CN-122028689-A - Go up unloading sorting device and semiconductor processing system

CN122028689ACN 122028689 ACN122028689 ACN 122028689ACN-122028689-A

Abstract

The invention relates to the technical field of semiconductor processing equipment, in particular to a loading and unloading sorting device and a semiconductor processing system, wherein the loading and unloading sorting device comprises a bearing assembly, a sorting and transferring assembly and a first carrying assembly; the bearing assembly comprises a first bearing table and a second bearing table, wherein the first bearing table is used for bearing a workpiece to be processed, and the second bearing table is used for bearing the workpiece processed by the semiconductor processing equipment. By independently carrying the first bearing table and the second bearing table of the bearing assembly, the sorting and transferring assembly and the first carrying assembly, the blanking process can be synchronously executed without waiting when the feeding process is in progress, and vice versa. The waiting time in the operation of the traditional feeding and discharging sorting device is effectively shortened, and the overall working efficiency and the equipment productivity of the semiconductor processing system are remarkably improved.

Inventors

ZHAN ZHIGANG
CHEN QIANG
Wu Hongbai
LI YUAN
LIU JIAMENG
LONG HAO
LI JIABIN

Assignees

沈阳和研科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260323

Claims (14)

1. The utility model provides a go up unloading sorting device, its characterized in that is applied to semiconductor processing system, semiconductor processing system includes semiconductor processing equipment, go up unloading sorting device includes: the bearing assembly comprises a first bearing table and a second bearing table, the first bearing table is used for bearing a workpiece to be processed, and the second bearing table is used for bearing the workpiece processed by the semiconductor processing equipment; The sorting and transferring assembly is arranged close to the semiconductor processing equipment and the bearing assembly and is used for sorting and transferring the workpieces on the first bearing table to processing positions corresponding to the semiconductor processing equipment and/or sorting and transferring the workpieces processed by the semiconductor processing equipment to the second bearing table; the first carrying assembly is used for carrying the workpiece to be processed onto the first bearing table and/or carrying the workpiece processed by the semiconductor processing equipment on the second bearing table into a material box positioned at a blanking position.
2. The loading and unloading sorting device of claim 1, wherein a plurality of first negative pressure holes which are mutually communicated are arranged on a processing position of the semiconductor processing equipment, and the sorting and transferring assembly comprises: The material receiving mobile disc is movably arranged on one side of the semiconductor processing equipment and is provided with a feeding position and a discharging position, and the material receiving mobile disc positioned at the feeding position is used for receiving a workpiece which is transported by a fifth carrying arm in the semiconductor processing equipment and processed by the semiconductor processing equipment; the placing disc is arranged between the semiconductor processing equipment and the bearing component and used for bearing the workpiece to be processed; The second carrying assembly is used for correspondingly transferring each workpiece on the first bearing table to the placing plate and/or transferring the workpiece on the receiving moving plate positioned at the unloading position to the second bearing table; The third carrying assembly is arranged on one side of the semiconductor processing equipment and is used for transferring the workpieces on the placing plate to the position above the first negative pressure hole on the processing position of the semiconductor processing equipment so that the workpieces are adsorbed on the corresponding processing position of the semiconductor processing equipment.
3. The loading and unloading sorting device of claim 2, wherein the carrier assembly further comprises: a third bearing table for bearing the replacement part; The second carrying assembly is further used for transferring the replacement parts on the third carrying platform to the placing tray when the number of the workpieces on the first carrying platform is smaller than that of the first negative pressure holes, so that the sum of the number of the workpieces and the number of the replacement parts on the placing tray is the same as that of the first negative pressure holes; The third carrying assembly is further used for transferring the replacement piece positioned on the placing disc to the position above the first negative pressure holes in the processing position of the semiconductor processing equipment, so that the upper surface of each first negative pressure hole is covered.
4. A loading and unloading sorting apparatus according to claim 3, wherein: The material receiving movable disc is provided with a plurality of second negative pressure holes which are communicated with each other, and a fifth carrying arm in the semiconductor processing equipment is used for transferring processed workpieces and/or processed substitutes on the processing position of the semiconductor processing equipment to the position above the second negative pressure holes on the material receiving movable disc so that the workpieces and/or the substitutes are adsorbed on the second negative pressure holes.
5. The loading and unloading sorting device of claim 3, wherein the second handling assembly comprises: The first carrying arm is arranged on one side close to the placing disc and is used for transferring the workpiece on the first bearing table and/or the replacement piece on the third bearing table to the placing disc; The first identification unit is arranged on the first carrying arm and is used for detecting the number of the workpieces transferred by the first carrying arm; And the first control unit is arranged on the first carrying arm and is used for determining the target quantity of the first carrying arm for transferring the replacement parts when the first identification unit identifies that the quantity of the workpieces transferred by the first carrying arm is less than the quantity of the first negative pressure holes so as to control the first carrying arm to transfer the replacement parts with the same target quantity onto the placing plate.
6. A loading and unloading sorting apparatus according to claim 3, wherein: The second carrying assembly is further used for placing each workpiece on the first bearing table and/or each replacement piece on the third bearing table on the placing plate at the same position as the first negative pressure hole at the processing position of the semiconductor processing equipment; The third carrying assembly is used for transferring each workpiece and/or each replacement piece positioned on the placing plate to the processing position of the semiconductor processing equipment in a placing posture on the placing plate, so that each workpiece and/or each replacement piece is correspondingly positioned above the first negative pressure hole in the processing position of the semiconductor processing equipment.
7. The loading and unloading sorting device of claim 6, wherein the third handling assembly comprises: An actuating arm and a sucker which are connected with each other, wherein the sucker is used for sucking the workpiece and/or the replacement piece on the placing tray in the placing posture of the workpiece and/or the replacement piece on the placing tray, the actuator arm is configured to move the chuck between being positioned above a processing location of the semiconductor processing apparatus and above the swing plate.
8. The loading and unloading sorting device of claim 6, wherein: The plurality of first negative pressure holes are distributed on the circumference of a target circle taking the axis of the processing position of the semiconductor processing equipment as the center; The swing disc is provided with a plurality of preset bearing areas, the plurality of preset bearing areas are distributed on the circumference of the same circle as the target circle, and the number of the preset bearing areas is the same as that of the first negative pressure holes; The second carrying assembly is further used for placing the workpiece on the first bearing table and/or the replacement piece on the third bearing table on the preset bearing area.
9. The loading and unloading sorting device of claim 8, wherein: Each preset bearing area is provided with a third negative pressure hole, a plurality of third negative pressure holes are communicated with each other, and the second carrying assembly is further used for conveying each workpiece of the first bearing table and/or each replacement piece on the third bearing table to the upper part of the third negative pressure hole on the placing plate so that each workpiece and/or each replacement piece is adsorbed on the preset bearing area.
10. The loading and unloading sorting device of claim 8, wherein the second handling assembly further comprises: The second carrying arm is used for transferring the workpiece on the receiving mobile disc of the unloading station to the second bearing table and/or transferring the replacement piece on the receiving mobile disc of the unloading station to the third bearing table; The second identifying unit is arranged on the second carrying arm and is used for identifying whether the replacing piece is transported on the material receiving movable disc positioned at the unloading station; The second control unit is arranged on the second carrying arm and is used for controlling the second carrying arm to transfer the workpiece onto the second bearing table and controlling the second carrying arm to transfer the replacement piece onto the third bearing table when the second identification unit identifies that the replacement piece is transferred onto the second carrying arm.
11. The loading and unloading sorting device of any one of claims 1 to 10, further comprising: The calibration assembly is arranged close to the bearing assembly and comprises a first calibration part and a second calibration part which are oppositely arranged, the first calibration part is used for calibrating the workpiece to be processed, and the second calibration part is used for calibrating the workpiece processed by the semiconductor processing equipment; The first conveying assembly is further used for conveying the workpiece on the first calibration part to the first bearing table and/or conveying the workpiece processed by the semiconductor processing equipment on the second bearing table into the second calibration part.
12. The loading and unloading sorting device of claim 11, wherein the first handling assembly comprises: the third carrying arm is arranged between the first calibration part and the bearing assembly and is used for carrying the workpiece on the first calibration part to the first bearing table; And the fourth carrying arm is arranged between the second calibration part and the bearing assembly and is used for carrying the workpiece on the second bearing table to the second calibration part.
13. A semiconductor processing system comprising a semiconductor processing apparatus, the loading and unloading sorting device according to any one of claims 1 to 12; The loading and unloading sorting device is used for transferring the workpiece to be processed to the processing position corresponding to the semiconductor processing equipment; The semiconductor processing device is used for processing the workpiece positioned at the processing position.
14. The semiconductor processing system of claim 13, wherein the semiconductor processing apparatus comprises at least one of a grinding apparatus, a film attachment apparatus, a dispensing apparatus, a laser cutting apparatus, a cleaning apparatus, and a packaging apparatus.

Description

Go up unloading sorting device and semiconductor processing system Technical Field The invention relates to the technical field of semiconductor processing equipment, in particular to a loading and unloading sorting device and a semiconductor processing system. Background In the wafer processing industry, the processing efficiency of workpieces determines the overall throughput of a production line. The current unloader that goes up combines material loading platform and unloading platform into a last unloading module, and when material loading letter sorting arm carried out the material loading operation from last unloading module, the unloading letter sorting arm then can not carry out the unloading operation with last unloading module, and this operation can influence the beat to reduce equipment work efficiency. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art or related art. Therefore, the invention provides the feeding and discharging sorting device, which can avoid the problem that the feeding operation and the discharging operation are mutually waited and mutually restricted, and remarkably improves the overall working efficiency and the equipment productivity of a semiconductor processing system. The invention also provides a semiconductor processing system. According to an embodiment of the first aspect of the present invention, a loading and unloading sorting device is applied to a semiconductor processing system, the semiconductor processing system includes a semiconductor processing apparatus, and the loading and unloading sorting device includes: The bearing assembly comprises a first bearing table and a second bearing table, the first bearing table is used for bearing a workpiece to be processed, and the second bearing table is used for bearing the workpiece processed by the semiconductor processing equipment; the sorting and transferring assembly is arranged close to the semiconductor processing equipment and the bearing assembly and is used for sorting and transferring the workpieces on the first bearing table to processing positions corresponding to the semiconductor processing equipment and/or sorting and transferring the workpieces processed by the semiconductor processing equipment to the second bearing table; The first carrying assembly is used for carrying the workpiece to be processed onto the first bearing table and/or carrying the workpiece processed by the semiconductor processing equipment on the second bearing table into the material box positioned at the blanking position. Optionally, be provided with a plurality of first negative pressure holes of intercommunication each other on the processing position of semiconductor processing equipment, sort and transport the subassembly and include: the material receiving mobile disc is movably arranged on one side of the semiconductor processing equipment and is provided with a feeding position and a discharging position, and the material receiving mobile disc positioned at the feeding position is used for receiving a workpiece which is transported by a fifth carrying arm in the semiconductor processing equipment and processed by the semiconductor processing equipment; The placing disc is arranged between the semiconductor processing equipment and the bearing component and is used for bearing a workpiece to be processed; The second carrying assembly is used for correspondingly transferring each workpiece on the first bearing table to the placing plate and/or transferring the workpiece on the receiving moving plate positioned at the unloading position to the second bearing table; The third carrying assembly is arranged on one side of the semiconductor processing equipment and is used for transferring the workpieces on the placing plate to the upper part of the first negative pressure hole on the processing position of the semiconductor processing equipment so that each workpiece is adsorbed on the corresponding processing position of the semiconductor processing equipment. Optionally, the carrier assembly further comprises: a third bearing table for bearing the replacement part; The second carrying assembly is further used for transferring the replacement parts on the third bearing table to the placing plate when the number of the workpieces on the first bearing table is smaller than that of the first negative pressure holes, so that the sum of the number of the workpieces and the number of the replacement parts on the placing plate is the same as that of the first negative pressure holes; the third handling assembly is also used for transferring the replacement piece positioned on the placing plate to the position above the first negative pressure holes on the processing position of the semiconductor processing equipment, so that the upper surface of each first negative pressure hole is covered. Optionally, a plurality of second negative pressure holes which are