CN-122028733-A - Power module and power conversion device

Abstract

The embodiment of the application provides a power module and a power conversion device, relates to the technical field of electronic devices, and is used for improving the rigidity of a heat exchange plate and reducing the possibility of buckling deformation of the heat exchange plate. In the power conversion device, the power module comprises a power chip, a substrate and a heat exchange plate, wherein the power chip is arranged on the substrate, and the heat exchange plate is arranged on one side of the substrate away from the power chip. The heat exchanger is arranged on one side of the heat exchange plate, which is away from the power chip, and a containing cavity is arranged in the heat exchanger and used for Rong Zhihuan heat mediums. The heat exchange plate is in contact with a heat exchange medium. Deviating from base plate of heat exchange plate is provided with a truss on one side. The truss is accommodated in the accommodating cavity, and the truss is contacted with the heat exchange medium. Through setting up the truss in the heat exchange plate back of the body one side of base plate, and make truss and heat exchange medium contact to can promote the rigidity of heat exchange plate, and disperse and transfer the impact force of heat exchange medium to the heat exchange plate effectively, reduce the possibility that the heat exchange plate warp deformation appears.

Inventors

• Zhou Jiakan
• LIU ZHILING
• DING HAN
• FANG CHAO

Assignees

• 华为数字能源技术有限公司

Dates

Publication Date

20260512

Application Date

20241107

Claims (15)

1. 1. A power conversion apparatus, comprising: the power module comprises a power chip, a substrate and a heat exchange plate, wherein the power chip is arranged on the substrate, and the heat exchange plate is arranged on one side of the substrate far away from the power chip; The heat exchanger is arranged on one side of the heat exchange plate, which is away from the power chip, and a containing cavity is arranged in the heat exchanger and is used for Rong Zhihuan heat medium, and the heat exchange plate is in contact with the heat exchange medium; the truss is arranged on one side, away from the substrate, of the heat exchange plate, is accommodated in the accommodating cavity, and is in contact with the heat exchange medium; And one side of the power module, which is away from the heat exchanger, is arranged on the circuit board.
2. 2. The power conversion device according to claim 1, wherein a side of the heat exchange plate facing away from the substrate is a first side, the first side is accommodated in the accommodating cavity, and the first side is in contact with the heat exchange medium.
3. 3. The power conversion device of claim 2, wherein the heat exchange plate has a first side, the first side surrounding the first side, the heat exchanger being connected to the first side.
4. 4. The power conversion device according to claim 1, wherein a face of the heat exchange plate facing away from the substrate is a first face; A portion of the first face is in contact with the heat exchange medium and another portion of the first face is connected to the heat exchanger.
5. 5. The power conversion device of any of claims 1-4, wherein the truss comprises a first truss comprising a first chord and a plurality of first web members, One end of each first web member in the self extending direction is connected with the first chord member, and the other end is connected with the heat exchange plate.
6. 6. The power conversion device of claim 5, wherein the truss further comprises a second truss disposed on a side of the first truss remote from the heat exchange plate.
7. 7. The power conversion device of claim 6, wherein the second truss comprises a second chord and a plurality of second web members; each second web member is connected at one end in the self-extending direction to the second chord member, and at the other end to the first chord member.
8. 8. The power conversion device according to any one of claims 1-7, wherein the truss comprises a plurality of first planar trusses, each of the plurality of first planar trusses extending in a first direction and the plurality of first planar trusses being spaced apart in a second direction; The first direction and the second direction are parallel to the surface of the heat exchange plate, which is away from the substrate, and the first direction is intersected with the second direction.
9. 9. The power conversion device of claim 8, wherein the truss further comprises a second planar truss; the second plane trusses extend along the second direction, and two ends of the second plane trusses in the second direction are respectively connected with the two first plane trusses; two adjacent first planar trusses are connected through at least one second planar truss.
10. 10. The power conversion device according to any one of claims 1 to 9, wherein a projection of the truss in a thickness direction of the power module covers a projection of the power chip in the thickness direction of the power module.
11. 11. The power conversion device according to any one of claims 1 to 10, wherein a side of the heat exchange plate facing away from the substrate is further provided with a first reinforcing plate and a second reinforcing plate in this order in a thickness direction of the power module; one end of the first reinforcing plate in the thickness direction of the power module is connected with the heat exchange plate, and the other end of the first reinforcing plate is connected with the second reinforcing plate.
12. 12. The power conversion device according to claim 11, wherein an area S1 of a surface of the first reinforcing plate facing the heat exchange plate and an area S2 of a surface of the second reinforcing plate facing away from the first reinforcing plate satisfy S1. Ltoreq.S 2.
13. 13. A power module, comprising: A substrate; The power chip is arranged on the substrate; The heat exchange plate is arranged on one side of the substrate far away from the power chip; and one side of the heat exchange plate, which is far away from the substrate, is provided with the truss.
14. 14. The power module of claim 13 wherein the truss comprises a first truss including a first chord and a plurality of first web members, One end of each first web member in the self extending direction is connected with the first chord member, and the other end is connected with the heat exchange plate.
15. 15. The power module according to claim 13 or 14, wherein a first reinforcing plate and a second reinforcing plate are further provided in order along the thickness direction of the power module on a side of the heat exchange plate facing away from the substrate, one end of the first reinforcing plate in the thickness direction of the power module is connected to the heat exchange plate, and the other end is connected to the second reinforcing plate; The area S1 of the surface of the first reinforcing plate facing the heat exchange plate and the area S2 of the surface of the second reinforcing plate facing away from the first reinforcing plate satisfy that S1 is less than or equal to S2.

Description

Power module and power conversion device Technical Field The present application relates to the field of electronic devices, and in particular, to a power module and a power conversion device. Background With the increase of power consumption of electronic devices, such as photovoltaic devices including photovoltaic inverters, a large amount of heat can be generated during the operation of the power module, and if heat cannot be dissipated in time, the working efficiency and the service life of the power module can be affected. At present, the power module radiates heat in a mode of directly contacting with a heat exchange medium of the heat exchanger. As shown in fig. 1, a power conversion device 100 includes a power module 10, a heat exchanger 20, and a circuit board 30, and the power module 10 includes a power chip 1, a substrate 2, and a heat exchange plate 3. The power chip 1 is arranged on a substrate 2, and a heat exchange plate 3 is arranged on one side of the substrate 2 away from the power chip 1. The heat exchanger 20 is arranged on the side of the heat exchanger plate 3 facing away from the power chip 1. The side of the power module 10 facing away from the heat exchanger 20 is disposed on the circuit board 30. A housing 201 of the heat exchanger 20 is provided with a receiving chamber 202 therein. The side of the heat exchanger plate 3 facing away from the base plate 2 is accommodated in the accommodating chamber 202 and is in contact with the heat exchanger medium in the accommodating chamber 202. The heat exchange plate 3 is radiated by the heat exchange medium, and the substrate 2 and the power chip 1 on the substrate 2 are radiated. The heat exchange medium has certain pressure in the operation process, so that the heat exchange plate is easy to warp and deform, the heat radiation capacity of the heat exchange plate and the sealing between the heat exchange plate and the heat exchanger can be influenced, and the working efficiency, the service life and other performances of the power module are further influenced. Disclosure of Invention The application provides a power module and a power conversion device, which are used for improving the rigidity of a heat exchange plate and reducing the possibility of buckling deformation of the heat exchange plate. In order to achieve the above purpose, the application adopts the following technical scheme: In a first aspect of the present application, a power conversion device is provided, the power conversion device includes a circuit board, a power module, and a heat exchanger, the power module includes a power chip, a substrate, and a heat exchange plate, the power chip is disposed on the substrate, and the heat exchange plate is disposed on a side of the substrate away from the power chip. The heat exchanger is arranged on one side of the heat exchange plate, which is away from the power chip, and a containing cavity is arranged in the heat exchanger and used for Rong Zhihuan heat mediums. The heat exchange plate is in contact with a heat exchange medium. Deviating from base plate of heat exchange plate is provided with a truss on one side. The truss is accommodated in the accommodating cavity, and the truss is contacted with the heat exchange medium. One side of the power module, which is away from the heat exchanger, is arranged on the circuit board. The heat exchange medium of the heat exchanger is contacted with the heat exchange plate so as to carry out heat management on the power module through heat exchange between the heat exchange plate and the heat exchange medium. For example, the power chip may generate heat during operation, and the heat is transferred to the heat exchange plate through the substrate. The heat exchange plate is contacted with the heat exchange medium, and the heat exchange medium exchanges heat with the heat exchange plate, so that heat of the heat exchange plate is taken away. The heat of the heat exchange plate is transferred to the heat exchange medium, so that a temperature difference is generated between the substrate and the heat exchange plate, and the heat of the substrate can be continuously transferred to the heat exchange plate. Similarly, heat from the power chip can be continuously transferred to the substrate. Because the pressure of the heat exchange medium can lead to the buckling deformation of the part of the heat exchange plate contacted with the heat exchange medium, the heat dissipation capacity of the heat exchange plate and the sealing between the heat exchange plate and the heat exchanger can be influenced, and even the performances of the power module, such as the working efficiency, the service life and the like, can be influenced. In order to ensure the operation reliability of the power module, a truss is arranged on one side, away from the substrate, of the heat exchange plate, the truss is accommodated in the accommodating cavity, and the truss is in contact with a heat exchange medium. Th