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CN-122028691-A - Substrate bonding device

CN122028691ACN 122028691 ACN122028691 ACN 122028691ACN-122028691-A

Abstract

The application provides a substrate bonding device which comprises a first supporting structure, a second supporting structure and a control system, wherein the first supporting structure is used for supporting a first substrate, the second supporting structure is used for supporting a second substrate, the control system is connected with the first supporting structure and the second supporting structure and used for controlling the positions of the first supporting structure and the second supporting structure so as to enable the first substrate and the second substrate to be aligned. The substrate bonding device can improve the accuracy of substrate alignment.

Inventors

  • Pu Longnan

Assignees

  • 朴龙男

Dates

Publication Date
20260512
Application Date
20230424

Claims (10)

  1. 1. A substrate bonding apparatus, comprising: -a first support structure (300), the first support structure (300) being for supporting a first substrate (100); and a second support structure (400), the second support structure (400) for supporting a second substrate (200); a control system coupled to the first support structure (300) and the second support structure (400), the control system for controlling the position of the first support structure (300) and the second support structure (400) such that the first substrate (100) and the second substrate (200) are aligned.
  2. 2. The substrate bonding apparatus according to claim 1, wherein the control system comprises a position detection element for detecting the positions of the first support structure (300) and the second support structure (400) to thereby obtain the positions of the corresponding first substrate (100) and second substrate (200).
  3. 3. The substrate bonding apparatus according to claim 2, wherein the control system further comprises an analyzing element electrically connected to the position detecting element, the analyzing element being configured to analyze positions of the first substrate (100) and the second substrate (200) obtained by the position detecting element, thereby obtaining a displacement difference between the first substrate (100) and the second substrate (200).
  4. 4. A substrate bonding apparatus according to claim 3, wherein the control system comprises a drive structure (550), the drive structure (550) being connected to the first support structure (300) and the second support structure (400), the drive structure (550) being adapted to drive the first support structure (300) and/or the second support structure (400) in motion to align the first substrate (100) and the second substrate (200).
  5. 5. The substrate bonding apparatus according to claim 4, wherein the driving structure (550) is connected to the analysis element, the driving structure (550) being capable of driving the first support structure (300) and/or the second support structure (400) to be obtained in accordance with the displacement difference obtained by the analysis element so that the first substrate (100) and the second substrate (200) are aligned.
  6. 6. The substrate bonding apparatus according to claim 4, wherein the first support structure (300) and the second support structure (400) each comprise a groove, the grooves being rectangular grooves, the grooves of the first support structure (300) and the second support structure (400) being adapted to mount the first substrate (100) and the second substrate (200), respectively, with a length direction of the grooves being an x-axis direction, a width direction of the grooves being a y-axis direction, and a depth direction of the grooves being a z-axis direction, the driving structure (550) being adapted to drive the first support structure (300) and/or the second support structure (400) to move in the x-axis direction and/or the y-axis direction, and/or to rotate about the z-axis direction, so that the first substrate (100) and the second substrate (200) are aligned.
  7. 7. The substrate bonding apparatus according to claim 1, wherein the first support structure (300) has a first alignment mark (330) thereon, the second support structure (400) has a second alignment mark (430) thereon, each of the first alignment marks (330) corresponds to a first preset position (130) on the first substrate (100), the second alignment mark (430) corresponds to a second preset position on the second substrate (200), and the control system is capable of controlling the first support structure (300) and/or the second support structure (400) to move according to the first alignment mark (330) and the second alignment mark (430) so as to align the first substrate (100) and the second substrate (200).
  8. 8. The substrate bonding apparatus according to claim 7, wherein the control system is further capable of obtaining a first error based on the first alignment mark (330) and the first preset position (130), the control system is further capable of obtaining a second error based on the second alignment mark (430) and the second preset position, and the control system is further capable of controlling the first support structure (300) and/or the second support structure (400) to align the first substrate (100) and the second substrate (200) based on the first alignment mark (330) and the second alignment mark (430) using the first error and the second error as compensation values.
  9. 9. The substrate bonding apparatus according to claim 1, wherein the first substrate (100) and the second substrate (200) are made of opaque materials, wherein a first mark hole is provided on the first substrate (100), the first mark hole forming the first alignment mark (330), and a second mark hole is provided on the second substrate (200), the second mark hole forming the second alignment mark (430).
  10. 10. The substrate bonding apparatus according to claim 9, wherein the first marking hole is filled with a transparent material, and/or the second marking hole is filled with a transparent material.

Description

Substrate bonding device Technical Field The application relates to the technical field of substrate bonding devices, in particular to a substrate bonding device. Background Currently, substrate bonding techniques are used in semiconductor, LED, MEMS sensor, WLP, HBM fabrication, and multi-chip lamination techniques. In the past, since the substrates were bonded with an adhesive, and then wiring was formed, precise alignment of the substrates was not required. However, in recent years, a technique of directly connecting wirings formed on substrates by bonding and simultaneously realizing electrical connection between the substrates has been used, and therefore, it is necessary to precisely align the substrates before bonding the substrates. In the substrate alignment mode in the prior art, the alignment accuracy is low. Therefore, how to provide a substrate bonding apparatus capable of improving accuracy of substrate alignment is a problem that a person skilled in the art is urgent to solve. Disclosure of Invention Accordingly, the present application is directed to a substrate bonding apparatus capable of improving accuracy of substrate alignment. In order to solve the problem, the present application provides a substrate bonding apparatus comprising: A first support structure for supporting the first substrate; And a second support structure for supporting the second substrate; and the control system is connected with the first supporting structure and the second supporting structure and is used for controlling the positions of the first supporting structure and the second supporting structure so as to align the first substrate and the second substrate. Further, the control system comprises a position detection element, wherein the position detection element is used for detecting positions of the first support structure and the second support structure, and further acquiring positions of the corresponding first substrate and second substrate. Further, the control system further comprises an analysis element, the analysis element is electrically connected with the position detection element, and the analysis element is used for analyzing the positions of the first substrate and the second substrate obtained by the position detection element, so that the displacement difference between the first substrate and the second substrate is obtained. Further, the control system comprises a driving structure connected with the first support structure and the second support structure, and the driving structure is used for driving the first support structure and/or the second support structure to move so as to align the first substrate and the second substrate. Further, a driving structure is connected to the analysis element, the driving structure being capable of driving the first support structure and/or the second support structure to be obtained in accordance with a displacement difference obtained by the analysis element, such that the first substrate and the second substrate are aligned. Further, the first support structure and the second support structure comprise grooves which are rectangular grooves, the grooves corresponding to the first support structure and the second support structure are used for installing the first substrate and the second substrate respectively, the length direction of the grooves is taken as the x-axis direction, the width direction of the grooves is taken as the y-axis direction, the depth direction of the grooves is taken as the z-axis direction, and the driving structure is used for driving the first support structure and/or the second support structure to move in the x-axis direction and/or the y-axis direction and/or rotate around the z-axis direction so as to align the first substrate and the second substrate. Further, the first support structure is provided with a first alignment mark, the second support structure is provided with a second alignment mark, each first alignment mark corresponds to a first preset position on the first substrate, the second alignment mark corresponds to a second preset position on the second substrate, and the control system can control the first support structure and/or the second support structure to move according to the first alignment mark and the second alignment mark so as to align the first substrate and the second substrate. Further, the control system can also obtain a first error according to the first alignment mark and the first preset position, can also obtain a second error according to the second alignment mark and the second preset position, and can control the first support structure and/or the second support structure to move so as to align the first substrate and the second substrate according to the first alignment mark and the second alignment mark by adopting the first error and the second error as compensation values. Further, the first substrate and the second substrate are made of opaque materials, the first substrate is