CN-122028696-A - Disk core assembly, cover assembly, hot disk module and semiconductor processing equipment

Abstract

The application provides a core assembly, a cover assembly, a hot plate module and semiconductor processing equipment. The disc core assembly comprises a disc body and an air supply assembly, wherein the air supply assembly comprises an inner ring piece and an outer ring piece, an annular air outlet channel is formed between the inner ring piece and the outer ring piece, a pre-pressurizing cavity is arranged in the air supply assembly, the outlet end of the air inlet channel faces the wall surface of the pre-pressurizing cavity, so that the entering air can enter the annular air outlet channel after being blocked and diffused through the wall surface, and uniform air supply is realized. The technical scheme of the application mainly realizes the online pressure equalizing operation of the process gas by arranging the gas supply assembly with the pre-pressurizing cavity and utilizing the principle of gas impact wall surface diffusion. The method can ensure the uniformity and stability of the gas environment in the heat treatment process and ensure the quality and consistency of the process treatment. The pressure equalizing structure is compact in design, can be integrated in the existing module, and does not affect the overall layout of equipment, so that the normal operation of the equipment is not affected.

Inventors

• LIANG BINGBING
• DONG JINJIN
• PAN ZEQUAN

Assignees

• 宁波润华全芯微电子设备有限公司

Dates

Publication Date

20260512

Application Date

20251231

Claims (17)

1. 1. A core assembly of a hot plate module, comprising: a tray body having a supporting surface for supporting the substrate, and A gas supply assembly for delivering a gas to a surrounding area of the substrate; The air supply assembly includes: the inner ring piece and the outer ring piece are coaxially arranged, and an annular air outlet channel communicated to one side of the supporting surface is defined between the inner ring piece and the outer ring piece; A pre-pressurizing cavity formed inside the inner ring member and/or the outer ring member, the pre-pressurizing cavity being in communication with the annular air outlet passage, and An air inlet channel for introducing air into the pre-pressurizing chamber; The outlet end of the air inlet channel is arranged towards the wall surface of the pre-pressurizing cavity, so that the air entering the pre-pressurizing cavity is blocked by the wall surface and diffused to the pre-pressurizing cavity, and then enters the annular air outlet channel.
2. 2. A disc core assembly according to claim 1, wherein the cross-sectional area of the pre-charge chamber is greater than the cross-sectional area of the annular outlet passage, the radial width of the pre-charge chamber being 3 to 20 times the width of the annular outlet passage, or, The width of the annular air outlet channel in the circumferential direction is uniform and is between 0.1 mm and 2mm, or, The air inlet channel comprises a plurality of air inlets which are uniformly distributed along the circumferential direction.
3. 3. The disc cartridge assembly of claim 1, wherein the pre-charge chamber is an annular air groove formed by shrinking the bottom of the inner ring member, the wall surface is a top surface of the annular air groove, and the air inlet of the air inlet channel is formed on the bottom surface of the annular air groove and faces the top surface.
4. 4. A disc core assembly according to claim 1, wherein the air inlet of the air inlet channel is formed in the inner wall of the outer ring member, and the wall surface is the outer peripheral wall surface of the inner ring member.
5. 5. The disc cartridge assembly of claim 1, wherein the air supply assembly further comprises a plurality of positioning members disposed between the inner ring member and the outer ring member for ensuring concentricity of the inner ring member and the outer ring member.
6. 6. The disc cartridge assembly of claim 5 wherein said positioning member is a positioning key or pin, and wherein said outer peripheral wall of said inner ring member is provided with a plurality of positioning grooves for receiving said positioning member, said positioning member being abutted against said inner peripheral wall of said outer ring member, or, The number of the positioning pieces is three or four and the positioning pieces are uniformly distributed along the circumferential direction.
7. 7. A disc core assembly according to claim 1, wherein the top surface edge of the inner ring member and the top surface edge of the outer ring member are formed in an inclined structure inclined toward the center of the support surface so that the outlet of the annular air outlet passage converges toward the center of the support surface.
8. 8. A cover assembly for a thermal disc module, comprising: A housing defining an interior cavity, the housing having an exhaust port for connection to an exhaust line; The flow equalizing plate is arranged in the inner cavity of the shell and positioned below the exhaust port, and divides the inner cavity into an exhaust cavity positioned above and a processing cavity positioned below; Wherein, the flow equalizing plate is provided with a plurality of through flow guide holes for communicating the treatment cavity and the exhaust cavity; The flow equalizing plate is provided with a solid blocking area, the solid blocking area covers the area where the exhaust port is projected along the normal direction of the flow equalizing plate, and the flow guide holes are distributed in the area outside the solid blocking area so as to force air flow to flow from the processing cavity to the exhaust cavity through the flow guide holes and to be converged to the exhaust port in the exhaust cavity.
9. 9. The lid assembly of claim 8, wherein the flow directing holes have a pore size or distribution density that varies in a direction away from the solid barrier, wherein the flow directing holes near the edge of the process chamber have a larger pore size or higher distribution density than the flow directing holes near the center, The exhaust port is formed above the geometric center of the flow equalizing plate.
10. 10. The cover assembly of claim 9, further comprising a baffle plate disposed between the flow equalization plate and the housing, the exhaust chamber being formed between the flow equalization plate and the baffle plate, and a heating assembly disposed between the baffle plate and a top interior wall of the housing.
11. 11. A hotplate module, comprising: A module body configured to be capable of being pushed into a bin of a semiconductor processing apparatus along an insertion direction; the bearing disc is arranged in the module main body; A tray cover arranged above the bearing tray and having an air outlet, and The exhaust flow path is arranged on the tray cover, one end of the exhaust flow path is communicated with the exhaust port of the tray cover, and the other end of the exhaust flow path extends to the back of the module main body and forms a butt joint air port; The opening of the butt-joint air port faces to be parallel to the insertion direction, and when the module main body is pushed into the bin to be in place, the butt-joint air port and an equipment exhaust interface in the bin form sealing butt joint.
12. 12. The hot plate module of claim 11, wherein a ring of flexible seals is provided on the outlet end face of the docking tuyere for forming a squeeze seal when the docking tuyere is docked with the device air exhaust interface.
13. 13. The hot plate module of claim 11, wherein one of the docking tuyere or the equipment exhaust port is designed with a tapered guiding surface for guiding the two to align with each other during docking, or, The inside of the exhaust flow path is provided with a valve, and the valve is a butterfly valve or a gate valve and is used for adjusting the gas flow passing through the exhaust flow path.
14. 14. The hotplate module of any of claims 11-13, wherein the carrier plate comprises a core assembly as claimed in any of claims 1 to 7.
15. 15. The hot plate module of any one of claims 11-13, wherein the plate cover is a cover assembly of any one of claims 8 to 10.
16. 16. A semiconductor processing apparatus, comprising: A frame having at least one compartment for accommodating a thermal tray module, a rear wall plate of the compartment being provided with a device air outlet port connected to a negative pressure suction system, and The thermal disc module of any one of claims 11-15, removably mounted in the bay; the air outlet of the hot plate module is in butt joint with the exhaust interface of the equipment to form a communicated air flow channel.
17. 17. The semiconductor processing apparatus of claim 16, wherein the rack has a plurality of the bins, the bins being grouped, the equipment exhaust interfaces of each group of bins being connected to a separate main exhaust pipe.

Description

Disk core assembly, cover assembly, hot disk module and semiconductor processing equipment Technical Field The invention relates to the technical field of semiconductor processing equipment, in particular to a disk core assembly, a cover body assembly, a thermal disk module and semiconductor processing equipment of the thermal disk module. Background Along with the continuous development of semiconductor technology, the precision control requirement on production equipment is increasingly improved. In order to adapt to the continuously advanced process nodes, the heat treatment links in the semiconductor wet process equipment are gradually transited to the directions of high uniformity and high stability. The heat plate module is a main executive component for solving the technological requirements of heating, baking and the like of a substrate in the industry at present. Semiconductor substrates come in a variety of specifications and process windows are often very critical. The air flow environment inside the thermal disc module and around the substrate is critical to ensure uniformity of process treatment. In order to achieve more uniform heating or to form a curtain of insulating gas, it is desirable to deliver a specific process gas from a carrier plate below the substrate. The process gas delivery process can be further divided into a number of sub-division schemes. In the existing air supply mode, a plurality of discrete air inlets are formed in the bearing plate, and process air is directly sprayed upwards. Generally, in order to ensure the coverage of air flow, the number and distribution of the air inlets are high in design. If the difference of the air flow speed and the pressure on the surface of the substrate in the air supply process is too large, not only the temperature field on the surface of the substrate is uneven, but also the consistency of the chemical reaction rate is possibly affected, and more serious problems such as particle pollution and the like are possibly caused by local air flow disturbance. Disclosure of Invention In order to solve the problem of uneven air supply of a hot plate module in a semiconductor process, the application provides a plate core assembly, a cover body assembly, a hot plate module and semiconductor processing equipment of the hot plate module. The technical scheme of the invention provides a disc core assembly of a hot disc module, which comprises a disc body and a gas supply assembly, wherein the disc body is provided with a supporting surface for supporting a substrate, the gas supply assembly is used for conveying gas to the surrounding area of the substrate, the gas supply assembly comprises an inner ring piece and an outer ring piece, the inner ring piece and the outer ring piece are coaxially arranged, an annular gas outlet channel communicated to one side of the supporting surface is defined between the inner ring piece and the outer ring piece, a pre-charging cavity is formed in the inner ring piece and/or the outer ring piece, the pre-charging cavity is communicated with the annular gas outlet channel, and a gas inlet channel is used for introducing gas into the pre-charging cavity, wherein the outlet end of the gas inlet channel is arranged towards the wall surface of the pre-charging cavity, so that the gas entering the pre-charging cavity is blocked by the wall surface and is diffused into the pre-charging cavity, and then enters the annular gas outlet channel. Preferably, the cross-sectional area of the channel of the pre-pressurizing cavity is larger than that of the annular air outlet channel, the radial width of the pre-pressurizing cavity is 3 to 20 times of that of the annular air outlet channel, or the width of the annular air outlet channel in the circumferential direction is uniform and is between 0.1 and 2 millimeters, or the air inlet channel comprises a plurality of air inlets uniformly distributed along the circumferential direction. Preferably, the pre-pressurizing cavity is an annular air groove formed at the bottom of the inner ring member in a shrinking manner, the wall surface is the top surface of the annular air groove, and the air inlet of the air inlet channel is formed on the bottom surface of the annular air groove and faces the top surface. Preferably, the air inlet of the air inlet channel is formed on the inner wall of the outer ring member, and the wall surface is the outer peripheral wall surface of the inner ring member. Preferably, the air supply assembly further comprises a plurality of positioning members disposed between the inner ring member and the outer ring member for ensuring concentricity of the inner ring member and the outer ring member. Preferably, the positioning piece is a positioning key or a positioning pin, a plurality of positioning grooves for accommodating the positioning piece are formed in the peripheral wall of the inner ring piece, the positioning piece is abutted against the inner wall