CN-122028722-A - Air bridge preparation method and device and electronic equipment

CN122028722ACN 122028722 ACN122028722 ACN 122028722ACN-122028722-A

Abstract

The invention discloses an air bridge preparation method and device and electronic equipment, and belongs to the technical field of chip preparation. The preparation method of the air bridge comprises the steps of obtaining an initial substrate, forming a hard supporting layer made of hard materials on the upper surface of the initial substrate, wherein the hardness of the hard materials is larger than that of the preset hardness, the preset hardness is determined by the hardness of photoresist, forming a target superconducting layer covering the hard supporting layer, and removing the hard supporting layer to obtain the target air bridge. In the air bridge preparation method, the hard support layer is prepared on the surface of the initial substrate by using a hardness material with hardness larger than preset hardness, and the target superconducting layer covering the hard support layer is used as an air bridge. Because the hardness of the hard material is larger than the preset hardness determined by the photoresist, when the hard material is used for preparing the hard support layer, the risk of collapse of the support layer in the preparation process can be effectively reduced, and the stability of the air bridge preparation process can be improved.

Inventors

JIA ZHILONG
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Assignees

本源量子计算科技（合肥）股份有限公司

Dates

Publication Date: 20260512
Application Date: 20241031

Claims (10)

1. A method of making an air bridge, the method comprising: Acquiring an initial substrate; Forming a hard support layer made of a hard material on the upper surface of the initial substrate, wherein the hardness of the hard material is greater than a preset hardness, and the preset hardness is determined by the hardness of photoresist; Forming a target superconducting layer covering the hard support layer; and removing the hard supporting layer to obtain the target air bridge.
2. The method of manufacturing an air bridge according to claim 1, wherein forming a hard support layer made of a hard material on an upper surface of the initial substrate comprises: Forming an initial support layer covering the upper surface of the initial substrate by using the hard material; forming a first photoresist mask on the upper surface of the initial supporting layer; And etching the initial supporting layer based on the first photoresist mask to obtain the hard supporting layer.
3. The method of claim 2, wherein forming a first photoresist mask on the upper surface of the initial support layer comprises: Coating photoresist on the upper surface of the initial supporting layer to form a first photoresist layer; And exposing and developing the first photoresist layer according to the preset position information of the hard supporting layer to obtain the first photoresist mask.
4. The method for preparing an air bridge according to claim 3, wherein the initial substrate has a coplanar waveguide signal line, the exposing and developing the first photoresist layer according to the preset position information of the hard support layer to obtain the first photoresist mask comprises: Determining the position information of the hard supporting layer according to the position information of the coplanar waveguide signal line, wherein the projection area of the hard supporting layer is connected with two grounding strips of the coplanar waveguide signal line along the direction perpendicular to the upper surface of the initial substrate; and processing the first photoresist layer by using a gray scale exposure process based on the position information of the hard support layer and developing to obtain the first photoresist mask with the preset shape.
5. The method of claim 4, wherein etching the initial support layer based on the first photoresist mask to obtain the hard support layer, comprises: And etching the initial support layer by adopting a dry etching process based on the first photoresist mask with the preset shape to obtain the hard support layer with the preset shape.
6. The method of claim 2, wherein the thickness of the first photoresist mask is equal to the thickness of the initial support layer.
7. The method of claim 1, wherein forming the target superconducting layer overlying the rigid support layer comprises: sputtering superconducting metal on the upper surfaces of the initial substrate and the hard supporting layer to form an initial superconducting layer; And based on the position information of the hard support layer, retaining the upper surface of the hard support layer and the initial superconductive layers corresponding to the pier areas at the two sides of the hard support layer.
8. The method for preparing an air bridge according to claim 7, wherein the step of reserving the initial superconducting layers of the upper surface of the hard support layer and the pier regions corresponding to both sides of the hard support layer according to the position information of the hard support layer comprises the steps of: Coating photoresist on the upper surface of the initial superconducting layer to form a second photoresist layer; Etching the second photoresist layer according to the position information of the hard support layer and the pier region to obtain a second photoresist mask, wherein the second photoresist mask covers the hard support layer and the pier region; And removing the initial superconducting layer which is not covered by the second photoresist mask by using a dry etching process.
9. An air bridge preparation apparatus, the apparatus comprising: the acquisition module is used for acquiring the initial substrate; The hard support layer preparation module is used for forming a hard support layer formed by a hard material on the upper surface of the initial substrate, wherein the hardness of the hard material is greater than a preset hardness, and the preset hardness is determined by the hardness of photoresist; a target superconducting layer preparation module for forming a target superconducting layer covering the hard support layer; and the removing module is used for removing the hard supporting layer to obtain the target air bridge.
10. An electronic device includes a processor; A memory for storing processor-executable instructions; Wherein the processor is configured to implement the air bridge fabrication method of any one of claims 1-8 by executing the executable instructions.

Description

Air bridge preparation method and device and electronic equipment Technical Field The invention belongs to the technical field of chip preparation, and particularly relates to an air bridge preparation method, an air bridge preparation device and electronic equipment. Background The air bridge is a suspended structure used for connecting the two sides of the potential unbalance position in the quantum chip, and the air bridge avoids direct contact with a lower circuit or a resonant cavity by suspending above the surface of the chip, thereby reducing electromagnetic loss. At present, an air bridge is prepared by adopting a photoresist sacrificial process, and the air bridge comprises the steps that a substrate is provided with an arched supporting structure formed by adopting photoresist reflow, the surface of the whole substrate is plated with metal, then the metal of a bridge deck and a bridge pier is reserved by adopting a photoetching process, redundant metal is etched, and finally the supporting structure is stripped and removed. However, in the existing method, the sacrificial layer made of photoresist is at risk of collapsing during the preparation of the air bridge, which can cause the collapse problem of the prepared air bridge deck. Therefore, how to improve the process stability of preparing air bridges is a problem to be solved. Disclosure of Invention The invention aims to provide an air bridge preparation method, an air bridge preparation device and electronic equipment, which are used for solving the defects in the prior art and improving the process stability of preparing an air bridge. The exemplary embodiment of the present application is implemented as follows. In a first aspect, examples of the present application provide an air bridge preparation method, the method comprising: Acquiring an initial substrate; Forming a hard support layer made of a hard material on the upper surface of the initial substrate, wherein the hardness of the hard material is greater than a preset hardness, and the preset hardness is determined by the hardness of photoresist; Forming a target superconducting layer covering the hard support layer; and removing the hard supporting layer to obtain the target air bridge. According to some examples of the present application, the forming a hard support layer composed of a hard material on an upper surface of the initial substrate includes: Forming an initial support layer covering the upper surface of the initial substrate by using the hard material; forming a first photoresist mask on the upper surface of the initial supporting layer; And etching the initial supporting layer based on the first photoresist mask to obtain the hard supporting layer. According to some examples of the present application, the forming a first photoresist mask on an upper surface of the initial support layer includes: Coating photoresist on the upper surface of the initial supporting layer to form a first photoresist layer; And exposing and developing the first photoresist layer according to the preset position information of the hard supporting layer to obtain the first photoresist mask. According to some examples of the present application, the initial substrate has a coplanar waveguide signal line, and the exposing and developing the first photoresist layer according to the preset position information of the hard support layer to obtain the first photoresist mask includes: Determining the position information of the hard supporting layer according to the position information of the coplanar waveguide signal line, wherein the projection area of the hard supporting layer is connected with two grounding strips of the coplanar waveguide signal line along the direction perpendicular to the upper surface of the initial substrate; and processing the first photoresist layer by using a gray scale exposure process based on the position information of the hard support layer and developing to obtain the first photoresist mask with the preset shape. According to some examples of the present application, the etching the initial support layer based on the first photoresist mask to obtain the hard support layer includes: And etching the initial support layer by adopting a dry etching process based on the first photoresist mask with the preset shape to obtain the hard support layer with the preset shape. According to some examples of the application, the thickness of the first photoresist mask is equal to the thickness of the initial support layer. According to some examples of the application, the forming the target superconducting layer overlying the hard support layer includes: sputtering superconducting metal on the upper surfaces of the initial substrate and the hard supporting layer to form an initial superconducting layer; And based on the position information of the hard support layer, retaining the upper surface of the hard support layer and the initial superconductive layers corresponding to th