CN-122028738-A - Nitrogen cube device

CN122028738ACN 122028738 ACN122028738 ACN 122028738ACN-122028738-A

Abstract

The invention relates to the field of chip heat dissipation, and provides a nitrogen cube device. The nitrogen cube device comprises a liquid nitrogen cavity module, a fixing module, a heat preservation heat transfer module, a liquid nitrogen circulation module, a temperature regulation module and a safety protection module, wherein the liquid nitrogen cavity module is used for containing cooling media, the fixing module is configured in the liquid nitrogen cavity module and used for installing electronic devices, the heat preservation heat transfer module is arranged between the fixing module and the liquid nitrogen cavity module and used for conducting heat transfer between the electronic devices and the cooling media, the liquid nitrogen circulation module is communicated with the liquid nitrogen cavity module and used for realizing supply, recovery and liquefaction circulation of the cooling media, the temperature regulation module is electrically connected with the liquid nitrogen cavity module, the heat preservation heat transfer module and the liquid nitrogen circulation module and used for collecting temperature data and adjusting operation parameters of the liquid nitrogen circulation module or heat resistance of the heat preservation heat transfer module according to the temperature data, and the safety protection module is communicated with the liquid nitrogen cavity module and used for monitoring pressure and leakage states of the liquid nitrogen cavity module. The nitrogen cube device can realize accurate control of chip temperature in a liquid nitrogen cooling scene and solve the problem of downtime.

Inventors

ZHANG XUDONG
SHI JIAHAO
LIU JING

Assignees

中国科学院理化技术研究所

Dates

Publication Date: 20260512
Application Date: 20260119

Claims (10)

1. A nitrogen cube apparatus, comprising: A liquid nitrogen cavity module (100) for containing a cooling medium; a fixing module (102) configured in the liquid nitrogen cavity module (100) and used for installing an electronic device (120); the heat preservation and heat transfer module (104) is arranged between the fixing module (102) and the liquid nitrogen cavity module (100) and is used for conducting heat transfer between the electronic device (120) and a cooling medium; the liquid nitrogen circulation module (106) is communicated with the liquid nitrogen cavity module (100) and is used for realizing the supply, recovery and liquefaction circulation of a cooling medium; The temperature regulation and control module (108) is electrically connected with the liquid nitrogen cavity module (100), the heat preservation and heat transfer module (104) and the liquid nitrogen circulation module (106) and is used for acquiring temperature data and regulating the operation parameters of the liquid nitrogen circulation module (106) or the thermal resistance of the heat preservation and heat transfer module (104) according to the temperature data; And the safety protection module (110) is communicated with the liquid nitrogen cavity module (100) and is used for monitoring the pressure and leakage state of the liquid nitrogen cavity module (100).
2. The nitrogen cube set of claim 1, wherein the insulated heat transfer module (104) comprises at least one of a cold plate module (112), a spray module (114), a submerged module (116), and a cryogenic nitrogen module (118).
3. The nitrogen cube set of claim 2, wherein when the keep warm heat transfer module (104) is a cold plate module (112), the cold plate module (112) comprises: The cold plate body is internally provided with a micro-channel for flowing through liquid nitrogen; The heat preservation structure (122), heat preservation structure (122) include with the outside laminating of cold plate body phase change material layer, and be used for adjusting phase change material layer with cold plate body degree of adhesion's electric putter.
4. The nitrogen cube set of claim 2, wherein when the keep warm heat transfer module (104) is a spray module (114), the spray module (114) comprises: a heat transfer plate, the surface of which is provided with a micron-sized groove; The spraying unit is arranged above the heat transfer plate and is used for spraying liquid nitrogen to the surface of the heat transfer plate; the heat insulation structure (122), the heat insulation structure (122) include with the aerogel heat preservation with adjustable that heat transfer plate back set up relatively, and be used for adjusting the aerogel heat preservation with servo motor in heat transfer plate clearance.
5. The nitrogen cube apparatus of claim 2, wherein when the keep warm heat transfer module (104) is a submerged module (116), the submerged module (116) comprises: the heat transfer matrix is made of aluminum nitride ceramic matrix composite material, and the surface of the heat transfer matrix is provided with honeycomb micro-channels for being immersed in liquid nitrogen; And the heat insulation structure (122) is a composite heat insulation layer for wrapping the aerogel felt and the phase change material outside the heat transfer matrix.
6. The nitrogen cube set of claim 2, wherein when the keep warm heat transfer module (104) is a cryogenic nitrogen module (118), the cryogenic nitrogen module (118) comprises: the heat transfer structure is an aluminum fin type heat exchanger and is used for flowing low-temperature nitrogen; the heat preservation structure (122) is a polyurethane heat preservation sleeve wrapping the outside of the heat transfer structure, and an adjustable ventilation opening and a stepping motor used for controlling the opening of the adjustable ventilation opening are arranged on the polyurethane heat preservation sleeve.
7. The nitrogen cube set of any one of claims 1 to 6, wherein the temperature regulation module (108) comprises: At least one platinum resistance temperature sensor arranged on the surface of the electronic device (120), in the liquid nitrogen cavity module (100) or in the heat preservation and heat transfer module (104); And the PLC is electrically connected with the at least one platinum resistance temperature sensor and is used for receiving the temperature data and generating a control instruction according to a PID algorithm.
8. The nitrogen cube set as defined in any one of claims 1-6, wherein the liquid nitrogen circulation module (106) is connected to the liquid nitrogen cavity module (100) through a stainless steel bellows, and the liquid nitrogen circulation module (106) comprises a high-pressure liquid nitrogen storage tank, a variable-frequency booster pump, a condenser and a nitrogen recovery pipeline, the variable-frequency booster pump is connected to the high-pressure liquid nitrogen storage tank, the cooling efficiency of the condenser is greater than or less than 95%, and a flow control valve and a filtering unit are arranged on the nitrogen recovery pipeline, and the flow control valve and the filtering unit are used for filtering and conveying nitrogen evaporated from the liquid nitrogen cavity module (100) to the condenser for liquefaction.
9. The nitrogen cube set of any one of claims 1 to 6, wherein the safety protection module (110) comprises a pressure sensor for monitoring the internal pressure of the liquid nitrogen cavity module (100), a pressure sensor, a liquid nitrogen leak detector, an electromagnetic pressure relief valve, and an audible and visual alarm, the safety protection module (110) further configured to, upon detection of an overrun in pressure, a leak, or a critical component temperature anomaly, link the liquid nitrogen circulation module (106) to shut off the liquid nitrogen supply and activate the electromagnetic pressure relief valve to relieve pressure while simultaneously issuing an alarm via the audible and visual alarm and sending an alarm signal to the operation and maintenance system.
10. The nitrogen cube set of any one of claims 1-6, wherein the securing module (102) comprises an adjustable clamp structure having a pressure adjustment range of 5-15N and configured to accommodate differently sized electronic devices (120), a thermally conductive silicone gasket disposed between the adjustable clamp structure and the electronic devices (120), the adjustable clamp structure compressing the electronic devices (120) against the thermal heat transfer module (104) through the thermally conductive silicone gasket to absorb thermal stresses while ensuring thermal connection.

Description

Nitrogen cube device Technical Field The invention relates to the field of chip heat dissipation, and provides a nitrogen cube device. Background With the continuous improvement of the performance of electronic devices, the problem of heat dissipation becomes one of the key bottlenecks for limiting the release of the performance. Under the extreme heat flux, how to effectively dissipate heat becomes an important subject for guaranteeing the stable operation of equipment and prolonging the service life. In the current state of the art, liquid nitrogen is considered to be one of the optimal cooling working fluids, particularly in extreme heat dissipation scenarios, because of its extremely low boiling point (-196 ℃), high latent heat of phase change (200 kJ/kg), and excellent electrical insulation and chemical stability. The liquid nitrogen cooling technology has been applied in the early stage for its physical and chemical properties, basic cooling principle and application scheme. However, the hardware design operating temperature range of conventional computers and industrial control chips and the like is typically limited to between-40 ℃ and 85 ℃. When the chip temperature is lower than-40 ℃, the motherboard can trigger a low-temperature protection mechanism, so that the system automatically fails. In addition, the low temperature can cause thermal stress cracks, metal welding spots to fall off and abnormal behaviors of electronic elements of the chip packaging material, and the reliability and durability of the device are seriously affected. Therefore, the existing liquid nitrogen cooling technology faces two major challenges, namely, the heat transfer and heat preservation balance problem, the technology mainly focuses on enhancing the heat transfer function through soaking or cold plates and the like, but a structure which is not designed to effectively control low temperature formation can cause the chip temperature to be too low, and the problem of scene suitability, and the requirement of the full-range heat flux density of 50-2000W/cm 2 can not be met by a single heat exchange form. Disclosure of Invention The embodiment of the invention provides a nitrogen cube device, which is used for solving the defects that the liquid nitrogen cooling technology in the related technology cannot accurately control the temperature and has relatively narrow adaptability. An embodiment of the present invention provides a nitrogen cube apparatus, including: the liquid nitrogen cavity module is used for accommodating a cooling medium; The fixing module is configured in the liquid nitrogen cavity module and is used for installing electronic devices; the heat preservation and heat transfer module is arranged between the fixing module and the liquid nitrogen cavity module and is used for conducting heat transfer between the electronic device and the cooling medium; The liquid nitrogen circulation module is communicated with the liquid nitrogen cavity module and is used for realizing the supply, recovery and liquefaction circulation of a cooling medium; The temperature regulation and control module is electrically connected with the liquid nitrogen cavity module, the heat preservation and heat transfer module and the liquid nitrogen circulation module and is used for collecting temperature data and regulating the operation parameters of the liquid nitrogen circulation module or the thermal resistance of the heat preservation and heat transfer module according to the temperature data; And the safety protection module is communicated with the liquid nitrogen cavity module and is used for monitoring the pressure and leakage state of the liquid nitrogen cavity module. According to one embodiment of the invention, the heat-preserving and heat-transferring module comprises at least one of a cold plate module, a spraying module, a immersing module and a low-temperature nitrogen module. According to one embodiment of the present invention, when the heat-preserving and heat-transferring module is a cold plate module, the cold plate module includes: The cold plate body is internally provided with a micro-channel for flowing through liquid nitrogen; The heat preservation structure comprises a phase change material layer attached to the outer portion of the cold plate body and an electric push rod used for adjusting the attachment degree of the phase change material layer and the cold plate body. According to one embodiment of the present invention, when the heat-preserving and heat-transferring module is a spray module, the spray module includes: a heat transfer plate, the surface of which is provided with a micron-sized groove; The spraying unit is arranged above the heat transfer plate and is used for spraying liquid nitrogen to the surface of the heat transfer plate; The heat insulation structure comprises an adjustable aerogel heat insulation layer which is arranged opposite to the back of the heat transfer plate, and a servo