CN-122028734-A - Cooling assembly and method for manufacturing a cooler

Abstract

A cooling assembly for dissipating heat generated by a semiconductor device and a method for manufacturing a cooler are provided. The assembly includes a cooler having a housing and a top plate defining an internal fluid passageway. The cooler includes at least one reinforcing structure disposed therein, the structure being constructed of a reinforcing material different from the material of the top plate or the housing. The reinforcing structure increases the structural rigidity of the cooler to mitigate warpage and the likelihood of mold cracking or delamination.

Inventors

• LIN CHENGYUAN

Assignees

• 半导体元件工业有限责任公司

Dates

Publication Date

20260512

Application Date

20251112

Priority Date

20251106

Claims (20)

1. 1. A cooling assembly, the cooling assembly comprising: a chiller, comprising: A housing; A top plate connected to the housing, the top plate and the housing defining a fluid passage; a fluid input port providing a fluid path into the fluid channel, and A fluid output port providing a fluid path out of the fluid channel, and A reinforcing structure disposed within the cooler, the reinforcing structure being composed of a reinforcing material different from the material of the top plate and the housing.
2. 2. The cooling assembly of claim 1, wherein the reinforcing material is ceramic.
3. 3. The cooling assembly of claim 1, wherein the reinforcing structure is embedded in the housing.
4. 4. A cooling assembly according to claim 3, wherein the housing comprises a recess in which the reinforcing structure is disposed, the housing comprising a seal disposed over the reinforcing structure and sealing the fluid passage.
5. 5. The cooling assembly of claim 1 wherein the reinforcing structure is embedded in the top plate.
6. 6. The cooling assembly of claim 5 wherein the top plate comprises: a base having a recessed area in which the reinforcing structure is disposed, and And the cover part is arranged on the reinforcing structure.
7. 7. The cooling assembly of claim 1 wherein the reinforcement structure is a first reinforcement structure, the cooling assembly comprising the first reinforcement structure embedded in the housing and a second reinforcement structure embedded in the top plate.
8. 8. The cooling assembly of claim 1, wherein the cooling assembly further comprises a semiconductor device bonded to the top plate.
9. 9. The cooling assembly of claim 8 wherein the semiconductor device comprises a silicon carbide die.
10. 10. A cooling assembly, the cooling assembly comprising: A cooler including a reinforcing structure disposed within the cooler, the reinforcing structure being composed of a reinforcing material different from a material of the cooler, and A power module coupled to the cooler.
11. 11. The cooling assembly of claim 10, wherein the power module is a first power module, the cooling assembly comprising a second power module and a third power module coupled to the cooler.
12. 12. The cooling assembly of claim 11, wherein each of the first, second, and third power modules is configured to provide an output corresponding to a phase of a three-phase electrical output.
13. 13. The cooling assembly of claim 10, wherein the power module includes a first transistor die corresponding to a high side of a half-bridge circuit and a second transistor die corresponding to a low side of the half-bridge circuit.
14. 14. The cooling assembly of claim 10, wherein the cooler comprises: Upper part, and A lower portion connected to the upper portion, the upper portion and the lower portion defining a fluid channel, wherein the reinforcing structure is embedded in at least one of the upper portion and the lower portion.
15. 15. The cooling assembly of claim 14 wherein the reinforcement structure is a first reinforcement structure, the cooling assembly comprising the first reinforcement structure embedded in the upper portion and a second reinforcement structure embedded in the lower portion.
16. 16. The cooling assembly of claim 10 wherein the reinforcing structure is comprised of a ceramic material.
17. 17. A method for manufacturing a cooler, the method comprising: providing a reinforcing structure in at least one of the top plate or the housing, the reinforcing structure being composed of a reinforcing material different from a material of at least one of the top plate and the housing, and The top plate is connected to the housing to form the cooler, the top plate and the housing defining a fluid passage, the cooler including a fluid input port providing a fluid path into the fluid passage and a fluid output port providing a fluid path out of the fluid passage.
18. 18. The method of claim 17, wherein disposing the reinforcing structure in at least one of the top plate and the housing comprises embedding the reinforcing structure in the housing.
19. 19. The method of claim 17, wherein disposing the reinforcing structure in at least one of the top plate and the housing comprises embedding the reinforcing structure in the top plate.
20. 20. The method of claim 17, wherein the reinforcing material is ceramic and the material of at least one of the housing and the top plate is aluminum.

Description

Cooling assembly and method for manufacturing a cooler Cross Reference to Related Applications The application claims the benefit of U.S. provisional application No.63/719,354 filed on day 11, 2024 and U.S. application No.19/381,897 filed on day 11, 2025, and 6, which are incorporated herein by reference in their entirety. Technical Field The present specification relates to semiconductor package assemblies, and more particularly, to a cooling assembly including a mechanical reinforcement for preventing warpage and a method for manufacturing a cooler. Background A semiconductor package assembly (e.g., a semiconductor device power module) may include a substrate bonded to a heat dissipation mechanism (e.g., a heat sink, a water jacket, etc.). Mechanical stresses due to thermal cycling can weaken the bond between the semiconductor package and the cooler, resulting in poor cooling performance and even flaking. Disclosure of Invention In a general aspect, a cooling assembly includes a cooler. The cooler includes a housing and a top plate connected to the housing, wherein the top plate and the housing define a fluid passage. The cooler also includes a fluid input port providing a fluid path into the fluid channel and a fluid output port providing a fluid path out of the fluid channel. The cooling assembly further includes a reinforcement structure disposed within the cooler, the reinforcement structure being composed of a reinforcement material different from the material of the top plate and the housing. In some aspects, the reinforcing material is a ceramic. In some aspects, the reinforcing structure is embedded in the housing. In some aspects, where the reinforcing structure is embedded in the housing, the housing includes a groove in which the reinforcing structure is disposed. The housing also includes a seal disposed over the reinforcing structure within the groove and sealing the fluid passage. In some aspects, the reinforcing structure is embedded in the top plate. In some aspects, where the reinforcing structure is embedded in the top panel, the top panel includes a base portion having a recessed area provided with the reinforcing structure and a cover portion provided on the reinforcing structure. In some aspects, the reinforcement structure is a first reinforcement structure embedded in the housing, and the cooling assembly includes a second reinforcement structure embedded in the top plate. In some aspects, the cooling assembly further comprises a semiconductor device bonded to the top plate. In some aspects, a semiconductor device includes a silicon carbide die. In another general aspect, a cooling assembly includes a cooler having a reinforcing structure disposed within the cooler. The reinforcing structure is composed of a reinforcing material different from that of the cooler. The cooling assembly also includes a power module coupled to the cooler. In some aspects, the power module is a first power module and the cooling assembly includes a second power module and a third power module coupled to the cooler. In some aspects, each of the first, second, and third power modules is configured to provide an output corresponding to the three-phase electrical output. In some aspects, a power module includes a first transistor die corresponding to a high side of a half-bridge circuit and a second transistor die corresponding to a low side of the half-bridge circuit. In some aspects, the cooler includes an upper portion and a lower portion connected to the upper portion, wherein the upper and lower portions define a fluid passage. The reinforcing structure is embedded in at least one of the upper and lower portions. In some aspects, the reinforcement structure is a first reinforcement structure embedded in the upper portion, and the cooling assembly includes a second reinforcement structure embedded in the lower portion. In some aspects, the reinforcing structure is composed of a ceramic material. In another general aspect, a method for manufacturing a cooler includes disposing a reinforcing structure in at least one of a top plate and a housing of the cooler. The reinforcing structure is composed of a reinforcing material different from that of at least one of the top plate and the housing. The method further includes connecting a top plate to the housing to form a cooler, wherein the top plate and the housing define a fluid passage. The cooler includes a fluid input port providing a fluid path into the fluid channel and a fluid output port providing a fluid path out of the fluid channel. In some aspects of the method, disposing the reinforcing structure in at least one of the top plate and the housing includes embedding the reinforcing structure in the housing. In some aspects of the method, disposing the reinforcing structure in at least one of the top plate and the housing includes embedding the reinforcing structure in the top plate. In some aspects of the method, the reinforcement material is ceramic