CN-122028758-A - Binding assembly, preparation method of binding assembly and display panel

CN122028758ACN 122028758 ACN122028758 ACN 122028758ACN-122028758-A

Abstract

The application discloses a binding assembly, a preparation method of the binding assembly and a display panel, and relates to the technical field of display, wherein the binding assembly comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a transparent electrode layer, the first metal layer is arranged on the substrate, and the first insulating layer is arranged on the first metal layer; the second metal layer is arranged on the first insulating layer; the second insulating layer is arranged on the second metal layer; the transparent electrode layer is arranged on the second insulating layer, wherein the orthographic projection of the areas of the first metal layer and the second metal layer corresponding to the first connecting holes on the substrate forms a first binding area, the orthographic projection of the areas of the first metal layer and the second metal layer corresponding to the second connecting holes on the substrate forms a second binding area, the first binding area and the second binding area are alternately arranged, the width of the first binding area is larger than that of the second binding area, and the binding interval is increased through the design.

Inventors

WU YUE
CAO ZHONGLIN
CHEN JIE
WU CHUAN
XU PEI

Assignees

绵阳惠科光电科技有限公司
惠科股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260129

Claims (10)

1. A binding assembly for a display panel, comprising: A substrate; a first metal layer disposed on the substrate; A first insulating layer disposed on the first metal layer; A second metal layer disposed on the first insulating layer; A second insulating layer disposed on the second metal layer; a transparent electrode layer arranged on the second insulating layer and is characterized in that, The binding assembly further comprises a first connecting hole and a second connecting hole, the first connecting hole is formed in the first insulating layer, the second connecting hole is formed in the second insulating layer, the transparent electrode layer is connected to the second metal layer through the second through hole, and the second metal layer is connected to the first metal layer through the first connecting hole; the second metal layer is arranged on the substrate, and the second metal layer is arranged on the substrate, wherein the second metal layer is arranged on the substrate, and the second metal layer is arranged on the substrate, and is arranged on the substrate, wherein the second metal layer is arranged on the substrate, and is used for forming a second binding region; The first binding areas and the second binding areas are alternately arranged, and the width of the first binding areas is larger than that of the second binding areas.
2. The bonding assembly of the display panel according to claim 1, wherein orthographic projections of the bonding assembly on the substrate are of a sawtooth structure, the first connecting holes and the second connecting holes are multiple, the first connecting holes are arranged on the first insulating layer at intervals, the second connecting holes are arranged on the second insulating layer at intervals, orthographic projections of the first metal layer and the second metal layer, which correspond to the area of each first connecting hole, on the substrate form a first bonding area, orthographic projections of the first metal layer and the second metal layer, which correspond to the area of each second connecting hole, on the substrate form a second bonding area, and each first bonding area and each second bonding area are alternately arranged one by one.
3. The display panel binding assembly of claim 2, wherein the binding assembly includes a first binding assembly and a second binding assembly, the first binding assembly is disposed in parallel with the second binding assembly, each first binding region of the first binding assembly is disposed in one-to-one opposition to each second binding region of the second binding assembly and forms a first spacing, each second binding region of the first binding assembly is disposed in one-to-one opposition to each first binding region of the second binding assembly and forms a second spacing.
4. The display panel binding assembly of claim 3 wherein the orthographic projection of the first metal layer on the substrate and the orthographic projection of the second metal layer on the substrate are both of a saw tooth structure; The first metal layer forms a first metal area corresponding to the orthographic projection of the first connecting hole on the substrate, and the second metal layer forms a second metal area corresponding to the orthographic projection of the first connecting hole on the substrate; The orthographic projection of the first metal layer on the substrate corresponding to the second connecting hole forms a third metal area, and the orthographic projection of the second metal layer on the substrate corresponding to the second connecting hole forms a fourth metal area; the third metal region and the fourth metal region form the second binding region; the area of the first metal area is smaller than that of the second metal area, and the area of the third metal area is smaller than that of the fourth metal area.
5. The binding assembly of the display panel according to claim 1, wherein orthographic projection of the binding assembly on the substrate is of a T-shaped structure, the first connecting holes and the second connecting holes are multiple, the first connecting holes are arranged on the first insulating layer at intervals, the second connecting holes are arranged on the second insulating layer at intervals, orthographic projection of the first metal layer and the second metal layer corresponding to the areas of the first connecting holes on the substrate forms a first binding area, orthographic projection of the first metal layer and the second metal layer corresponding to the areas of the second connecting holes on the substrate forms a second binding area, and the first binding area and the second binding area are alternately arranged.
6. The display panel binding assembly of claim 5, wherein the binding assembly comprises a first binding assembly and a second binding assembly, the first binding assembly is disposed in parallel with the second binding assembly, each first binding region of the first binding assembly is disposed opposite each second binding region of the second binding assembly to form a first spacing, and each second binding region of the first binding assembly is disposed opposite each first binding region of the second binding assembly to form a second spacing.
7. The display panel binding assembly of claim 6, wherein the orthographic projection of the first metal layer on the substrate and the orthographic projection of the second metal layer on the substrate are both in a "T" shaped structure; The first metal layer corresponds to orthographic projection of a plurality of first connecting holes on the substrate to form a first metal region, and the second metal layer corresponds to orthographic projection of a plurality of first connecting holes on the substrate to form a second metal region; The first metal layer corresponds to orthographic projection of a plurality of second connecting holes on the substrate to form a third metal region, and the second metal layer corresponds to orthographic projection of a plurality of second connecting holes on the substrate to form a fourth metal region; the area of the first metal area is smaller than that of the second metal area, and the area of the third metal area is smaller than that of the fourth metal area.
8. The display panel binding assembly of claim 3 or 6, wherein the first pitch is equal in size to the second pitch.
9. A method for preparing a binding assembly of a display panel, for preparing a binding assembly according to any one of claims 1 to 8, comprising the steps of: providing a substrate; forming a first metal layer on the substrate; patterning the first metal layer to form a plurality of first metal regions and a plurality of third metal regions; forming a first insulating layer on the first metal layer; forming first connection holes corresponding to the first metal region and the third metal region on the first insulating layer; Forming a second metal layer on the first insulating layer, wherein the second metal layer is connected with the first metal layer through the first connecting hole; forming a second insulating layer on the second metal layer; Patterning the second metal layer to form a plurality of second metal regions and a plurality of fourth metal regions; Forming second connection holes on the second insulating layer corresponding to the second metal region and the fourth metal region respectively; forming a transparent electrode layer on the second insulating layer, wherein the transparent electrode layer is connected with the second metal layer through the second connecting hole; the first metal region and the second metal region are overlapped to form a first binding region, and the third metal region and the fourth metal region are overlapped to form a second binding region; The first binding region and the second binding region are arranged at intervals, and the width of the first binding region is larger than that of the second binding region.
10. A display panel comprising a binding assembly according to any of claims 1-8.

Description

Binding assembly, preparation method of binding assembly and display panel Technical Field The application relates to the technical field of display, in particular to a binding assembly, a preparation method of the binding assembly and a display panel. Background Currently, along with the improvement of living standard, the display panel has more and more obvious development trend of high resolution, the higher the requirement of customers on display effect, the resolution of display products/pen electric products is gradually increased, and the binding space of products is smaller and smaller because the length of a lower frame is too short, and the COF (Chip on Film, abbreviated as COF) can be bound on a binding component on a glass substrate. The binding assemblies are generally arranged in parallel, foreign matters are easy to enter in the production process due to the precision of binding equipment, binding intervals between two adjacent binding assemblies are too small, adjacent binding pads are easy to short-circuit after the foreign matters exist, poor display is formed, and the product yield is reduced. Disclosure of Invention The application aims to provide a binding component for increasing binding space and reducing binding short circuit risk, a preparation method of the binding component and a display panel. The application discloses a binding assembly of a display panel, which comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a transparent electrode layer, wherein the first metal layer is arranged on the substrate, the first insulating layer is arranged on the first metal layer, the second metal layer is arranged on the first insulating layer, the second insulating layer is arranged on the second metal layer, the transparent electrode layer is arranged on the second insulating layer, a first binding area is formed by orthographic projection of a region of the first metal layer and the second metal layer, corresponding to a first connecting hole, on the substrate, a second binding area is formed by orthographic projection of a region of the first metal layer and the second metal layer, corresponding to a second connecting hole, on the substrate, the first binding area and the second binding area are alternately arranged, and the width of the first binding area is larger than that of the second binding area. The bonding assembly comprises a substrate, a plurality of first connecting holes, a plurality of second connecting holes, a first metal layer, a second metal layer, a first bonding area, a second bonding area and a second bonding area, wherein the orthographic projection of the bonding assembly on the substrate is of a sawtooth structure, the first connecting holes and the second connecting holes are all multiple, the first connecting holes are arranged on the first insulating layer at intervals, the second connecting holes are arranged on the second insulating layer at intervals, the orthographic projection of the area of the first metal layer, corresponding to each first connecting hole, on the substrate forms the first bonding area, the orthographic projection of the area of the first metal layer, corresponding to each second connecting hole, on the substrate forms the second bonding area, and each first bonding area and each second bonding area are alternately arranged one by one. Optionally, the binding assembly includes a first binding assembly and a second binding assembly, the first binding assembly is arranged in parallel with the second binding assembly, each first binding region of the first binding assembly is arranged in one-to-one opposite to each second binding region of the second binding assembly, and a first interval is formed, and each second binding region of the first binding assembly is arranged in one-to-one opposite to each first binding region of the second binding assembly, and a second interval is formed. The front projection of the first metal layer on the substrate and the front projection of the second metal layer on the substrate are of saw-tooth structures, the front projection of the first metal layer on the substrate corresponds to the first connecting hole to form a first metal area, the front projection of the second metal layer on the substrate corresponds to the first connecting hole to form a second metal area, the first metal area and the second metal area form a first binding area, the front projection of the first metal layer on the substrate corresponds to the second connecting hole to form a third metal area, the front projection of the second metal layer on the substrate corresponds to the second connecting hole to form a fourth metal area, the third metal area and the fourth metal area form a second binding area, the area of the first metal area is smaller than the area of the second metal area, and the area of the third metal area is smaller than the area of the fourth meta