CN-122028695-A - Flip chip packaging machine

CN122028695ACN 122028695 ACN122028695 ACN 122028695ACN-122028695-A

Abstract

The invention relates to a flip chip packaging machine which comprises a carrier collecting and releasing device, a chip packaging device, a wafer platform and a chip pick-up device, wherein the carrier collecting and releasing device utilizes a carrier conveying track to convey a carrier from a discharging station to a collecting station, the chip packaging device is arranged between the discharging station and the collecting station, a liftable pressing head is arranged above the carrier conveying track, a liftable pressing platform is arranged below the carrier conveying track relative to the pressing head, the pressing head and the pressing platform are provided with heaters, the wafer platform is arranged on the side edge of the chip packaging device and can translate in the axial direction of the parallel carrier conveying track, the pick-up device is arranged on a triaxial manipulator, and the pick-up head utilizes the triaxial manipulator to move along a translation shaft, a lifting shaft and a rotating shaft which are perpendicular to the carrier conveying track, so that a chip is picked up from the wafer platform and handed over to the pressing head. Therefore, the pressing head and the pressing platform are lifted in situ to perform pressing packaging, and the pressing head and the pressing platform have the effects of improving pressing precision and pressing temperature stability.

Inventors

ZHAO LIWEN
YU SHICONG
Jian Jiean
CHEN JUNXIAN

Assignees

易发精机股份有限公司

Dates

Publication Date: 20260512
Application Date: 20241107

Claims (2)

1. The flip chip packaging machine is characterized by comprising: The carrier receiving and releasing device is provided with a discharging station, a carrier conveying track and a receiving station, and the carrier conveying track is utilized to convey the carrier from the discharging station to the receiving station; the chip packaging device is arranged between the discharging station and the receiving station, a pressing head with a lifting function is arranged above the carrier conveying track, a pressing platform with a lifting function is arranged below the carrier conveying track relative to the pressing head, and the pressing head and the pressing platform are provided with heaters; A wafer stage arranged at the side of the chip packaging device and arranged on a single-axis manipulator for translating in the axial direction parallel to the carrier conveying track, and The chip picking device is used for arranging a picking head on a triaxial manipulator, and the picking head utilizes the triaxial manipulator to move along a translation axis, a lifting axis and a rotation axis which are perpendicular to the carrier conveying track, so as to pick up chips from the wafer platform, transfer the chips to the lamination head, and utilize the lamination head and the lamination platform to carry out lamination packaging.
2. The flip chip packaging machine of claim 1, comprising a wafer cassette platform and a wafer loading device, wherein the wafer cassette platform is disposed at a side of the wafer platform, the wafer cassette is disposed on the wafer cassette platform, the wafer loading device is disposed between the wafer platform and the wafer cassette platform, and the wafer loading device is used to take out a wafer from the wafer cassette and transfer the wafer to the wafer platform.

Description

Flip chip packaging machine Technical Field The present invention relates to a flip chip packaging machine, and more particularly to a design for lifting a bonding head and a bonding platform in situ to perform bonding packaging, which has the advantages of improving bonding precision and bonding temperature stability. Background TWI764188/CN112218516B discloses a mounting device for mounting electronic components on a mounting area of a tape circuit board arranged in parallel, comprising a tape running unit having a conveying path for mounting the tape circuit board and running the tape circuit board along a conveying path along the conveying path in a main operation of the mounting, a bonding stage capable of being arranged on the conveying path of the tape circuit board and supporting the tape circuit board from a lower surface, a bonding head for pressing the electronic components on the mounting area of the tape circuit board supported by the bonding stage and heating the bonding head, and a heater for heating the bonding head and the bonding stage in addition thereto, wherein the bonding head and the bonding stage are moved to an out-of-band position deviated from the conveying path of the tape circuit board as an aging operation before the main operation and kept in contact or close to each other or repeatedly brought into contact or separated from each other while heating the bonding head and separated from each other by the heater. The bonding head and the bonding stage are moved to an out-of-band position deviated from the conveying path of the tape-shaped circuit substrate, and the out-of-band position is heated by a heater, and the electronic component is transferred by the bonding head and the pick-up head of the electronic component. Therefore, there is a need to design a flip chip packaging machine to solve the above-mentioned problems. Disclosure of Invention The invention aims to provide a flip chip packaging machine, which solves the problem that the pressing precision and the pressing temperature are unstable due to the outward transfer of a joint (pressing) joint and a joint (pressing) joint platform in the prior art, so that the joint and the pressing platform are lifted in situ to perform pressing packaging, and the flip chip packaging machine has the effects of improving the pressing precision and the pressing temperature stability. In order to achieve the above purpose, the invention provides a flip chip packaging machine which comprises: The chip packaging device comprises a carrier receiving and releasing device, a chip packaging device, a chip picking device and a chip picking device, wherein the carrier receiving and releasing device is provided with a discharging station, a carrier conveying track and a receiving station, the carrier conveying track is used for conveying a carrier from the discharging station to the receiving station, the chip packaging device is arranged between the discharging station and the receiving station, a pressing head with a lifting function is arranged above the carrier conveying track, a pressing platform with the lifting function is arranged below the carrier conveying track relative to the pressing head, the pressing head and the pressing platform are provided with heaters, the wafer platform is arranged on the side edge of the chip packaging device, the wafer platform is arranged on a single-shaft manipulator, the single-shaft manipulator is used for translating the wafer platform in the axial direction parallel to the carrier conveying track, and the chip picking device is arranged on the three-shaft manipulator, moves the chip picking head by the three-shaft manipulator in the vertical translation shaft, the lifting shaft and the rotation shaft, picks up the chip from the wafer platform, and transfers the chip to the pressing head, and uses the pressing head and the pressing platform to perform pressing packaging. In addition, the wafer cassette loading device comprises a wafer cassette platform and a wafer loading device, wherein the wafer cassette platform is arranged on the side edge of the wafer cassette platform, the wafer cassette is placed on the wafer cassette platform, the wafer loading device is arranged between the wafer cassette platform and the wafer cassette platform, and the wafer loading device is used for taking out the wafer from the wafer cassette and transferring the wafer to the wafer platform. Drawings FIG. 1 is a schematic view of the appearance structure of the present invention; FIG. 2 is a schematic top view of the present invention; FIG. 3 is a structural view of the area indicated by the circle 3 in FIG. 2; FIG. 4 is an enlarged view of a portion of the area indicated by the circle 4 in FIG. 3; Fig. 5 is a partial enlarged view illustrating an operation state of the chip pickup device corresponding to fig. 4. The figure indicates: 10 a carrier collecting and releasing device; 11 a discharging station; 12 carrier tran