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CN-122028703-A - Wafer shaking degree detection device and shaking degree detection method

CN122028703ACN 122028703 ACN122028703 ACN 122028703ACN-122028703-A

Abstract

The invention relates to the technical field of semiconductor detection, and provides a device and a method for detecting wafer shaking degree. The device comprises a movable seat, a driving device, a mounting frame, an image capturing device, a guiding component and a host module, wherein the upper end of the movable seat is provided with a clamp for releasably clamping the lower end of a wafer to enable the movable seat to form a mounting space of the wafer, the driving device is connected with the movable seat and drives the movable seat to horizontally and linearly reciprocate, the mounting frame is composed of a connecting rod fixedly connected with the movable seat and the mounting seat fixedly connected with the upper end of the connecting rod, the mounting seat is arranged on one side of the mounting space, the image capturing device is arranged on the mounting seat and is used for capturing images when the wafer swings along with the movable seat, the sound capturing device is arranged on the mounting seat and is used for capturing sounds when the wafer swings, the guiding component is used for guiding the mounting seat to horizontally and linearly move along with the movable seat and limiting the vertical swing of the mounting seat, and the image capturing device and the sound capturing device are electrically connected to the host module, and the host module receives images captured by the image capturing device and displays the sound captured by the sound capturing device and displays decibel values of the sound capturing device.

Inventors

  • GAO BING
  • REN FENGMING

Assignees

  • 浙江晶越半导体有限公司

Dates

Publication Date
20260512
Application Date
20251225

Claims (10)

  1. 1. The device for detecting the degree of shaking of the wafer is characterized by comprising: a moving seat, the upper end of which is provided with a clamp, the clamp is configured to clamp the lower end of the wafer in a releasable way, so that a mounting space for the wafer is formed above the moving seat; a driving device connected with the moving seat and configured to drive the moving seat to linearly reciprocate in a horizontal direction; the mounting frame comprises a connecting rod fixedly connected with the movable seat and a mounting seat fixedly connected with the upper end of the connecting rod, wherein the mounting seat is positioned at one side of the mounting space; an image capturer mounted to the mounting base and configured to collect an image of a wafer swinging as the wafer swings with movement of the moving base; a sound trap mounted to the mounting base and configured to collect sound of wafer swing when the wafer swings with movement of the moving base; A guide assembly configured to guide the mount to reciprocate linearly in a horizontal direction with the moving mount and to restrict a swing of the mount in a vertical direction; Wherein the image capturer and the sound capturer are each electrically connected to a host module configured to: Receiving and displaying the image captured by the image capturer; And receiving the sound captured by the sound capturer and displaying the decibel value of the sound.
  2. 2. The device for detecting the degree of shaking of a wafer according to claim 1, wherein the guide assembly comprises a fixed stand, and a guide rod is fixedly connected to the fixed stand and extends along the direction in which the movable seat moves linearly; The mounting seat is slidably sleeved on the guide rod, so that the guide rod guides the mounting seat to linearly reciprocate along with the moving seat in the horizontal direction, and the mounting seat is limited to swing vertically.
  3. 3. The device for detecting wafer shaking degree according to claim 1, wherein the guide assembly comprises a fixed stand fixedly connected with a first limit rod and a second limit rod; The first limiting rod and the second limiting rod are vertically arranged at intervals to jointly define a guide groove, and the guide groove extends along the direction of linear movement of the movable seat; The mounting seat is provided with a sliding block part which is slidably embedded in the guide groove, the upper end of the sliding block part is always abutted against the first limiting rod, and the lower end of the sliding block part is always abutted against the second limiting rod, so that the mounting seat is guided to linearly reciprocate along with the moving seat in the horizontal direction, and the vertical swing of the mounting seat is limited.
  4. 4. The device for detecting wafer waviness of claim 3, wherein the upper end of the slider portion has a plurality of upwardly projecting upper end abutting portions; the outer surface of the upper end abutting part is a spherical surface, and the upper end of the sliding block part is abutted with the first limiting rod through the outer surfaces of the upper end abutting parts; And/or; the lower end of the sliding block part is provided with a plurality of lower end abutting parts protruding downwards; The outer surface of the lower end abutting part is a spherical surface, and the lower end of the sliding block part is abutted with the second limiting rod through the outer surfaces of the lower end abutting parts.
  5. 5. The device for detecting wafer shaking degree according to claim 1, wherein the guide assembly comprises a fixed stand fixedly connected with a first limit bar and a second limit bar; The first limit strips and the second limit strips are vertically arranged at intervals to jointly define a limit groove, and the limit groove extends along the direction of linear movement of the movable seat; The mounting seat is provided with a sliding block part which is slidably embedded in the limiting groove, the upper end of the sliding block part is always in rolling connection with the first limiting strip, and the lower end of the sliding block part is always in rolling connection with the second limiting strip, so that the mounting seat is guided to linearly reciprocate along with the moving seat in the horizontal direction, and the vertical swing of the mounting seat is limited.
  6. 6. The apparatus for detecting wafer waviness of claim 5, wherein the first stop bar comprises: the first rod body extends along the direction of linear movement of the movable seat; the first rollers are rotationally connected to the first rod body, and are distributed at intervals along the direction of linear movement of the movable seat; the upper end face of the sliding block part is always abutted against the outer wheel face of at least one first roller, so that the upper end of the sliding block part is always in rolling connection with the first limit strip; And/or; the second limit bar includes: The second rod body extends along the direction of the linear movement of the movable seat; The second rollers are rotationally connected to the second rod body, and are distributed at intervals along the direction of linear movement of the movable seat; The lower end face of the sliding block part is always abutted with the outer wheel face of at least one second roller, so that the lower end of the sliding block part is always in rolling connection with the second limit strip.
  7. 7. The device for detecting wafer waviness according to any one of claims 3 to 6, wherein the connecting rod is disposed obliquely, and the lower end of the connecting rod is fixedly connected to the movable base, and the upper end of the connecting rod is fixedly connected to a side surface of the mounting base in the horizontal direction, the side surface facing the mounting space of the wafer.
  8. 8. The wafer shaking degree detection method is characterized by comprising the following steps: s1, clamping the lower end of a wafer through a clamp to enable the wafer to be fixedly positioned on a movable seat; S2, driving the movable seat and the wafer clamped on the movable seat to linearly reciprocate, so that the free end of the upper part of the wafer swings; s3, during the reciprocating movement of the movable seat, the following operations are synchronously executed to acquire information: Acquiring an image of the wafer in the swinging process through an image capturer; collecting sound signals generated by a wafer in the swinging process through a sound capturer; S4, transmitting the image and the sound signals to a host module, and executing the following operations by the host module: Displaying the image; Calculating and displaying a decibel value thereof based on the sound signal; s5, analyzing the swing amplitude of the wafer based on the image, and comprehensively evaluating the swing degree of the wafer by combining the decibel values.
  9. 9. The method of claim 8, wherein in S3, both the image capturing device and the sound capturing device are driven to reciprocate linearly in synchronization with the moving base.
  10. 10. The method for detecting wafer shaking degree according to claim 8, wherein the image capturing device is controlled to collect an initial still image of the wafer in a stationary state before the moving base reciprocates, and the initial still image is set as a reference image for analysis of a swing amplitude; In S5, analyzing the swing amplitude of the wafer includes calculating a pixel offset of the free end of the wafer in the image based on the initial still image by comparing the image of the wafer swing with the initial still image and converting the pixel offset to an actual physical displacement amplitude.

Description

Wafer shaking degree detection device and shaking degree detection method Technical Field The invention relates to the technical field of semiconductor detection, in particular to a device and a method for detecting the shaking degree of a wafer. Background In the process of wafer production, the degree of wafer shaking (degree of wafer shaking) needs to be detected, and due to the defect of a corresponding detection device, the degree of wafer shaking is usually detected manually, namely, a person holds one corner of the wafer, judges the degree of wafer shaking through arm reciprocating motion and tactile sensation or sound, and then defines the degree of wafer shaking by combining with a judging standard. However, the manual detection method generally adopted in the industry relies on the operator holding the wafer to shake reciprocally, and performs subjective judgment by means of the touch feeling and hearing of the operator. The detection mode is obviously influenced by human factors, so that the difference of judgment results among different operators is large, the repeatability is poor, and the detection process is difficult to standardize because the clamping conditions, the motion parameters and the like cannot be uniformly controlled, objective and quantized detection data cannot be obtained, and the accuracy and the reliability of the detection result are seriously influenced. Disclosure of Invention The invention aims at overcoming the defects of the prior art and providing a device and a method for detecting the wafer shaking degree, which are used for detecting the shaking degree of a wafer and can improve the accuracy and the reliability of detecting the shaking degree of the wafer. The whole technical scheme of the invention is as follows: The invention is based on the method of manually detecting the degree of shaking of the wafer, and has the problem of low accuracy and reliability. In view of the above, the present invention provides a wafer wobble degree detection apparatus for detecting a wobble degree of a wafer, comprising: a moving seat, the upper end of which is provided with a clamp, the clamp is configured to clamp the lower end of the wafer in a releasable way, so that a mounting space for the wafer is formed above the moving seat; A driving device connected with the movable seat and configured to drive the movable seat to perform linear reciprocating movement in a horizontal direction; The mounting frame comprises a connecting rod fixedly connected with the movable seat and a mounting seat fixedly connected with the upper end of the connecting rod, wherein the mounting seat is positioned at one side of the mounting space; an image capturer mounted on the mounting base and configured to collect an image of the wafer swinging as the wafer swings with the movement of the moving base; a sound trap mounted on the mounting base and configured to collect sound of wafer swing when the wafer swings with movement of the moving base; the guide assembly is configured to guide the mounting seat to linearly reciprocate along with the moving seat in the horizontal direction and limit the vertical swing of the mounting seat; Wherein the image capturer and the sound capturer are each electrically connected to a host module configured to: Receiving and displaying the image captured by the image capturer; The sound captured by the sound capturer is received and the decibel value of the sound is displayed. According to the scheme, the driving device controls the movable seat to perform uniform linear reciprocating motion, manual shaking is replaced, interference caused by human factors (such as inconsistent force, frequency and amplitude) is eliminated, detection conditions are more controllable, consistency is higher, and a foundation is provided for detecting accuracy and reliability of the shaking degree of the wafer. And moreover, a visual image of wafer swing is captured through an image capturing device, and swing sound is captured through a sound capturing device and quantized into decibel values, so that judgment originally relying on subjective touch feeling and hearing of operators is converted into objective, visual and quantized image and sound parameters. The defects of large difference of judging results and poor repeatability in the prior art are effectively overcome, and a more accurate and reliable basis is provided for the evaluation of the wafer shaking degree detection. The upper end of the movable seat is provided with a clamp for clamping the lower end of the wafer, when the movable seat moves linearly to drive the clamp to move and drive the wafer to swing, the movable seat is always pressed down by the gravity of the clamp and the wafer more, the stability of the linear movement of the movable seat is ensured to be better, and further noise interference on the detection of the shaking degree of the wafer is reduced, but not when the clamp is arranged on the side edge of the