CN-122028706-A - Semiconductor packaging component pressure test module with multiple pressing blocks and semiconductor packaging component test equipment

Abstract

A semiconductor packaging component pressure measurement module with multiple pressing blocks is disclosed, the semiconductor packaging component pressure measurement module with multiple pressing blocks comprises a base and a plurality of movable pressing blocks, the base comprises an inner cavity and a plurality of open grooves, the open grooves are communicated with the inner cavity, the movable pressing blocks are accommodated in the open grooves of the base, the movable pressing blocks correspond to different areas on a semiconductor packaging component, and in response to the fact that the inner cavity is filled with high-pressure fluid, the movable pressing blocks generate downward pressure on the areas. A semiconductor package testing apparatus is also disclosed, the controller being adapted to control the fluid supply unit to supply high pressure fluid to the interior chamber of the base and to test the semiconductor package through the test seat.

Inventors

• LV MENGGONG
• CHEN JIANMING

Assignees

• 致茂电子(苏州)有限公司

Dates

Publication Date

20260512

Application Date

20241106

Claims (20)

1. 1. A semiconductor package member press-testing module having a plurality of press blocks adapted to test a semiconductor package member having a surface including a plurality of areas thereon, the semiconductor package member press-testing module having a plurality of press blocks comprising: A base including at least one inner chamber and a plurality of open slots connected to the at least one inner chamber, and The movable pressing blocks are respectively accommodated in the plurality of open grooves of the base; the plurality of movable pressing blocks respectively correspond to the plurality of areas on the semiconductor packaging component, and generate a downward pressure on the plurality of areas respectively in response to the at least one high-pressure fluid filled in the at least one internal cavity.
2. 2. The semiconductor package component compression module of claim 1, wherein the base further comprises a fixed compression block corresponding to one of the plurality of chips on the semiconductor package component.
3. 3. The semiconductor package component pressure measurement module of claim 1, wherein the at least one internal chamber comprises a first chamber and a second chamber, the plurality of open slots comprises a first open slot and a second open slot, the at least one high pressure fluid comprises a first high pressure fluid and a second high pressure fluid, the first open slot is in communication with the first chamber, the second open slot is in communication with the second chamber, and the plurality of movable pressure blocks generate a plurality of downforces to the plurality of regions in response to the first chamber and the second chamber being filled with the first high pressure fluid and the second high pressure fluid, respectively.
4. 4. The semiconductor package pressure measurement module according to claim 3, wherein the first high-pressure fluid and the second high-pressure fluid have different pressures.
5. 5. The semiconductor package component pressure measurement module according to claim 3, wherein the first high-pressure fluid and the second high-pressure fluid have different temperatures.
6. 6. The module of claim 1, wherein the base comprises an upper housing, a lower housing, and a seal, the at least one inner chamber is disposed in the upper housing, the plurality of open slots are disposed in the lower housing, the lower housing defines an annular groove surrounding the at least one inner chamber, and the seal is disposed in the annular groove.
7. 7. The module of claim 1, wherein the base comprises an upper housing, a lower housing, and a membrane, the at least one internal chamber is located in the upper housing, the plurality of open slots are located in the lower housing, and the membrane is interposed between the upper housing and the lower housing.
8. 8. The semiconductor package component pressure measurement module with multiple pressure blocks according to claim 1, further comprising at least one bladder received in the at least one internal chamber, wherein the multiple movable pressure blocks respectively generate the downward pressure to the multiple regions in response to the at least one bladder in the at least one internal chamber being filled with the at least one high pressure fluid.
9. 9. The semiconductor package component pressure measurement module according to claim 1, wherein each of the open slots comprises a radial extension and an axial through portion, each of the movable pressure blocks comprises a radial flange and an axial body, the axial body passes through the axial through portion, and the radial extension is adapted to block the radial flange.
10. 10. A semiconductor package member testing apparatus, comprising: the semiconductor package member press-testing module provided with a plurality of press blocks according to claim 1; A fluid supply unit connected to the at least one internal chamber; A test seat corresponding to the semiconductor packaging component pressing module with multiple pressing blocks and suitable for accommodating a semiconductor packaging component, and A controller electrically connected to the fluid supply unit and the test seat; The controller is suitable for controlling the fluid supply unit to supply the at least one high-pressure fluid to the at least one inner chamber of the semiconductor packaging component pressure testing module with the multiple pressing blocks, and is suitable for testing the semiconductor packaging component through the testing seat.
11. 11. The semiconductor package apparatus of claim 10, further comprising a displacement generating device electrically connected to the controller, wherein the base of the multi-press block semiconductor package pressing module is connected to the displacement generating device, and wherein the controller is adapted to control the displacement generating device to bring the multi-press block semiconductor package pressing module closer to or farther from the test base.
12. 12. The semiconductor package apparatus according to claim 10, wherein the fluid supply unit comprises a valve and a high-pressure fluid source, the high-pressure fluid source is connected to the at least one internal chamber, the valve is disposed between the high-pressure fluid source and the at least one internal chamber and is electrically connected to the controller, and the controller controls opening and closing of the valve to control whether the high-pressure fluid source supplies the at least one high-pressure fluid to the at least one internal chamber.
13. 13. The semiconductor package apparatus of claim 10, further comprising a fluid temperature control unit disposed between the high pressure fluid source and the at least one internal chamber and electrically connected to the controller, the controller controlling the fluid temperature control unit to regulate the temperature of the at least one high pressure fluid supplied to the at least one internal chamber.
14. 14. The semiconductor package apparatus of claim 10, further comprising a temperature control unit of the pressure measurement module, wherein the temperature control unit of the pressure measurement module is disposed on at least one of the base and the plurality of movable pressing blocks and is electrically connected to the controller, and wherein the controller controls the temperature control unit of the pressure measurement module to adjust the temperature of at least one of the base and the plurality of movable pressing blocks.
15. 15. The semiconductor package apparatus of claim 10, further comprising a test seat temperature control unit electrically connected to the controller, wherein the controller controls the test seat temperature control unit to adjust the temperature of the test seat.
16. 16. A semiconductor package member press-testing module having a plurality of press blocks adapted to test a semiconductor package member having a surface including a plurality of areas thereon, the semiconductor package member press-testing module having a plurality of press blocks comprising: A base including at least one interior chamber and a plurality of open slots, the plurality of open slots being in communication with the at least one interior chamber; a plurality of movable pressing blocks respectively accommodated in the plurality of open slots of the base, and At least one elastic piece which is accommodated in the at least one inner cavity and corresponds to the plurality of open grooves; The plurality of movable pressing blocks respectively correspond to the plurality of areas on the semiconductor packaging component, and the at least one elastic piece is pushed in response to the fact that at least one of the plurality of movable pressing blocks is subjected to an external force, and the at least one elastic piece drives the at least one of the plurality of movable pressing blocks to generate a downward pressure on the at least one of the plurality of areas.
17. 17. The semiconductor package component pressure measurement module with multiple pressure blocks according to claim 16, wherein the at least one internal chamber comprises multiple internal chambers, the at least one elastic piece comprises multiple elastic pieces, and the multiple elastic pieces are respectively accommodated in the multiple internal chambers and respectively correspond to the multiple open slots.
18. 18. The multi-press block semiconductor package component pressure measurement module according to claim 16, wherein the at least one elastic member is at least one selected from the group consisting of a spring, a rubber, and a shape memory alloy.
19. 19. The multi-press block semiconductor package component pressure measurement module according to claim 16, wherein the at least one elastic member comprises a bladder filled with a high pressure fluid.
20. 20. The semiconductor package pressure measurement module according to claim 19, wherein the material of the bladder is at least one selected from the group consisting of nylon, polyurethane, polyvinyl chloride, thermoplastic polyurethane, rubber, polyethylene, and silicone.

Description

Semiconductor packaging component pressure test module with multiple pressing blocks and semiconductor packaging component test equipment Technical Field The present invention relates to a testing device for semiconductor package components, and more particularly, to a pressure testing module for semiconductor package components with multiple pressing blocks. Background In conventional semiconductor package testing techniques, a single press head is typically used for testing. The main function of the pressure probe is to apply a pressing force to the semiconductor package to ensure a good electrical connection between the package and the test probe, thereby maintaining the effectiveness of the test. However, with the rapid development of semiconductor packaging technology, it has been difficult to meet the requirements of new generation technology, especially in the field of 3D packaging application, and these advanced packages can arrange multiple chips (such as CPU, GPU, SOC, logic chips or high-bandwidth memory) on the upper surface of the package body, which makes the packaging structure more complex. The chips are different in area, thickness and required stress conditions, and higher requirements are placed on the precision and equipment of the test. Thus, conventional test equipment relying on a single pressure probe has not been fully adapted for such advanced semiconductor packages. Because the existing single pressure measuring head can not be fully contacted with each chip, and proper pressing force is difficult to apply to all chips, the problem of uneven pressure distribution in the pressing test process is caused, the situation of overhigh or insufficient local pressure is easy to generate, and the local poor contact or even the whole semiconductor packaging component is warped (warpage) or deformed, so that the stability of packaging and the accuracy of a test result can be influenced finally. Disclosure of Invention In view of the foregoing, embodiments of the present invention provide a semiconductor package member press testing module and a semiconductor package member testing apparatus having multiple press blocks, which can apply a pressing force to multiple areas on a semiconductor package member at the same time, so as to ensure complete electrical contact between a chip and a probe of a test socket, and prevent the chip from deforming. In one embodiment, a semiconductor package component pressure measurement module with multiple pressing blocks is disclosed, wherein the semiconductor package component pressure measurement module with multiple pressing blocks comprises a base and multiple movable pressing blocks, the base comprises at least one inner cavity and multiple open slots, the open slots are communicated with the at least one inner cavity, the movable pressing blocks are respectively accommodated in the open slots of the base, the movable pressing blocks respectively correspond to different areas on the semiconductor package component, and the movable pressing blocks respectively generate downward pressure on the areas in response to filling of at least one high-pressure fluid in the at least one inner cavity. The plurality of regions may include a local region on a substrate of the semiconductor package, a chip (Dies) located on the substrate, and a local region on the chip. In an embodiment of the semiconductor package component compression module with multiple compression blocks, the base further comprises a fixed compression block corresponding to one of the chips on the semiconductor package component. In an embodiment of the semiconductor package component pressure measurement module with multiple pressing blocks, the at least one inner chamber comprises a first chamber and a second chamber, the plurality of open slots comprise a first open slot and a second open slot, the at least one high-pressure fluid comprises a first high-pressure fluid and a second high-pressure fluid, the first open slot is communicated with the first chamber, the second open slot is communicated with the second chamber, and the plurality of movable pressing blocks generate a plurality of lower pressures on the plurality of areas in response to the first chamber and the second chamber being respectively filled with the first high-pressure fluid and the second high-pressure fluid. In an embodiment of the semiconductor package component pressure measurement module with multiple pressure blocks, the first high pressure fluid and the second high pressure fluid are at different pressures. In an embodiment of the semiconductor package component pressure measurement module with multiple pressure blocks, the first high pressure fluid and the second high pressure fluid are at different temperatures. In an embodiment of the semiconductor packaging component pressure measurement module with multiple pressing blocks, the base comprises an upper shell, a lower shell and a sealing piece, wherein the at least