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CN-122028761-A - Power module, power converter and vehicle

CN122028761ACN 122028761 ACN122028761 ACN 122028761ACN-122028761-A

Abstract

The embodiment of the application provides a power module, a power converter and a vehicle, relates to the technical field of electronic devices, and is used for improving the vibration reliability of pins and reducing the risk of vibration fracture of the pins. The power module comprises a power chip, a plastic package body and a plurality of pins distributed along a first direction, wherein the plastic package body wraps the power chip. One end of the pin is positioned in the plastic package body, the other end of the pin is positioned outside the plastic package body, the part of the pin positioned in the plastic package body is connected with the power chip, and the part of the pin positioned outside the plastic package body is bent. The plurality of pins comprise a first pin, and the area S 1 of the cross section of the first pin at the end face of the plastic package body and the area S 2 of the cross section of any other pin at the end face of the plastic package body meet the requirement that S 1 ＞S 2 is formed. The cross section of the first pin at the end face of the plastic package body is larger than the cross section of any other pin at the end face of the plastic package body in area, so that the vibration resistance of the first pin is improved, and the risk of vibration fracture of the pin is reduced.

Inventors

  • WANG ZHAOYUE
  • XIONG ZHI
  • LIU ZHILING
  • ZHOU SIZHAN

Assignees

  • 华为数字能源技术有限公司

Dates

Publication Date
20260512
Application Date
20241107

Claims (14)

  1. 1. A power module, comprising: A power chip; the plastic package body wraps the power chip; The power chip comprises a plurality of pins arranged along a first direction, wherein one end of each pin is positioned in the plastic package body, the other end of each pin is positioned outside the plastic package body, the part of each pin positioned in the plastic package body is connected with the power chip, and the part of each pin positioned outside the plastic package body is bent; The plurality of pins comprise first pins, the area S 1 of the cross section of the first pin at the end face of the plastic package body and the area S 2 of the cross section of any other pin at the end face of the plastic package body meet the requirement S 1 ＞S 2 .
  2. 2. The power module of claim 1, wherein the most end pin of the plurality of pins is the first pin.
  3. 3. The power module of claim 1 or 2, wherein the area S 1 of the cross section of the first pin at the end face of the plastic package body and the area S 2 of the cross section of any other pin at the end face of the plastic package body satisfy 1.2S 2 ≤S 1 ≤5S 2 .
  4. 4. A power module according to any one of claims 1-3, characterized in that the area S 1 of the cross section of the first pin at the end face of the plastic package body satisfies 1mm 2 ≤S 1 ≤11mm 2 .
  5. 5. The power module of any of claims 1-4, wherein the first pin is circular in cross-section at the end face of the plastic package body.
  6. 6. The power module of claim 5, wherein a cross section of the first pin at the end face of the plastic package body has a diameter of 1.2mm-3.6mm.
  7. 7. The power module of any one of claims 1-6, wherein a distance from a bend of the first pin to the plastic package is less than or equal to a distance from a bend of any other pin to the plastic package.
  8. 8. The power module of any one of claims 1-7, wherein a distance from the bend of the first pin to the plastic package is 1mm-3mm.
  9. 9. The power module of any one of claims 1-8, further comprising a stiffener secured to the bend of the first pin.
  10. 10. The power module of claim 9, wherein the stiffener is disposed at a side of the bent portion of the first pin facing the plastic package body.
  11. 11. A power converter, comprising: At least one power module according to any of claims 1-10; And one end of the pin, which is away from the plastic package, is electrically connected with the circuit board.
  12. 12. The power converter of claim 11, wherein the circuit board has opposite first and second sides along a length of the power module; the pins located closest to the first side of the circuit board and the pins located closest to the second side of the circuit board are the first pins of all pins of the at least one power module.
  13. 13. The power converter of claim 12, wherein the pins of each of the power modules that are located closest to a first side of the circuit board and the pins that are located closest to a second side of the circuit board are the first pins.
  14. 14. A vehicle, characterized by comprising: A battery; A motor; The power converter of any of claims 11-13; The power converter is electrically connected with the battery and the motor respectively.

Description

Power module, power converter and vehicle Technical Field The present disclosure relates to electronic devices, and particularly to a power module, a power converter, and a vehicle. Background The Power semiconductor device is one of the components of a Power Module (Power Module) and is responsible for converting and controlling electric energy. The power semiconductor device and the power module are widely applied to the fields of new energy automobiles, industrial control, new energy power generation, energy storage and the like. When the power module is applied to an on-board motor control unit (Motor Control Unit, MCU) in an on-board electric drive system of a vehicle, a power semiconductor device in the power module is one of core components of the on-board motor control unit for performing electric energy conversion, such as converting Direct Current (DC) supplied by a battery into three-phase alternating Current (ALTERNATING CURRENT, AC) for driving a motor to operate. With the widespread use of third generation semiconductor materials such as gallium nitride (GaN), silicon carbide (SiC), etc. in power semiconductor devices, the efficiency and output power of MCUs have been improved. In the actual working process, the increase of the output power of the MCU can cause the vibration of the whole MCU to be aggravated. In power modules, such as plastic package power modules, there may be suspended frame PINs (PINs), which have small size and weak vibration resistance, so that the vibration of the whole MCU increases the risk of vibration fracture of the frame PINs. Disclosure of Invention The application aims to provide a power module, a power converter and a vehicle, which are used for improving the vibration reliability of pins and reducing the risk of breakage of the pins caused by vibration. According to the first aspect of the application, a power module is provided, the power module comprises a power chip, a plastic package body and a plurality of pins distributed along a first direction, the plastic package body wraps the power chip, one end of each pin is located in the plastic package body, the other end of each pin is located outside the plastic package body, the part of each pin located in the plastic package body is connected with the power chip, the part of each pin located outside the plastic package body is bent, the plurality of pins comprise first pins, the area S 1 of the cross section of each first pin located at the end face of the plastic package body and the area S 2 of the cross section of any other pin located at the end face of the plastic package body meet the requirement S 1＞S2. In some application scenarios of the power module, for example, the power module is applied to an on-vehicle electric drive system, it is understood that the power module is part of an on-vehicle motor control unit of the on-vehicle electric drive system. The plastic package body of the power module wraps the power chip, and performs insulation protection on the power chip, so that the power chip is prevented from being damaged due to short circuit at the periphery of the power chip. The plurality of pins of the power module are distributed along a first direction, such as along the length direction of the power module, one end of each pin is connected with a power chip positioned in the plastic package, and the other end is connected with a circuit board positioned outside the plastic package. In the power module provided by the application, the part of each pin, which is positioned outside the plastic package, is bent, so that on one hand, the connection between the pin and the circuit board or other connecting pieces can be facilitated, and the pin can be better adapted to the layout of the circuit board or other connecting pieces, and the power module can be accurately installed at a preset position. On the other hand, the occupied space of the power module can be reduced, for example, the size of the power module in the width direction and the vertical direction can be reduced through the bent pins. Of the plurality of pins, the cross-sectional area S 1 of the first pin at the end face of the plastic package body (i.e., the outer end face of the plastic package body through which the first pin passes) is larger than the cross-sectional area S 2 of any other pin at the end face of the plastic package body (i.e., the outer end face of the plastic package body through which the pin passes), it is understood that the cross-sectional area S 1 of the first pin at the end face of the plastic package body is the largest among the plurality of pins, so that the structural rigidity and the moment of inertia of the first pin are the largest. In addition, the cross-sectional area of the first pin at the end face of the plastic package body is increased compared to the solution of S 1≤S2. Thus, the deflection and the rotation angle of the first pin are reduced (i.e. the maximum allowable deflection and the max