafer taking and placing mechanism and guide wafer system

CN122028688ACN 122028688 ACN122028688 ACN 122028688ACN-122028688-A

Abstract

The application relates to a silicon wafer taking and placing mechanism and a guide piece system, wherein the silicon wafer taking and placing mechanism comprises a pulling and inserting part, a buffer part, a first lifting part and a moving part, the pulling and inserting part comprises two pulling and inserting rods which are arranged in parallel along a first direction, the pulling and inserting part is provided with a first bearing part and a second bearing part which are arranged along a second direction, the first direction is vertical to the second direction, the pulling and inserting part can reciprocate along the second direction under the driving of the moving part, the first bearing part and the second bearing part can respectively move to the buffer part, and the pulling and inserting part can lift under the action of the first lifting part so that a silicon wafer positioned at the first bearing part falls on the buffer part or the second bearing part jacks up the silicon wafer positioned at the buffer part. The silicon wafers can be rapidly taken out from the flower basket one by one through the silicon wafer taking and placing mechanism, so that the production efficiency is improved.

Inventors

  • YANG SHIMENG
  • LI HAISHENG
  • SONG GUANGHUA

Assignees

  • 江苏微导纳米科技股份有限公司

Dates

Publication Date
20260512
Application Date
20260213

Claims (13)

  1. 1. The silicon wafer taking and placing mechanism is characterized by comprising a pulling and inserting part (1), a buffer part (2), a first lifting part (3) and a moving part (4), wherein the pulling and inserting part (1) comprises two pulling and inserting rods (11) which are arranged in parallel along a first direction, the pulling and inserting part (1) is provided with a first bearing part (12) and a second bearing part (13) which are arranged along a second direction, and the first direction and the second direction are perpendicular; The drawing and inserting part (1) can reciprocate along the second direction under the drive of the moving part (4), so that the first bearing part (12) and the second bearing part (13) respectively move to the buffer part (2); The pulling and inserting part (1) can be lifted under the action of the first lifting part (3) so as to enable the silicon wafer (6) positioned on the first bearing part (12) to fall on the buffer part (2) or enable the second bearing part (13) to jack up the silicon wafer (6) positioned on the buffer part (2).
  2. 2. The silicon wafer picking and placing mechanism according to claim 1, wherein the first receiving part (12) and the second receiving part (13) respectively comprise a first protrusion (14) arranged at the top of the inserting rod (11), and the distance between the first protrusions (14) of the two inserting rods (11) is gradually reduced from top to bottom.
  3. 3. The silicon wafer pick-and-place mechanism according to claim 2, wherein opposite side wall surfaces of the first protrusions (14) of the two pull-and-insert rods (11) are inclined surfaces or curved surfaces so as to be in line contact with the silicon wafer (6).
  4. 4. A silicon wafer picking and placing mechanism according to any one of claims 1-3, wherein the buffer portion (2) comprises two groups of second protrusions (21) spaced along the second direction, the intervals between the two groups of second protrusions (21) along the first direction are gradually reduced from top to bottom, and a buffer area for placing the silicon wafer (6) is formed by enclosing the two groups of second protrusions (21).
  5. 5. The silicon wafer pick-and-place mechanism according to claim 4, wherein the second protrusions (21) are cone-shaped cylinders, or two groups of second protrusions (21) are provided with cone edges on opposite side wall surfaces along the first direction respectively so as to be in point contact with the silicon wafer (6).
  6. 6. The silicon wafer pick-and-place mechanism according to claim 4, further comprising a regulating portion (5), wherein the regulating portion (5) is provided with a driving member (51) and two pushing members (52), the two pushing members (52) are arranged at intervals along a first direction and located right above the buffer station, and the driving member (51) is used for driving the two pushing members (52) to approach or separate from each other.
  7. 7. The silicon wafer pick-and-place mechanism according to claim 4, wherein the buffer portion (2) is further provided with a first mounting groove (22) arranged in the first direction, and the second protrusion (21) is slidable and fixed along the first mounting groove (22).
  8. 8. A wafer guiding system, characterized by comprising a conveying part (8) and a silicon wafer picking and placing mechanism as claimed in any one of claims 1-7, wherein the silicon wafer picking and placing mechanism is arranged between a flower basket (7) and the conveying part (8); The moving part (4) drives the drawing and inserting part (1) to move to a first state, the first bearing part (12) is positioned on the flower basket (7) and is used for taking out the silicon chip (6) positioned on the flower basket (7), and the second bearing part (13) is positioned on the buffer part (2); When the moving part (4) moves the drawing and inserting part (1) to a second state, the first bearing part (12) is positioned at the buffer part (2), and the second bearing part (13) is positioned at the conveying part (8).
  9. 9. Guide system according to claim 8, characterized in that the conveying part (8) is provided with a plurality of carrying parts (81) for carrying the silicon wafers (6) at intervals along the first direction, two groups of third protrusions (82) are provided above the carrying parts (81) at intervals along the second direction, the distance between the two groups of third protrusions (82) is gradually reduced from top to bottom, and a carrying area is formed between the two groups of third protrusions (82).
  10. 10. The guide vane system according to claim 9, characterized in that the third projection (82) comprises a first section (821) and a second section (822) arranged in the height direction, the second section (822) being fixed to the conveying section (8), the first section (821) being provided with a first contact surface, the second section (822) being provided with a second contact surface, the first contact surface having a slope that is greater than the slope of the second contact surface.
  11. 11. The guide vane system according to claim 9, characterized in that the carrying area is further provided with a flexible support protrusion (84), the height of the flexible support protrusion (84) being not higher than the height of the third protrusion (82).
  12. 12. The guide system according to claim 8, further comprising a lifting mechanism (9), wherein the lifting mechanism (9) comprises a second lifting portion (91) and a positioning portion (92), the positioning portion (92) comprises two lifting members (922) arranged in parallel along a first direction, the two lifting members (922) are respectively located at two sides of the conveying portion, and the second lifting portion (91) is used for driving the positioning portion (92) to lift; the positioning part (92) comprises two jacking pieces (922) which are arranged in parallel along a first direction, the two jacking pieces (922) are respectively positioned at two sides of the conveying part (8), the positioning part (92) is provided with at least one positioning area which is arranged along a second direction, and the positioning area is arranged corresponding to the bearing area.
  13. 13. The guide vane system according to claim 12, wherein the positioning area is provided with positioning projections (93) on both sides in the first direction and on both sides in the second direction, respectively, the spacing between the positioning projections (93) on both sides in the first direction is gradually reduced from top to bottom, and the spacing between the positioning projections (93) on both sides in the second direction is gradually reduced from top to bottom.

Description

Silicon wafer taking and placing mechanism and guide wafer system Technical Field The application relates to the technical field of photovoltaics, in particular to a silicon wafer taking and placing mechanism and a wafer guiding system. Background In the mass production process of electronic components such as photovoltaic cells, semiconductor chips and the like, a silicon wafer is used as a core substrate, and the continuity and the high efficiency of a transmission flow directly determine the productivity and the manufacturing cost of the whole production line. One of the key links of silicon wafer transmission is to take out the silicon wafers stored in the flower basket one by one and accurately and stably convey the silicon wafers to the next processing station (such as cleaning, texturing, coating, photoetching and the like), and how to quickly take out the silicon wafers from the flower basket one by one so as to improve the production efficiency is a technical problem which needs to be solved by a person skilled in the art. Disclosure of Invention The application aims to provide a silicon wafer taking and placing mechanism and a wafer guiding system, which can rapidly take silicon wafers out of flower baskets one by one so as to improve production efficiency. The application provides a silicon wafer picking and placing mechanism which comprises a pulling and inserting part, a buffer part, a first lifting part and a moving part, wherein the pulling and inserting part comprises two pulling and inserting rods which are arranged in parallel along a first direction, the pulling and inserting part is provided with a first bearing part and a second bearing part which are arranged along a second direction, the first direction is perpendicular to the second direction, the pulling and inserting part can reciprocate along the second direction under the driving of the moving part, the first bearing part and the second bearing part can respectively move to the buffer part, and the pulling and inserting part can lift under the action of the first lifting part, so that a silicon wafer positioned in the first bearing part falls in the buffer part, or the second bearing part can jack up the silicon wafer positioned in the buffer part. Optionally, the first receiving portion and the second receiving portion respectively include a first protrusion disposed at the top of the insertion rod, and a distance between the first protrusions of the two insertion rods is gradually reduced from top to bottom. Optionally, a side wall surface of the two pull-plug rods opposite to the first protrusions is an inclined surface or a curved surface so as to be in line contact with the silicon wafer. Optionally, the buffer portion includes two groups of second protrusions arranged at intervals along the second direction, the intervals between the two groups of second protrusions along the first direction are gradually reduced from top to bottom, and a buffer area for placing the silicon wafer is formed by enclosing the two groups of second protrusions. Optionally, the second protrusions are cone cylinders, or two groups of opposite side wall surfaces of the second protrusions along the first direction are respectively provided with cone ribs so as to be in point contact with the silicon wafer. Optionally, the device further comprises a regulation part, wherein the regulation part is provided with a driving piece and two pushing pieces, the two pushing pieces are arranged at intervals along a first direction and are positioned right above the buffer station, and the driving piece is used for driving the two pushing pieces to be close to or far away from each other. Optionally, the buffer portion is further provided with a first mounting groove arranged along the first direction, and the second protrusion is capable of sliding along and being fixed to the first mounting groove. The application further provides a guide piece system which comprises a conveying part and the silicon wafer taking and placing mechanism, wherein the silicon wafer taking and placing mechanism is arranged between the flower basket and the conveying part, the moving part drives the drawing and inserting part to move to a first state, the first bearing part is positioned on the flower basket and is used for taking out the silicon wafer positioned on the flower basket, the second bearing part is positioned on the buffer part, and the moving part moves the drawing and inserting part to move to a second state, the first bearing part is positioned on the buffer part, and the second bearing part is positioned on the conveying part. Optionally, the conveying part is provided with a plurality of bearing parts for bearing the silicon wafer at intervals along the first direction, two groups of third protrusions are arranged above the bearing parts at intervals along the second direction, the intervals between the two groups of third protrusions are gradually reduced from top