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CN-122028698-A - Suction nozzle device suitable for PD array chip and maintenance method thereof

CN122028698ACN 122028698 ACN122028698 ACN 122028698ACN-122028698-A

Abstract

The invention provides a suction nozzle device suitable for a PD array chip and a maintenance method thereof, wherein an adsorption contact 11 is arranged on a suction nozzle head 1, an avoidance groove 111 is arranged on the adsorption contact 11, a plurality of adsorption holes 112 are arranged in the avoidance groove 111, the adsorption holes 112 are communicated with negative pressure channels in the suction nozzle head 1 and an adsorption pipe body 2, an adsorption function is provided for the suction nozzle head 1, the avoidance groove 111 corresponds to the positions of a thermosensitive surface 51 and an annular boss 53 on the PD array chip 5 when the PD array chip 5 is adsorbed, the avoidance groove 111 is used for preventing the adsorption contact 11 from directly contacting the thermosensitive surface 51 and the annular boss 53, so that damage to the thermosensitive surface 51 and the annular boss 53 in the adsorption process is avoided, and meanwhile, the adsorption stability is ensured.

Inventors

  • LI SHIYU
  • HU YAN
  • YUE AIWEN
  • ZHONG XING
  • LI JING

Assignees

  • 武汉光迅科技股份有限公司

Dates

Publication Date
20260512
Application Date
20241104

Claims (10)

  1. 1. The suction nozzle device suitable for the PD array chip is characterized by comprising a suction nozzle head (1) and a suction tube body (2), wherein: The suction nozzle head (1) is arranged at one end of the suction pipe body (2), a main negative pressure channel (21) communicated with the suction nozzle head (1) is arranged in the suction pipe body (2), and the main negative pressure channel (21) is used for being communicated with a vacuum pump; The suction nozzle is characterized in that an adsorption contact (11) is arranged at the front end of the suction nozzle head (1), an avoidance groove (111) is formed in the adsorption contact (11), the depth of the avoidance groove (111) is larger than the height of an annular boss (53) on the PD array chip (5), a plurality of adsorption holes (112) are formed in the bottom surface of the avoidance groove (111), the adsorption holes (112) are communicated with the main negative pressure channel (21), the adsorption holes (112) are used for adsorbing the PD array chip (5), and the avoidance groove (111) is used for avoiding the annular boss (53) on the PD array chip (5).
  2. 2. Suction nozzle device for PD array chips according to claim 1, characterized in that the suction nozzle device for PD array chips further comprises a monitoring laser (6), the monitoring laser (6) being arranged below the suction nozzle head (1) and between the second receiving film (7) and the second receiving film (8), wherein: When the mechanical swing arm drives the suction nozzle head (1) to reciprocate between the second receiving film (7) and the second receiving film (8) so as to transfer the PD array chip (5) on the second receiving film (7) to the second receiving film (8), the optical path of the monitoring laser (6) passes through the moving path of the suction nozzle head (1); The monitoring laser (6) is used for outputting optical signals, the suction nozzle head (1) is used for reflecting the optical signals back to the monitoring laser (6) when the optical paths of the monitoring laser (6) are passed through, the monitoring laser (6) is used for receiving reflected light reflected by the suction nozzle head (1), and whether the suction nozzle head (1) needs maintenance is judged according to the signal intensity of the reflected light.
  3. 3. The suction nozzle device suitable for the PD array chip according to claim 1, wherein a limit clamping groove (3) surrounding a circumference is arranged between the suction nozzle head (1) and the suction pipe body (2).
  4. 4. The suction nozzle device for the PD array chip according to claim 3, wherein the limit slot (3) is provided with a soft collar.
  5. 5. The suction nozzle device for the PD array chip according to claim 1, wherein the suction contact (11) is rectangular, the length of the long side of the suction contact (11) is 1400um-4000um, and the length of the wide side of the suction contact (11) is 250um-500um.
  6. 6. The suction nozzle device for a PD array chip according to any one of claims 1-5, wherein the avoidance groove (111) is rectangular, the length of the long side of the avoidance groove (111) is 1000um-3000um, the length of the wide side of the avoidance groove (111) is 50um-300um, and the depth of the avoidance groove (111) is 100um-500um.
  7. 7. The suction nozzle device for a PD array chip according to any one of claims 1-5, wherein at least 3 suction holes (112) are provided in the avoidance groove (111).
  8. 8. The suction nozzle device for a PD array chip according to any one of claims 1-5, wherein the suction nozzle head (1) is in a shape of a circular table, and the suction contact (11) is disposed on the circular table surface of the suction nozzle head (1).
  9. 9. Suction nozzle device for PD array chips according to any one of claims 1-5, characterized in that the suction holes (112) communicate with the main negative pressure channel (21), comprising in particular: Each adsorption hole (112) is communicated with a single auxiliary negative pressure channel (22), and each auxiliary negative pressure channel (22) is communicated with the main negative pressure channel (21).
  10. 10. A maintenance method of a suction nozzle device for a PD array chip, which is applied to the suction nozzle device for a PD array chip according to any one of claims 1-9, comprising: setting a moving path of the mechanical swing arm driving the suction nozzle head (1) between the second receiving film (7) and the second receiving film (8); Arranging a monitoring laser (6) below the suction nozzle head (1) and between the second receiving film (7) and the second receiving film (8), wherein the optical path of the monitoring laser (6) passes through the moving path; Starting a mechanical swing arm to drive a suction nozzle head (1) to reciprocate between a second bearing film (7) and a second bearing film (8) along the moving path, wherein the suction nozzle head (1) transfers a PD array chip (5) on the second bearing film (7) to the second bearing film (8), and simultaneously starting a monitoring laser (6), and when the suction nozzle head (1) passes through a light path of the monitoring laser (6), reflecting an optical signal back to the monitoring laser (6); Recording the signal intensity of the reflected light received by the monitoring laser (6) every time the suction nozzle head (1) moves from the second receiving film (8) to the second receiving film (7); when the signal intensity of the reflected light received by the monitoring laser (6) is smaller than a preset threshold value, judging that the state of the suction nozzle head (1) is good; when the signal intensity of the reflected light received by the monitoring laser (6) is greater than or equal to a preset threshold value, the suction nozzle head (1) is judged to need maintenance.

Description

Suction nozzle device suitable for PD array chip and maintenance method thereof Technical Field The invention relates to the technical field of chip test and sorting, in particular to a suction nozzle device suitable for a PD array chip and a maintenance method thereof. Background With the rapid development of wireless communication, in order to improve the bandwidth, a Photodiode (PD) array chip is widely used in the existing wireless receiving device. Compared with a PD chip with a single structure, the PD array chip is formed by cascading a plurality of single chips, and has the characteristics of small size and slender structure. With the wide application of PD array chips, the suction problem of PD array chips is also becoming more and more apparent. The PD array chip is provided with a plurality of photosurfaces, the photosurfaces are very fragile, and when the PD array chip is sucked through the suction nozzle head, the photosurfaces and other devices on the PD array chip are easy to damage. And the PD array chip is fragile and thin, and the PD array chip body is easily damaged when the PD array chip is sucked by the suction nozzle head. In view of this, overcoming the drawbacks of the prior art is a problem to be solved in the art. Disclosure of Invention The invention aims at avoiding damage to the PD array chip when the PD array chip is adsorbed by the suction nozzle head. In a first aspect, there is provided a suction nozzle device adapted for a PD array chip, comprising a suction nozzle head 1 and a suction pipe body 2, wherein: The suction nozzle head 1 is arranged at one end of the suction pipe body 2, a main negative pressure channel 21 communicated with the suction nozzle head 1 and the suction pipe body 2 is arranged in the suction pipe body 2, and the main negative pressure channel 21 is used for being communicated with a vacuum pump; The front end of the suction nozzle head 1 is provided with an adsorption contact 11, the adsorption contact 11 is provided with an avoidance groove 111, the depth of the avoidance groove 111 is larger than the height of the annular boss 53 on the PD array chip 5, the bottom surface of the avoidance groove 111 is provided with a plurality of adsorption holes 112, the adsorption holes 112 are communicated with the main negative pressure channel 21, the adsorption holes 112 are used for adsorbing the PD array chip 5, and the avoidance groove 111 is used for avoiding the annular boss 53 on the PD array chip 5. Preferably, the suction nozzle device suitable for a PD array chip further comprises a monitoring laser 6, wherein: when the mechanical swing arm drives the suction nozzle head 1 to reciprocate between the second receiving film 7 and the second receiving film 8 so as to transfer the PD array chip 5 on the second receiving film 7 onto the second receiving film 8, the monitoring laser 6 is arranged below the suction nozzle head 1 and between the second receiving film 7 and the second receiving film 8, and the optical path of the monitoring laser 6 passes through the moving path of the suction nozzle head 1; The monitoring laser 6 is used for outputting optical signals, the suction nozzle head 1 is used for reflecting the optical signals back to the monitoring laser 6 when the optical paths of the monitoring laser 6 are passed, the monitoring laser 6 is used for receiving reflected light reflected by the suction nozzle head 1, and whether the suction nozzle head 1 needs maintenance is judged according to the signal intensity of the reflected light. Preferably, a limit clamping groove 3 encircling the circumference is arranged between the suction nozzle head 1 and the suction pipe body 2. Preferably, the limit clamping groove 3 is provided with a soft necklace. Preferably, the adsorption contact 11 is rectangular, the length of the long side of the adsorption contact 11 is 1400um-4000um, and the length of the wide side of the adsorption contact 11 is 250um-500um. Preferably, the avoidance groove 111 is rectangular, the length of the long side of the avoidance groove 111 is 1000um-3000um, the length of the wide side of the avoidance groove 111 is 50um-300um, and the depth of the avoidance groove 111 is 100um-500um. Preferably, at least 3 adsorption holes 112 are provided in the avoidance groove 111. Preferably, the suction nozzle head 1 is in a shape of a circular truncated cone, and the suction contact 11 is disposed on a circular table surface of the suction nozzle head 1. Preferably, the adsorption hole 112 is in communication with the main negative pressure channel 21, and specifically includes: Each of the suction holes 112 communicates with a single sub-negative pressure passage 22, and each sub-negative pressure passage 22 communicates with the main negative pressure passage 21. In a second aspect, a maintenance method of a suction nozzle device suitable for a PD array chip is provided, which is applied to the suction nozzle device suitable for a PD arra