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CN-122028754-A - Packaging carrier plate, preparation method thereof and semiconductor packaging structure

CN122028754ACN 122028754 ACN122028754 ACN 122028754ACN-122028754-A

Abstract

The application provides a packaging carrier plate and a preparation method thereof as well as a semiconductor packaging structure, wherein the packaging carrier plate comprises a packaging substrate, a packaging substrate and a packaging substrate, wherein the packaging substrate comprises an inorganic substrate and an organic substrate, the inorganic substrate is provided with a through groove penetrating along the thickness direction, the organic substrate is embedded in the through groove, and the organic substrate comprises a first through hole penetrating through the organic substrate along the thickness direction; and the conductive structure is at least partially positioned in the first through hole. The packaging substrate integrates the characteristics of the inorganic substrate and the organic substrate, and solves the problem that the rigidity is insufficient and the wiring requirement is difficult to be compatible in large-size packaging.

Inventors

  • ZHOU YANXU

Assignees

  • 苏州国显创新科技有限公司

Dates

Publication Date
20260512
Application Date
20260415

Claims (10)

  1. 1. A package carrier, comprising: The packaging substrate comprises an inorganic substrate and an organic substrate, wherein the inorganic substrate is provided with a through groove penetrating in the thickness direction, the organic substrate is embedded in the through groove, and the organic substrate comprises a first through hole penetrating through the organic substrate in the thickness direction; and the conductive structure is at least partially positioned in the first through hole.
  2. 2. The package carrier of claim 1, wherein the inorganic substrate is a glass substrate.
  3. 3. The package carrier of claim 1, wherein the conductive structure comprises a conductive layer comprising a ring-shaped structure and surrounding a first opening extending in the thickness direction, the first opening being filled with an insulating structure.
  4. 4. The package carrier of claim 1, further comprising a seed layer comprising a first portion between a wall of the first via and the conductive structure, further comprising a second portion covering at least a portion of a surface of the organic substrate and a third portion covering at least a portion of a surface of the inorganic substrate.
  5. 5. The package carrier of claim 4, wherein a surface of at least one side of the organic substrate is flush with a surface of the inorganic substrate on the same side.
  6. 6. The package carrier of claim 1, further comprising a bonding layer between the organic substrate and the inorganic substrate, the organic substrate being secured to a wall of the through-slot by the bonding layer.
  7. 7. The package carrier of claim 1, further comprising a redistribution layer disposed on at least one side of the package substrate, the redistribution layer comprising at least one dielectric layer and at least one circuit layer, the circuit layer being electrically connected to the conductive structures; the rewiring layer covers at least part of the surface of the organic substrate and at least part of the surface of the inorganic substrate.
  8. 8. A method of manufacturing a package carrier, the method comprising: providing an inorganic substrate, and forming a through groove penetrating in the thickness direction in the inorganic substrate; Embedding an organic substrate in the through groove to form a packaging substrate; Forming a first through hole penetrating in the thickness direction in the organic substrate; And forming a conductive structure in the first through hole.
  9. 9. The method of manufacturing a package carrier of claim 8, wherein forming a conductive structure within the first via comprises: Forming a conductive layer at least covering the hole wall of the first through hole, wherein the conductive layer encloses a first open hole; filling an insulating material in the first opening to form an insulating structure; depositing at least one layer of conductive material on the surface of the packaging substrate, and forming a circuit layer through patterning treatment; And manufacturing at least one dielectric layer to form a rewiring layer.
  10. 10. A semiconductor package structure comprising the package carrier according to any one of claims 1 to 7.

Description

Packaging carrier plate, preparation method thereof and semiconductor packaging structure Technical Field The present application relates to the field of semiconductor packaging technology, and in particular, to a packaging carrier, a method for manufacturing the same, and a semiconductor packaging structure. Background With the development of high-performance chips, the chip integration level is higher and the interconnection density is higher and denser. The multi-chip stack places higher demands on the IC carrier, requires larger dimensions, lower warpage and high planarity, and avoids solder layer failure. Conventional organic substrates cannot support large-sized packages due to mechanical strength issues. Disclosure of Invention In view of the above, the present application is directed to a package carrier, a method for manufacturing the same, and a semiconductor package structure for reducing the risk of warpage of a substrate. Based on the above object, the present application provides, in a first aspect, a package carrier, comprising: The packaging substrate comprises an inorganic substrate and an organic substrate, wherein the inorganic substrate is provided with a through groove penetrating in the thickness direction, the organic substrate is embedded in the through groove, and the organic substrate comprises a first through hole penetrating through the organic substrate in the thickness direction; and the conductive structure is at least partially positioned in the first through hole. Optionally, the inorganic substrate is a glass substrate. Optionally, the conductive structure includes a conductive layer, the conductive layer includes a ring structure and encloses a first opening extending along the thickness direction, and the first opening is filled with an insulating structure. Optionally, the package carrier further includes a seed layer, where the seed layer is at least located between the hole wall of the first through hole and the conductive structure; optionally, the seed layer includes an adhesion sub-layer and a conductive sub-layer that are stacked, the adhesion sub-layer is in contact with the hole wall of the first through hole, and the conductive sub-layer is in contact with the conductive structure; optionally, the seed layer includes a first portion covering the first via wall, a second portion covering at least a portion of the surface of the organic substrate, and a third portion covering at least a portion of the surface of the inorganic substrate. Optionally, the surface of at least one side of the organic substrate is flush with the surface of the inorganic substrate on the same side; alternatively, the surfaces of the opposite sides of the organic substrate are respectively flush with the surfaces of the inorganic substrate. Optionally, the package carrier further includes a bonding layer, the bonding layer is located between the organic substrate and the inorganic substrate, and the organic substrate is fixed to the groove wall of the through groove through the bonding layer; Optionally, the through groove is a rectangular groove; optionally, the material of the bonding layer comprises a resin. Optionally, the package carrier further includes a redistribution layer, where the redistribution layer is disposed on at least one side of the package substrate, and the redistribution layer includes at least one dielectric layer and at least one circuit layer, and the circuit layer is electrically connected to the conductive structure; Optionally, the redistribution layer covers at least part of the surface of the organic substrate and at least part of the surface of the inorganic substrate. In a second aspect, the present application further provides a method for manufacturing a package carrier, including: Providing an inorganic substrate, and forming a through groove penetrating in the thickness direction in the inorganic substrate; Embedding an organic substrate in the through groove to form a packaging substrate; forming a first through hole penetrating in a thickness direction in the organic substrate; a conductive structure is formed within the first via. Optionally, forming a conductive structure in the first via includes: Forming a conductive layer at least covering the hole wall of the first through hole, wherein the conductive layer encloses a first open hole; filling an insulating material in the first opening to form an insulating structure; optionally, after forming the insulating structure, the method further comprises: depositing at least one layer of conductive material on the surface of the packaging substrate, and forming a circuit layer through patterning treatment; manufacturing at least one dielectric layer to form a rewiring layer; Optionally, the circuit layer wraps the end of the insulation structure; optionally, forming a conductive structure in the first via includes: Fabricating a seed layer, wherein the seed layer comprises a first part covering the wa