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CN-122028760-A - Laser pressurizing bonding device

CN122028760ACN 122028760 ACN122028760 ACN 122028760ACN-122028760-A

Abstract

A laser compression bonding apparatus includes a carrier for placing a substrate, a transparent compression head for holding and moving an electronic component, wherein the transparent compression head includes a central portion, a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion, a laser source for emitting a laser beam toward the carrier through at least the central portion of the transparent compression head to heat the solder material so that the electronic component is bonded to the substrate via the solder material, and a heat sink attached to the peripheral portion of the transparent compression head, wherein the heat sink includes a liquid channel for containing a liquid flowing in the liquid channel to exchange heat with the transparent compression head.

Inventors

  • Pu Zhongzan
  • Min Jiongshuo

Assignees

  • 星科金朋管理私人有限公司

Dates

Publication Date
20260512
Application Date
20241101

Claims (13)

  1. 1. A laser compression bonding apparatus, the apparatus comprising: A carrier for placing a substrate; A transparent pressing head for holding and moving an electronic component, wherein the transparent pressing head includes a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, the transparent pressing head further including a peripheral portion surrounding the central portion; A laser source for emitting a laser beam toward the carrier through at least the central portion of the transparent pressing head to heat the solder material so that the electronic component is bonded to the substrate via the solder material, and A heat sink attached to the peripheral portion of the transparent pressurizing head, wherein the heat sink includes a liquid channel for containing a liquid flowing in the liquid channel to exchange heat with the transparent pressurizing head.
  2. 2. The laser compression bonding apparatus of claim 1, wherein the heat sink surrounds the central portion of the transparent compression head.
  3. 3. The laser compression bonding apparatus of claim 1, wherein the liquid is a cooling liquid for cooling the transparent compression head.
  4. 4. The laser compression bonding apparatus according to claim 1, wherein the liquid comprises a cooling liquid for cooling the transparent compression head or a heating liquid for heating the transparent compression head.
  5. 5. The laser compression bonding apparatus according to claim 1, the laser pressurizing bonding device is characterized by further comprising: a liquid supply fluidly coupled to the liquid channel to supply liquid into the liquid channel or to extract liquid from the liquid channel after heat exchange between the liquid in the liquid channel and the transparent pressure head.
  6. 6. The laser compression bonding device of claim 1, wherein the transparent compression head comprises a front surface facing the laser source and a rear surface opposite the front surface, and wherein the heat sink is attached to the front surface or the rear surface of the transparent compression head.
  7. 7. The laser compression bonding device of claim 1, wherein the transparent compression head comprises a front surface facing the laser source and a rear surface opposite the front surface, and wherein the heat sink is attached to the front surface and the rear surface of the transparent compression head.
  8. 8. The laser compression bonding apparatus of claim 1, wherein the heat spreader is formed of a non-transparent material.
  9. 9. The laser compression bonding apparatus according to claim 8, wherein the heat sink is arranged such that the laser beam is blocked by the heat sink from impinging on a peripheral region of the substrate where the solder material is absent.
  10. 10. The laser compression bonding apparatus of claim 1, wherein the heat sink is formed of a transparent material.
  11. 11. The laser compression bonding apparatus of claim 1, wherein the transparent compression head further comprises at least one through hole through a central portion thereof to apply vacuum pressure to the electronic component to hold the electronic component.
  12. 12. The laser compression bonding device of claim 1, wherein the transparent compression head further comprises an air flow channel attached to an outer edge of the transparent compression head, and wherein the air flow channel is configured to receive a cooling air flow for cooling the transparent compression head.
  13. 13. A laser compression bonding method, comprising: Placing a substrate on a carrier; placing an electronic component on the substrate via a solder material by a transparent pressing head; Pressing the electronic component against the substrate by the transparent pressing head and irradiating a laser beam from a laser source to the carrier through the central portion of the transparent pressing head to bond the electronic component to the substrate via the solder material, and Injecting a liquid into a heat sink attached to a peripheral portion of the transparent pressure head to cool the transparent pressure head, wherein the peripheral portion surrounds the central portion and the heat sink includes a liquid channel; after heat exchange between the liquid and the transparent pressurizing head, the liquid is extracted from the liquid channel.

Description

Laser pressurizing bonding device Technical Field The present application relates generally to semiconductor technology, and more particularly, to laser compression bonding devices and methods of use thereof. Background Laser compression bonding (laser compression bonding, LCB) or soldering processes have been used to form semiconductor packages in place of conventional large-scale reflow processes because thermal stresses within the semiconductor package can be reduced during the laser compression soldering process. LCB tools, however, are typically made of a transparent material such as bulk quartz, which has a relatively low thermal conductivity. Heat may accumulate in the LCB tool during the bonding process and may undesirably raise the temperature of the LCB tool. Thus, a new laser compression bonding apparatus is needed. Disclosure of Invention An object of the present application is to provide a laser compression bonding apparatus with improved heat dissipation. According to an aspect of the present application, there is provided a laser compression bonding apparatus. The laser compression bonding apparatus includes a carrier for placing a substrate, a transparent compression head for holding and moving an electronic component, wherein the transparent compression head includes a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion, a laser source for emitting a laser beam toward the carrier through at least the central portion of the transparent compression head to heat the solder material so that the electronic component is bonded to the substrate via the solder material, and a heat sink attached to the peripheral portion of the transparent compression head, wherein the heat sink includes a liquid channel for containing a liquid flowing in the liquid channel to exchange heat with the transparent compression head. According to another aspect of the present application, a laser compression bonding method is provided. The method includes placing a substrate on a carrier, placing an electronic component on the substrate via a solder material by a transparent pressing head, pressing the electronic component against the substrate by the transparent pressing head, and irradiating a laser beam from a laser source to the carrier through the central portion of the transparent pressing head to bond the electronic component to the substrate via the solder material, and injecting a liquid into a heat sink attached to a peripheral portion of the transparent pressing head surrounding the central portion and including a liquid channel, and extracting the liquid from the liquid channel after heat exchange between the liquid and the transparent pressing head. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. Drawings The accompanying drawings, which are incorporated in and constitute a part of this specification. The features illustrated in the drawings illustrate only some, but not all, embodiments of the application and the reader of this specification should not infer the contrary, unless the detailed description explicitly indicates otherwise. Fig. 1 shows temperature variations of an LCB tool and electronic components held by the LCB tool under different conditions. Fig. 2a and 2b show a laser compression bonding device according to an embodiment of the present application. Fig. 3 a-3 c show a laser compression bonding method according to an embodiment of the application. The same reference numbers will be used throughout the drawings to refer to the same or like parts. Detailed Description The following detailed description of exemplary embodiments of the application refers to the accompanying drawings, which form a part hereof. The drawings illustrate specific exemplary embodiments in which the application may be practiced. The detailed description, including the drawings, describes the embodiments in sufficient detail to enable those skilled in the art to practice the application. Other embodiments of the application may be utilized and logical, mechanical, etc., changes may be made by those skilled in the art without departing from the spirit or scope of the present application. The reader of the following detailed description is, therefore, not to be taken in a limiting sense, and only the appended claims define the scope of embodiments of the application. In the present application, the use of the singular includes the plural unless specifically stated