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CN-122028757-A - Packaging carrier unit and method for manufacturing the same

CN122028757ACN 122028757 ACN122028757 ACN 122028757ACN-122028757-A

Abstract

The application provides a packaging carrier plate unit and a preparation method thereof, wherein a glass substrate unit comprises a glass through hole and a conductive column, wherein the glass through hole is arranged in a penetrating manner along the thickness direction, the conductive column is filled with the glass through hole, a rewiring layer unit is arranged on at least one side of the glass substrate unit, the rewiring layer unit comprises a conductive circuit layer and a dielectric layer unit, the conductive circuit layer passes through the dielectric layer unit and is electrically connected with the conductive column, and the side wall of the glass substrate unit is contracted inwards relative to the side wall of the dielectric layer unit in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit. According to the application, the side wall of the glass substrate unit is contracted inwards relative to the side wall of the medium layer unit in the direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit, and the medium layer is used for effectively protecting the side wall of the glass substrate, so that the damage of the glass substrate unit in the production, transportation or use processes is avoided, the packaging reliability is improved, and the performance of the packaging loading board unit is improved.

Inventors

  • ZHOU YANXU

Assignees

  • 苏州国显创新科技有限公司

Dates

Publication Date
20260512
Application Date
20260415

Claims (10)

  1. 1. A package carrier unit is provided, characterized by comprising the following steps: a glass substrate unit including a glass through hole penetrating in a thickness direction and a conductive column filling the glass through hole; The rewiring layer unit is arranged on at least one side of the glass substrate unit and comprises a conductive circuit layer and a dielectric layer unit, and the conductive circuit layer passes through the dielectric layer unit and is electrically connected with the conductive column; the side wall of the glass substrate unit is retracted relative to the side wall of the medium layer unit in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit.
  2. 2. The package carrier unit of claim 1, further comprising an edge protection layer covering at least sidewalls of the glass substrate unit; And/or the orthographic projection of the side wall of the glass substrate unit on the target plane is not overlapped with the orthographic projection of the side wall of the medium layer unit on the target plane and is positioned in the orthographic projection of the medium layer unit on the target plane, wherein the target plane is parallel to the surface of the glass substrate unit.
  3. 3. The package carrier unit of claim 1, further comprising a protective structure comprising an embedded portion disposed between the glass substrate unit and the dielectric layer unit and an extended portion extending from the embedded portion in a direction parallel to a surface of the glass substrate unit and away from a center of the glass substrate unit and beyond a sidewall of the glass substrate unit.
  4. 4. A method of manufacturing a package carrier unit, comprising: The packaging carrier plate comprises a glass substrate and a rewiring layer, wherein the glass substrate comprises a glass through hole and a conductive column, the glass through hole is arranged in a penetrating mode in the thickness direction, the conductive column is filled in the glass through hole, the rewiring layer is arranged on at least one side of the glass substrate, the rewiring layer comprises a conductive circuit layer and a dielectric layer, and the conductive circuit layer penetrates through the dielectric layer and is electrically connected with the conductive column; removing the dielectric layer on the cutting channel of the packaging carrier plate to form a plurality of dielectric layer units; Cutting the glass substrate along the cutting path to form a plurality of glass substrate units; And etching the side wall of the glass substrate unit to enable the side wall of the glass substrate unit to shrink inwards relative to the side wall of the dielectric layer unit in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit.
  5. 5. The method of manufacturing a package carrier unit according to claim 4, wherein etching the sidewall of the glass substrate unit to make the sidewall of the glass substrate unit shrink inwards in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit with respect to the sidewall of the dielectric layer unit, further comprises: and forming an edge protection layer on the side wall of the glass substrate unit.
  6. 6. The method of manufacturing a package carrier unit according to claim 5, wherein etching the sidewall of the glass substrate unit to make the sidewall of the glass substrate unit opposite to the sidewall of the dielectric layer unit, after shrinking in a direction parallel to the surface of the glass substrate unit and near the center of the glass substrate unit, the method further comprises, before forming an edge protection layer on the sidewall of the glass substrate: forming an edge protection material layer on the side wall of the glass substrate unit and the side wall of the dielectric layer unit; And trimming the edge protection material layer to form the edge protection layer.
  7. 7. The method of manufacturing a package carrier unit according to claim 4, wherein the package carrier further comprises an ink layer disposed on a side of the rewiring layer away from the glass substrate, the ink layer being provided with an opening exposing the conductive wiring layer; after the side wall of the glass substrate unit is etched, the side wall of the glass substrate unit is contracted relative to the side wall of the medium layer unit, before the side wall of the glass substrate unit is contracted along the direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit, the method further comprises the steps of: and forming a first protective layer on the ink layer and one side of the opening, which is far away from the glass substrate unit.
  8. 8. The method of manufacturing a package carrier unit according to claim 4, wherein the package carrier further comprises an ink layer disposed on a side of the rewiring layer away from the glass substrate, the ink layer being provided with an opening exposing the conductive wiring layer; after the side wall of the glass substrate unit is etched, the side wall of the glass substrate unit is contracted relative to the side wall of the medium layer unit, before the side wall of the glass substrate unit is contracted along the direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit, the method further comprises the steps of: And forming a first protective layer on one side of the ink layer and the opening, which is far away from the glass substrate unit, and forming a second protective layer on the side wall of the rewiring layer unit.
  9. 9. The method of manufacturing a package carrier unit according to claim 8, wherein after etching the side wall of the glass substrate unit, the side wall of the glass substrate unit is retracted relative to the side wall of the dielectric layer unit in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit, further comprising: Forming an edge protection layer on one side of the side wall of the glass substrate unit, which is far away from the dielectric layer unit, of the second protection layer; And removing the first protective layer and reserving the second protective layer.
  10. 10. The method of manufacturing a package carrier unit according to claim 4, wherein after the glass substrate is cut along the scribe line to form a plurality of glass substrate units, the etching the sidewalls of the glass substrate units to make the sidewalls of the glass substrate units opposite to the sidewalls of the dielectric layer units, before shrinking inward in a direction parallel to the surface of the glass substrate units and near the center of the glass substrate units, further comprises: And carrying out modification treatment on the glass substrate unit.

Description

Packaging carrier unit and method for manufacturing the same Technical Field The application relates to the technical field of semiconductor packaging, in particular to a packaging carrier plate unit and a preparation method thereof. Background Compared with a silicon substrate, the glass substrate has the characteristics of low loss, strong mechanical stability, low cost, realization of large-size ultrathin design and the like, is widely focused, has wide application prospect, and is applied to the fields of optical communication, radio frequency modules, photoelectric system integration, consumer electronics, electronic power amplifiers, medical appliances and the like. The performance of the package carrier is currently being improved. Disclosure of Invention Based on the above, the application provides the packaging carrier plate unit and the preparation method thereof, which can effectively improve the performance of the packaging carrier plate unit. In a first aspect, the present application provides a package carrier unit comprising: a glass substrate unit including a glass through hole penetrating in a thickness direction and a conductive column filling the glass through hole; The rewiring layer unit is arranged on at least one side of the glass substrate unit and comprises a conductive circuit layer and a dielectric layer unit, and the conductive circuit layer passes through the dielectric layer unit and is electrically connected with the conductive column; the side wall of the glass substrate unit is retracted relative to the side wall of the medium layer unit in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit. In one embodiment, the glass substrate unit further comprises an edge protection layer covering the side wall of the glass substrate unit. In one embodiment, the edge protection layer at least partially covers the sidewalls of the dielectric layer; In one embodiment, the material of the edge protection layer includes at least one of an organic epoxy material, a silane material, or a polyimide material. In one embodiment, the front projection of the side wall of the glass substrate unit on the target plane is not overlapped with the front projection of the side wall of the medium layer unit on the target plane, and is positioned in the front projection of the medium layer unit on the target plane, wherein the target plane is parallel to the surface of the glass substrate unit. In one embodiment, the device further comprises a protection structure, wherein the protection structure comprises an embedded part and an extension part, the embedded part is arranged between the glass substrate unit and the medium layer unit, and the extension part extends from the embedded part along a direction parallel to the surface of the glass substrate unit and far away from the center of the glass substrate unit and exceeds the side wall of the glass substrate unit. In one embodiment, the material of the protective structure and the conductive line layer are the same and are prepared by the same procedure. In one embodiment, the material of the protective structure and the conductive trace layer comprises copper. In one embodiment, the side wall of the glass substrate unit is shrunk by 50-200um relative to the side wall of the dielectric layer unit in a direction parallel to the surface of the glass substrate unit and close to the center of the glass substrate unit. In one embodiment, the package carrier unit further includes an ink layer, the ink layer is disposed on a side of the redistribution layer away from the glass substrate, the ink layer is provided with an opening exposing the conductive circuit layer, and a conductive bump is disposed in the opening. The second application provides a preparation method of a packaging carrier plate unit, which comprises the following steps: The packaging carrier plate comprises a glass substrate and a rewiring layer, wherein the glass substrate comprises a glass through hole and a conductive column, the glass through hole is arranged in a penetrating mode in the thickness direction, the conductive column is filled in the glass through hole, the rewiring layer is arranged on at least one side of the glass substrate, the rewiring layer comprises a conductive circuit layer and a dielectric layer, and the conductive circuit layer penetrates through the dielectric layer and is electrically connected with the conductive column; removing the dielectric layer on the cutting channel of the packaging carrier plate to form a plurality of dielectric layer units; Cutting the glass substrate along the cutting path to form a plurality of glass substrate units; And etching the side wall of the glass substrate unit to enable the side wall of the glass substrate unit to shrink inwards relative to the side wall of the dielectric layer unit in a direction parallel to the surface of the glass substrate unit and close to