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CN-122028749-A - Substrate holder with sheet and patterned conductive structures of different thickness

CN122028749ACN 122028749 ACN122028749 ACN 122028749ACN-122028749-A

Abstract

According to some embodiments, a substrate holder (100) is configured for connecting a carrier (102) with an electronic component (104) of a package (106), wherein the substrate holder (100) comprises an electrically insulating and thermally conductive sheet member (108), and a patterned electrically conductive structure (110) located on a main surface of the electrically insulating and thermally conductive sheet member (108) and having at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2).

Inventors

  • CHEN YIDING
  • C. P. Tommy Qiu
  • Qiu Meifen
  • Su Meiwan
  • QIU WEIHAN

Assignees

  • 英飞凌科技奥地利有限公司

Dates

Publication Date
20260512
Application Date
20251111
Priority Date
20241112

Claims (20)

  1. 1. A substrate holder (100) for connecting a carrier (102) with an electronic component (104) of a package (106), wherein the substrate holder (100) comprises: electrically insulating and thermally conductive sheet member (108), and -A patterned electrically conductive structure (110), the patterned electrically conductive structure (110) being located on a main surface of the electrically insulating and thermally conductive sheet member (108) and having at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2), wherein a first connection section having a thickness (d 1) different from a thickness (d 2) of a second connection section is directly connected to an exposed lead section (130) of the carrier (102) and the second connection section is directly connected to the electronic component (104).
  2. 2. The substrate holder (100) according to claim 1, wherein at least one of the at least two different connection sections (112-115) comprises a metal post (116).
  3. 3. The substrate holder (100) according to claim 1 or 2, wherein the at least two different connection sections (112-115) comprise a first metal pillar (116) and a second metal pillar (118) having different vertical extensions (l 1, l 2).
  4. 4. A substrate holder (100) according to any of claims 1-3, wherein the at least two different connection sections (112-115) comprise a first sheet metal part (160) and a second sheet metal part (162) with different vertical extensions (s 1, s 2).
  5. 5. The substrate holder (100) according to any of claims 1-4, wherein at least one of the at least two different connection sections (112-115) comprises a plating structure (120) at an interface area with the carrier (102) or with the electronic component (104).
  6. 6. The substrate holder (100) according to any of claims 1-5, comprising one of the following features: Wherein different ones of the at least two different connection sections (112-115) are electrically decoupled from each other; Wherein different ones of the at least two different connection sections (112-115) are electrically coupled to each other.
  7. 7. The substrate holder (100) according to any one of claims 1-6, wherein the electrically insulating and thermally conductive sheet member (108) is flat, having a uniform thickness (F).
  8. 8. The substrate holder (100) according to any one of claims 1-7, wherein the electrically insulating and thermally conductive sheet member (108) comprises or consists of a ceramic.
  9. 9. Substrate holder (100) according to any one of claims 1-8, comprising a further electrically conductive structure (126) on the opposite other main surface of the electrically insulating and thermally conductive sheet member (108), in particular made of a solderable material.
  10. 10. The substrate holder (100) according to claim 9, wherein the further electrically conductive structure (126) is a continuous layer, in particular having a uniform thickness.
  11. 11. The substrate holder (100) according to any of claims 1-10, wherein the substrate holder (100) is configured as one of a direct copper bonded substrate, a direct aluminum bonded substrate, and an active metal brazed substrate.
  12. 12. A package (106), comprising: a carrier (102); an electronic component (104) mounted on the carrier (102), and The substrate holder (100) according to any of claims 1-11, the substrate holder (100) connecting the carrier (102) with the electronic component (104), wherein at least one of the at least two different connection sections (112-115) establishes an electrically conductive connection with the carrier (102) and at least another of the at least two different connection sections (112-115) establishes an electrically conductive connection with the electronic component (104).
  13. 13. The package (106) of claim 12, comprising at least one of the following features: -the package (106) comprising at least one further substrate holder (100) according to any of claims 1-11; Wherein the substrate holder (100) connects at least two different sections (128, 130) of the carrier (102) and/or connects at least two electronic components (104); Wherein the carrier (102) comprises a component assembly section (128) on which the electronic component (104) is mounted and at least one lead section (130) electrically coupled with at least one electronic component (104) and/or with the component assembly section (128), wherein the component assembly section (128) is connected with one of at least two connection sections (112, 114) and the at least one lead section (130) is connected with the other of the at least two connection sections (112, 114).
  14. 14. The package (106) of claim 12 or 13, comprising at least one of the following features: Wherein a major surface of the substrate holder (100) opposite the patterned conductive structure (110) forms part of an outer surface of the package (106); wherein a major surface of the carrier (102) forms part of an outer surface of the package (106).
  15. 15. The package (106) according to any one of claims 12-14, comprising an encapsulant (132), such as a molding compound, the encapsulant (132) encapsulating a portion of the carrier (102), at least a portion of the substrate holder (100), and at least a portion of the electronic component (104), wherein the substrate holder (100) protrudes from the encapsulant (132) or is coplanar with the encapsulant (132).
  16. 16. The package (106) according to any one of claims 12-15, wherein the electronic component (104) is arranged in a flip-chip configuration and has an active area on its front side connected to the carrier (102).
  17. 17. The package (106) of any of claims 12-16, comprising at least one of the following features: Wherein the electronic component (104) and the further electronic component (104') are connected in a half-bridge configuration; wherein the at least two different connecting sections (112-115) have at least three different thicknesses; Wherein the at least two different connection sections (112-115) have a first thickness connecting the electronic component (104), a second thickness connecting further electronic components (104'), and a third thickness connecting the carrier (102); comprising at least one further electronic component (104') mounted on the carrier (102); Wherein the electronic component (104) comprises at least one terminal facing the substrate holder (100); wherein the electronic component (104) has at least one terminal on each of its two opposite major surfaces; Wherein the electronic component (104) is a vertical electronic component; Wherein the electronic component (104) is a lateral electronic component.
  18. 18. A method of manufacturing a substrate holder (100) for connecting a carrier (102) with an electronic component (104) of a package (106), wherein the method comprises: providing an electrically insulating and thermally conductive sheet member (108), and -Forming a patterned electrically conductive structure (110) on a main surface of the electrically insulating and thermally conductive sheet member (108) such that the patterned electrically conductive structure (110) has at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2), wherein a first connection section having a thickness (d 1) different from a thickness (d 2) of a second connection section is directly connected to the exposed lead section (130) of the carrier (102) and the second connection section is directly connected to the electronic component (104).
  19. 19. The method of claim 18, wherein the method comprises forming the patterned conductive structure (110) with the at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2): Processing the initial conductive structure (132) using a first mask (134) to form an intermediate conductive structure (136) having a uniform thickness (d 2), and Thereafter, the intermediate conductive structure (136) is processed using a second mask (138) to obtain the patterned conductive structure (110) having the at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2).
  20. 20. The method of claim 18, wherein the method comprises forming the patterned conductive structure (110) with the at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2): providing an initial conductive structure (150) having a uniform thickness (d 0), and Thereafter, at least one post (116, 118) is attached to the initial conductive structure (150), thereby obtaining the patterned conductive structure (110) having the at least two different connection sections (112-115), the at least two different connection sections (112-115) having different thicknesses (d 1, d 2).

Description

Substrate holder with sheet and patterned conductive structures of different thickness Technical Field Various embodiments relate generally to substrate holders, packages, and methods of manufacturing substrate holders. Background A package may be represented as an encapsulated electronic component, for example, having exposed electrical connections and being mountable on an electronic peripheral component (e.g., on a printed circuit board). Packaging cost is an important driving force for industry. Related to this are performance, size and reliability. The different packaging solutions are manifolds and have to address the needs of the application. Disclosure of Invention A package and corresponding components that can be manufactured in a simple manner and have high reliability may be needed. According to an exemplary embodiment, a substrate holder for connecting a carrier with a packaged electronic component is provided, wherein the substrate holder comprises an electrically insulating and thermally conductive sheet member, and a patterned electrically conductive structure on a main surface of the electrically insulating and thermally conductive sheet member and having at least two different connection sections, the two different connection sections having different thicknesses. According to another exemplary embodiment, a package is provided, the package comprising a carrier, an electronic component mounted on the carrier, and a substrate holder having the above-mentioned features connecting the carrier with the electronic component, wherein at least one of the at least two different connection sections establishes an electrically conductive connection with the carrier, and at least another of the at least two different connection sections establishes an electrically conductive connection with the electronic component. According to yet another exemplary embodiment, a method of manufacturing a substrate holder for connecting a carrier with an encapsulated electronic component is provided, wherein the method comprises providing an electrically insulating and thermally conductive sheet member, and forming a patterned electrically conductive structure on a main surface of the electrically insulating and thermally conductive sheet member such that the patterned electrically conductive structure has at least two different connection sections having different thicknesses. According to an exemplary embodiment, a substrate suitable as a jig may be provided. Such a substrate holder can be configured for connecting the carrier with the electronic components in the package in an efficient manner and with the possibility of providing an extended functionality. Such substrate holders may have an electrically insulating and thermally conductive sheet member (e.g. a ceramic plate) providing a dielectric function with the possibility to assist in removing heat generated by the electronic components during operation of the package. The patterned conductive structure may be formed on one side of the sheet member, and may be provided with two or more connection sections having different thicknesses. Such multi-level electrically conductive structures on electrically insulating and thermally conductive sheet members can provide clip functionality by connecting different connection sections with different package components (e.g., carriers and electronic components). This may allow for electrically coupling the carrier and the electronic component in a compact and efficient manner without adding significant complexity to the manufacturing process, and potentially providing additional electrical and thermal coupling functionality to the clip and package as a whole. Illustratively, the carrier substrate may be reconfigured to have multiple connection sections of different thickness on the same major surfaces of the dielectric and thermally conductive sheet members for additional use as a fixture for establishing electrical connections between components at different elevation levels while providing galvanic separation and heat dissipation functionality. Description of other exemplary embodiments Hereinafter, other exemplary embodiments of the substrate holder, package, and method will be explained. In the context of the present application, the term "substrate holder" may particularly denote a mixture of an electrically conductive holder, which is capable of achieving an electrical connection at two or more different levels, with a substrate, which provides electrical insulation and thermal conductivity functionality through correspondingly configured plates. With a common insulating substrate, it may be advantageous to provide more than one patterned conductive structure on one major surface of the substrate. For example, a first conductive structure may be used to connect a drain pad of an electronic component to a drain lead of a carrier, and a second conductive structure may be used to connect a source pad of an electronic