CN-122028730-A - Semiconductor module and electronic device

CN122028730ACN 122028730 ACN122028730 ACN 122028730ACN-122028730-A

Abstract

A semiconductor module and an electronic device are provided. The semiconductor module includes a first semiconductor chip (31) and a second semiconductor chip (32) on which a switching element is formed, a first heat sink (21) provided on the second surface (1 b) side with respect to the first semiconductor chip (31) and on which the first semiconductor chip (31) is disposed, a second heat sink (22) provided on the second surface (1 b) side with respect to the second semiconductor chip (32) and on which the second semiconductor chip (32) is disposed, a sealing member (50) sealing the first semiconductor chip (31) and the second semiconductor chip (32), a first heat dissipation wiring layer (161 b) provided on the first surface (1 a) side with respect to the first semiconductor chip (31) and thermally connected to the first semiconductor chip (31), and a second heat dissipation wiring layer (162 b) provided on the first surface (1 a) side with respect to the second semiconductor chip (32) and thermally connected to the second semiconductor chip (32). Thereby, a semiconductor module capable of realizing heat dissipation from both sides can be provided.

Inventors

Shallow well woods Taro
AOSHIMA MASAKI

Assignees

株式会社电装
丰田自动车株式会社
未来瞻科技株式会社

Dates

Publication Date: 20260512
Application Date: 20251106
Priority Date: 20241111

Claims (6)

1. A semiconductor module having a first surface and a second surface on the opposite side of the first surface in the thickness direction, the semiconductor module being capable of being disposed between two connecting pipes in a cooling device with the first surface and the second surface interposed therebetween, The semiconductor module includes: A first semiconductor chip and a second semiconductor chip formed with a switching element; a first heat sink provided on the second surface side with respect to the first semiconductor chip, the first semiconductor chip being disposed on the first heat sink; A second heat sink provided on the second surface side with respect to the second semiconductor chip, the second semiconductor chip being disposed on the second heat sink; a sealing member sealing the first semiconductor chip and the second semiconductor chip; A first heat dissipation wiring layer disposed on the first surface side with respect to the first semiconductor chip and thermally connected to the first semiconductor chip, and And a second heat dissipation wiring layer disposed on the first surface side with respect to the second semiconductor chip and thermally connected to the second semiconductor chip.
2. The semiconductor module of claim 1, wherein, An insulating heat sink having a first face; The first heat dissipation wiring layer and the second heat dissipation wiring layer are covered by the insulating heat sink.
3. The semiconductor module of claim 1, wherein, The first semiconductor chip and the second semiconductor chip are connected in series; The semiconductor module has: A first wiring portion connected to the first semiconductor chip; A second wiring part connected with the second semiconductor chip, and A third wiring portion connecting the first semiconductor chip and the second semiconductor chip; the first wiring portion, the second wiring portion, and the third wiring portion are arranged on the first surface side with respect to the first semiconductor chip and the second semiconductor chip in a concentrated manner; The first wiring portion and the second wiring portion have portions arranged to face each other; The sealing member has a first sealing member sealing the first heat sink, the second heat sink, the first semiconductor chip, and the second semiconductor chip, and a second sealing member disposed on the first sealing member; The third wiring portion has a portion disposed on the second sealing member at a portion facing the first semiconductor chip; the first heat dissipation wiring layer is constituted by a portion of the third wiring portion that faces the first semiconductor chip; The second wiring portion has a wiring layer for the second wiring portion disposed on the first sealing member; The first wiring portion has a first wiring portion wiring layer disposed on the second sealing member, the first wiring portion wiring layer having a portion facing the second wiring portion wiring layer and a hole portion formed in a portion facing the second semiconductor chip; The second heat dissipation wiring layer is disposed on the second sealing member and in the hole portion of the first wiring layer, and is thermally connected to the second semiconductor chip by being connected to the second wiring layer through a via hole formed in the second sealing member.
4. The semiconductor module according to any one of claim 1 to 3, The device comprises: an electronic component connected to at least one of the first semiconductor chip and the second semiconductor chip, and A heat dissipation wiring layer for an electronic component, which is thermally connected to the electronic component; The electronic component is arranged on the second surface side; the heat dissipation wiring layer for electronic parts is arranged on the first surface side.
5. An electronic device, which is characterized in that, The device is provided with: a semiconductor module according to claim 1 to 4, and A cooling device having a flow path through which a cooling medium for cooling the semiconductor module flows; The cooling device has an inflow pipe into which the cooling medium flows, an outflow pipe from which the cooling medium flows, and a plurality of connecting pipes connecting the inflow pipe and the outflow pipe; the semiconductor module is arranged so as to be sandwiched between the two connection pipes; The first heat sink and the second heat sink are disposed at positions opposed to one of the two connecting pipes on the second surface side; the first heat dissipation wiring layer and the second heat dissipation wiring layer are arranged at positions opposite to the other connecting pipe positioned on the first surface side of the two connecting pipes.
6. The electronic device of claim 5, wherein, A joint member having an insulating substrate and an insulating heat conductive member is disposed between the semiconductor module and the connection pipe; the first heat dissipation wiring layer and the second heat dissipation wiring layer are covered with the insulating heat conduction member.

Description

Semiconductor module and electronic device Technical Field The present disclosure relates to a semiconductor module and an electronic device. Background Conventionally, a semiconductor module in which a semiconductor element is sealed with a molding resin has been proposed. Such a semiconductor module is disposed in contact with a cooler as shown in patent document 1, for example, and is used to construct an electronic device. In this electronic device, the semiconductor module is in contact with the cooler, and therefore, heat of the semiconductor element is released to the cooler. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2024-8238 Disclosure of Invention The present inventors have studied a semiconductor module including a first semiconductor chip and a second semiconductor chip connected in series. Specifically, in the semiconductor module, a first semiconductor chip is disposed on a first heat sink, and a second semiconductor chip is disposed on a second heat sink. Further, the present inventors studied to make an electronic device by bringing both ends in the stacking direction of the first semiconductor chip and the first heat sink in the semiconductor module into contact with a cooler. That is, an electronic device in which a semiconductor module is arranged so as to be sandwiched between coolers has been studied. However, in this semiconductor module, since the first heat sink and the second heat sink are disposed, the heat dissipation to the cooler disposed on the first heat sink and the second heat sink side becomes high, but the heat dissipation to the cooler disposed on the opposite side to the first heat sink and the second heat sink side may become low. That is, in the semiconductor module, the heat dissipation properties of both surfaces may be reduced. The purpose of the present disclosure is to provide a semiconductor module and an electronic device capable of performing heat dissipation on both sides. According to one aspect of the present disclosure, a semiconductor module includes a first surface and a second surface on an opposite side of the first surface in a thickness direction, the semiconductor module being capable of being disposed between two connection pipes in a cooling device with the first surface and the second surface interposed therebetween, the semiconductor module including a first semiconductor chip and a second semiconductor chip formed with a switching element, the first heat sink being disposed on the second surface side with respect to the first semiconductor chip, the first semiconductor chip being disposed on the first heat sink, the second heat sink being disposed on the second surface side with respect to the second semiconductor chip, the second semiconductor chip being disposed on the second heat sink, a sealing member sealing the first semiconductor chip and the second semiconductor chip, a first heat dissipation wiring layer being disposed on the first surface side with respect to the first semiconductor chip and being thermally connected to the first semiconductor chip, and the second heat dissipation wiring layer being disposed on the first surface side with respect to the second semiconductor chip and being thermally connected to the second semiconductor chip. Thus, the first heat sink and the second heat sink are disposed on the second surface side, and the first heat dissipation wiring layer and the second heat dissipation wiring layer are disposed on the first surface side. That is, the first heat sink and the first heat dissipation wiring layer are disposed on the opposite sides separately from the first semiconductor chip, and the second heat sink and the second heat dissipation wiring layer are disposed on the opposite sides separately from the second semiconductor chip. Therefore, when the semiconductor module is disposed so as to sandwich the first surface and the second surface between the two connection pipes of the cooling device, the heat in the first semiconductor chip and the second semiconductor chip can be released to both the connection pipe and the connection pipe. That is, the semiconductor module achieves heat dissipation from both sides. In addition, according to another aspect of the present disclosure, an electronic device includes the semiconductor module, a cooling device having a flow path through which a cooling medium for cooling the semiconductor module flows, the cooling device having an inflow pipe through which the cooling medium flows, an outflow pipe through which the cooling medium flows, and a plurality of connecting pipes connecting the inflow pipe and the outflow pipe, the semiconductor module being disposed so as to be sandwiched between the two connecting pipes, a first heat sink and a second heat sink being disposed at positions opposed to one of the two connecting pipes on a second surface side, and a first heat dissipation wiring layer and a second heat di