CN-122028692-A - Method for adjusting substrate conveying position, substrate conveying method and substrate processing system

CN122028692ACN 122028692 ACN122028692 ACN 122028692ACN-122028692-A

Abstract

The invention provides a technology capable of reducing the position deviation of a substrate conveyed from a batch processing part to a single-chip processing part. A method for adjusting a substrate transfer position in a substrate processing system includes a batch processing unit configured to collectively process a plurality of substrates, a single-wafer processing unit configured to process the substrates one by one, a substrate standby unit configured to standby the substrates transferred from the batch processing unit to the single-wafer processing unit, the substrate standby unit including a transfer table configured to mount the substrates and a first transfer robot configured to mount the substrates processed by the batch processing unit to the transfer table and including a first holding unit configured to hold the substrates, the single-wafer processing unit including a second transfer robot configured to acquire the substrates from the transfer table and including a second holding unit configured to hold the substrates, the second holding unit configured to acquire the substrates from the transfer table, the second holding unit configured to hold the substrates in a state in which the substrates acquired from the transfer table are held, and a horizontal position of the first holding unit configured to mount the substrates to the transfer table based on the detected amounts of the substrates.

Inventors

IWANO KOICHI
TERAMOTO AKIHIRO
YOSHIDA HIROSHI
SHENG DAFU

Assignees

东京毅力科创株式会社

Dates

Publication Date: 20260512
Application Date: 20251029
Priority Date: 20241108

Claims (9)

1. A method for adjusting a substrate transfer position in a substrate processing system including a batch processing unit for processing a plurality of substrates simultaneously, a single-wafer processing unit for processing the substrates one by one, and a substrate standby unit for standby of the substrates transferred from the batch processing unit to the single-wafer processing unit, The substrate standby part is provided with a delivery platform for placing the substrate and a first conveying robot for placing the substrate processed by the batch processing part on the delivery platform, The single-wafer processing unit includes a second transfer robot that obtains the substrate from the transfer stage, The first transfer robot has a first holding portion that holds the substrate, The second transfer robot has a second holding portion that holds the substrate, The method for adjusting the substrate conveying position comprises the following steps: the second holding unit obtains a substrate from the transfer table; detecting an amount of displacement of the substrate relative to a reference position in a state in which the second holding portion holds the substrate acquired from the transfer stage; And correcting a horizontal position of the first holding portion when the substrate is placed on the transfer table based on the detected offset amount.
2. The method for adjusting a substrate transport position according to claim 1, wherein, The substrate is a simulation substrate, and the simulation substrate, The method for adjusting the substrate conveying position is performed by using the simulation substrate before the product substrate is processed.
3. The method for adjusting a substrate transport position according to claim 1, wherein, The substrate is a product substrate, and the substrate is a product substrate, The method for adjusting the substrate conveying position is performed by using the product substrate when the product substrate is processed.
4. The method for adjusting a substrate transport position according to any one of claims 1 to 3, wherein, The first conveying robot is a 6-axis vertical multi-joint robot.
5. The method for adjusting a substrate transport position according to any one of claims 1 to 3, wherein, The offset is an offset in the horizontal direction.
6. The method for adjusting a substrate transport position according to any one of claims 1 to 3, wherein, The offset amount is detected when the second holding portion moves.
7. The method for adjusting a substrate transport position according to any one of claims 1 to 3, wherein, The offset amount is detected by a detection unit including a light projecting unit and a light receiving unit facing each other with a path through which the substrate acquired from the transfer table passes when the second holding unit conveys the substrate.
8. A substrate transfer method in a substrate processing system including a batch processing unit for processing a plurality of substrates at once, a single-wafer processing unit for processing the substrates one by one, and a substrate standby unit for standby of the substrates transferred from the batch processing unit to the single-wafer processing unit, The substrate standby part is provided with a delivery platform for placing the substrate and a first conveying robot for placing the substrate processed by the batch processing part on the delivery platform, The single-wafer processing unit includes a second transfer robot that obtains the substrate from the transfer stage, The first transfer robot has a first holding portion that holds the substrate, The second transfer robot has a second holding portion that holds the substrate, The substrate conveying method comprises the following steps: the second holding unit obtains a substrate from the transfer table; detecting an amount of deviation of the substrate from a reference position while the second holding portion holds the substrate acquired from the transfer stage, and And correcting a horizontal position of the first holding portion when the substrate is placed on the transfer table based on the detected offset amount.
9. A substrate processing system, comprising: a batch processing unit for processing a plurality of substrates at once; A single-wafer processing unit that processes the substrates one by one; A substrate standby section for standby substrates transferred from the batch processing section to the single-wafer processing section, and The control circuitry is configured to control the operation of the control circuitry, The substrate standby part is provided with a delivery platform for placing the substrate and a first conveying robot for placing the substrate processed by the batch processing part on the delivery platform, The single-wafer processing unit includes a second transfer robot that obtains the substrate from the transfer stage, The first transfer robot has a first holding portion that holds the substrate, The second transfer robot has a second holding portion that holds the substrate, The control circuit is configured to perform the following processing: the second holding unit obtains a substrate from the transfer table; detecting an amount of deviation of the substrate from a reference position while the second holding portion holds the substrate acquired from the transfer stage, and And correcting a horizontal position of the first holding portion when the substrate is placed on the transfer table based on the detected offset amount.

Description

Method for adjusting substrate conveying position, substrate conveying method and substrate processing system Technical Field The present invention relates to a method for adjusting a substrate transfer position, a substrate transfer method, and a substrate processing system. Background Patent document 1 discloses a technique in which, when a fork arm is retracted while holding a substrate, a position of a peripheral edge portion of the substrate held by the fork arm is detected by a sensor, and the position of transfer of the substrate to a processing unit at the time of conveyance to the next processing unit is corrected based on a detection value of the sensor. < Prior art document > < Patent document > Patent document 1 Japanese patent application laid-open No. 2012-64918 Disclosure of Invention < Problem to be solved by the invention > The invention provides a technology capable of reducing the position deviation of a substrate conveyed from a batch processing part to a single chip processing part. < Means for solving the problems > The method for adjusting the substrate transport position according to the aspect of the present invention is a method for adjusting the substrate transport position in a substrate processing system including a batch processing unit that processes a plurality of substrates simultaneously, a single-wafer processing unit that processes the substrates one by one, and a substrate standby unit that waits for the substrates transported from the batch processing unit to the single-wafer processing unit, wherein the substrate standby unit includes a transfer table on which the substrates are placed, and a first transport robot that places the substrates processed by the batch processing unit on the transfer table, the single-wafer processing unit includes a second transport robot that obtains the substrates from the transfer table, the first transport robot includes a first holding unit that holds the substrates, the second transport robot includes a second holding unit that holds the substrates, the second holding unit obtains the substrates from the transfer table, the second holding unit holds the substrates obtained from the transfer table, the substrates are detected in a state in which the second holding unit holds the substrates obtained from the transfer table, and the transfer position is corrected to the first holding unit based on the detected displacement amount of the substrates relative to the transfer table. < Effect of the invention > According to the present invention, the positional displacement of the substrates transferred from the batch processing section to the single-wafer processing section can be reduced. Drawings Fig. 1 is a schematic plan view showing an example of a substrate processing system. Fig. 2 is a diagram showing an example of the second transfer portion. Fig. 3 is a flowchart showing an example of a substrate processing method. Fig. 4 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 5 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 6 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 7 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 8 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 9 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 10 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 11 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 12 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 13 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 14 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 15 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 16 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 17 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 18 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 19 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 20 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 21 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 22 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 23 is a diagram showing an example of a method of adjusting the substrate transport position. Fig. 24 is a diagram showing an example of a method of adjusting the substrate tra