CN-122028735-A - Chip control method, device, chip, storage medium and program product

CN122028735ACN 122028735 ACN122028735 ACN 122028735ACN-122028735-A

Abstract

The embodiment of the application provides a chip control method, a chip control device, a chip, a storage medium and a program product. The method comprises the steps of collecting temperature data of a central area of a chip through a core temperature sensor, collecting temperature data of power modules corresponding to the local temperature sensors through each local temperature sensor, and controlling an operation mode of the chip according to temperature difference data between the temperature data of each power module and the temperature data of the central area. The method can effectively reduce the thermal failure risk of the chip, prolong the service life of the chip and improve the energy efficiency.

Inventors

ZHOU XIAOHONG
SONG ZHENGHUA
JIANG LIRONG
TAO LING
DE HAO

Assignees

武汉杰开科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260120

Claims (10)

1. A chip control method is characterized by being applied to a chip, wherein the chip comprises a core temperature sensor, a plurality of local temperature sensors and a plurality of power modules, each power module is provided with a double protection ring, and the method comprises the following steps: collecting temperature data of a central area of the chip through the core temperature sensor, and collecting temperature data of a power module corresponding to each local temperature sensor through each local temperature sensor; And controlling the operation mode of the chip according to temperature difference data between the temperature data of each power module and the temperature data of the central area.
2. The method of claim 1, wherein controlling the operating mode of the chip according to temperature difference data between the temperature data of each of the power modules and the temperature data of the central region comprises: Determining the load state of each power module according to temperature difference data between the temperature data of each power module and the temperature data of the central area; and controlling the operation mode of the chip according to the load state of each power module.
3. The method of claim 2, wherein determining the load status of each of the power modules based on temperature difference data between the temperature data of each of the power modules and the temperature data of the central region comprises: determining the temperature gradient of each power module according to the temperature difference data between the temperature data of the power module and the temperature data of the central area, wherein the temperature gradient represents the temperature change condition between the power module and the central area of the chip; And determining the load state of the power module according to the temperature gradient of the power module.
4. The method of claim 2, wherein controlling the operating mode of the chip according to the load status of each of the power modules comprises: And if the load state of the power module is determined to be an overload state, controlling the power module to reduce the output power.
5. The method of claim 1, wherein the local temperature sensor is embedded in a central region of the power module, and wherein a spacing between the local temperature sensor and a heat source of the power module is less than or equal to 50 μm.
6. The method according to any one of claims 1-5, further comprising: And determining the layout density and the position of each local temperature sensor according to the load characteristic of each power module.
7. A chip control device is characterized by being applied to a chip, wherein the chip comprises a core temperature sensor, a plurality of local temperature sensors and a plurality of power modules, each power module is provided with a double protection ring, and the device comprises: The acquisition module is used for acquiring temperature data of a central area of the chip through the core temperature sensor, and acquiring temperature data of a power module corresponding to each local temperature sensor through each local temperature sensor; And the control module is used for controlling the operation mode of the chip according to temperature difference data between the temperature data of each power module and the temperature data of the central area.
8. A chip, characterized in that the chip comprises a core temperature sensor, a plurality of local temperature sensors and a plurality of power modules, wherein each power module is provided with a double protection ring, the chip further comprises a memory and a processor, the memory stores computer execution instructions, and the processor executes the computer execution instructions stored in the memory, so that the processor executes the method according to any one of claims 1-6.
9. A computer readable storage medium having stored therein computer executable instructions which when executed by a processor are adapted to carry out the method of any one of claims 1-6.
10. A computer program product, characterized in that the computer program product comprises a computer program which, when executed by a processor, implements the method of any of claims 1-6.

Description

Chip control method, device, chip, storage medium and program product Technical Field The present application relates to the field of control technologies, and in particular, to a chip control method, a device, a chip, a storage medium, and a program product. Background In modern electronic devices, power management chips are widely used in automotive electronics, industrial control systems, and consumer electronics, and have a core function of providing stable power output for different loads through multiple power modules. With the improvement of chip integration, the density of the power module is obviously increased, so that the problem of local heating is increasingly serious, and therefore, accurate sensing of local heat distribution of the chip is required. In the prior art, a single global temperature sensor is adopted, the sensor is generally arranged in the central area of a chip, and whether the chip is in an over-temperature state or not is judged by collecting the whole temperature of the chip, and a protection mechanism (such as frequency reduction and turn-off) is triggered. However, in the above manner, a single sensor cannot cover the independent heating areas of the plurality of power modules of the chip, and there is a risk of local overheating failure of the chip. Disclosure of Invention The application provides a chip control method, a device, a chip, a storage medium and a program product, which can effectively reduce the thermal failure risk of the chip, prolong the service life of the chip and improve the energy efficiency. In a first aspect, the present application provides a chip control method, where the method is applied to a chip, the chip includes a core temperature sensor, a plurality of local temperature sensors, and a plurality of power modules, each of the power modules is provided with a double protection ring, and the method includes: collecting temperature data of a central area of the chip through the core temperature sensor, and collecting temperature data of a power module corresponding to each local temperature sensor through each local temperature sensor; And controlling the operation mode of the chip according to temperature difference data between the temperature data of each power module and the temperature data of the central area. In one possible implementation manner, the controlling the operation mode of the chip according to the temperature difference data between the temperature data of each power module and the temperature data of the central area includes: Determining the load state of each power module according to temperature difference data between the temperature data of each power module and the temperature data of the central area; and controlling the operation mode of the chip according to the load state of each power module. In one possible implementation manner, the determining the load state of each power module according to the temperature difference data between the temperature data of each power module and the temperature data of the central area includes: determining the temperature gradient of each power module according to the temperature difference data between the temperature data of the power module and the temperature data of the central area, wherein the temperature gradient represents the temperature change condition between the power module and the central area of the chip; And determining the load state of the power module according to the temperature gradient of the power module. In one possible implementation manner, the controlling the operation mode of the chip according to the load state of each power module includes: And if the load state of the power module is determined to be an overload state, controlling the power module to reduce the output power. In one possible implementation, the local temperature sensor is embedded in a central region of the power module, and a distance between the local temperature sensor and a heat source of the power module is less than or equal to 50 μm. In one possible embodiment, the method further comprises: And determining the layout density and the position of each local temperature sensor according to the load characteristic of each power module. In a second aspect, the present application provides a chip control device, the device being applied to a chip, the chip including a core temperature sensor, a plurality of local temperature sensors, and a plurality of power modules, each of the power modules having a dual guard ring disposed therein, the device comprising: The acquisition module is used for acquiring temperature data of a central area of the chip through the core temperature sensor, and acquiring temperature data of a power module corresponding to each local temperature sensor through each local temperature sensor; And the control module is used for controlling the operation mode of the chip according to temperature difference data between the temperature data of each power module