CN-122028762-A - Packaging structure and corresponding preparation method

Abstract

The invention relates to the technical field of semiconductor packaging, and discloses a packaging structure and a corresponding preparation method, wherein the packaging structure comprises a lead frame, a first lead frame and a second lead frame, wherein the lead frame comprises a carrier and pins protruding out of the carrier; the chip comprises a carrier, a chip, a glass sheet and a metal sheet, wherein the carrier is arranged on the chip, the glass sheet is arranged in an inner area of the upper surface of the chip, two ends of the metal sheet are respectively adhered to the outer area of the upper surface of the chip and the upper surface of the pin through corresponding first conductive adhesive layers, and the upper surface of the metal sheet and the upper surface of the glass sheet are exposed to the outside of a plastic package body. The chip can be contacted with the outside through the metal sheet, so that the heat in the product can be rapidly taken away. And the metal sheets are electrically connected, so that compared with the traditional wire bonding, the arc height is not required to be considered, and the packaging volume is reduced.

Inventors

• ZHANG YUESHENG
• ZHOU HAO
• YU KAIYUAN

Assignees

• 长电科技(江阴)有限公司

Dates

Publication Date

20260512

Application Date

20260121

Claims (20)

1. 1. A package structure, comprising: a lead frame including a carrier and pins protruding from the carrier; a chip located on the carrier; the first conductive adhesive layer is respectively positioned in the outer side area of the upper surface of the chip and the upper surface of the pin; the two ends of the metal sheet are respectively adhered to the outer side area of the upper surface of the chip and the upper surface of the pin through the corresponding first conductive adhesive layers, so that the pin and the chip are electrically connected through the metal sheet; a glass sheet located in an area inside an upper surface of the chip; And the plastic package body is positioned on the surface of the lead frame and is coated with the chip, the metal sheet and the glass sheet, and the upper surface of the metal sheet and the upper surface of the glass sheet are exposed to the outside of the plastic package body.
2. 2. The package structure of claim 1, wherein the upper surface of the metal sheet is a bare surface.
3. 3. The package structure of claim 1, wherein the upper surface of the metal sheet is covered with a first insulating high temperature resistant film layer, and the upper surface of the metal sheet is exposed to the outside of the plastic package body through the first insulating high temperature resistant film layer.
4. 4. The package structure of claim 3, wherein an upper surface of the first insulating high temperature resistant film layer is flush with an upper surface of the plastic package body.
5. 5. The package structure of claim 1, further comprising: and the radiator is used for connecting the metal sheets.
6. 6. The package structure of claim 1, wherein the upper surface of the glass sheet is a bare surface.
7. 7. The package structure of claim 1, wherein the lead frame has a plurality of pins, the metal sheet corresponding to the number of pins.
8. 8. The package structure of claim 1, wherein the bottom surface of the glass sheet is adhered to an area inside the upper surface of the chip by a first adhesive layer.
9. 9. The package structure of claim 8, wherein the first glue layer and the first conductive glue layer are the same material.
10. 10. The package structure of claim 1, wherein the bottom surface of the chip is adhered to the carrier by a second adhesive layer.
11. 11. The package structure of claim 1, wherein the upper surfaces of the pins are flush with the upper surface of the chip.
12. 12. The preparation method of the packaging structure is characterized by comprising the following steps: Providing a lead frame, wherein the lead frame comprises a carrier and pins protruding from the carrier; Attaching a chip to the carrier; Dispensing the upper surface of the pin and the outer area of the upper surface of the chip to form a first conductive adhesive layer; The two ends of the metal sheet are respectively stuck to the outer side area of the upper surface of the chip and the upper surface of the pin through the corresponding first conductive adhesive layer, so that the pin and the chip are electrically connected through the metal sheet; And encapsulating the lead frame, the chip, the metal sheet and the glass sheet to form a plastic package body, and controlling the upper surface of the metal sheet and the upper surface of the glass sheet to be exposed to the outside of the plastic package body.
13. 13. The method of manufacturing a package according to claim 12, wherein the upper surface of the metal sheet is covered with a first insulating high temperature resistant film.
14. 14. The method of claim 13, wherein controlling the exposure of the upper surface of the metal sheet to the exterior of the molded body comprises controlling the exposure of the upper surface of the first insulating high temperature resistant film layer to the exterior of the molded body such that the upper surface of the metal sheet is indirectly exposed to the exterior of the molded body through the first insulating high temperature resistant film layer.
15. 15. The method of manufacturing a package according to claim 12, wherein the upper surface of the glass sheet is covered with a second insulating high temperature resistant film layer.
16. 16. The method of claim 15, wherein controlling the exposure of the upper surface of the glass sheet to the exterior of the molded body comprises controlling the exposure of the upper surface of the second insulating high temperature resistant film layer to the exterior of the molded body such that the upper surface of the glass sheet is indirectly exposed to the exterior of the molded body through the second insulating high temperature resistant film layer.
17. 17. The method of manufacturing a package structure of claim 16, further comprising, after the step of forming the molded body: And removing the second insulating high temperature resistant film layer positioned on the upper surface of the glass sheet, so that the upper surface of the glass sheet is a bare surface.
18. 18. The method of manufacturing a package structure according to claim 12, wherein the step of disposing a glass sheet in an area inside an upper surface of the chip comprises: and adhering the bottom surface of the glass sheet to the inner side area of the upper surface of the chip through a first adhesive layer.
19. 19. The method of manufacturing a package structure according to claim 12, wherein the step of attaching the chip to the carrier comprises: And adhering the bottom surface of the chip to the carrier through a second adhesive layer.
20. 20. The method of manufacturing a package according to claim 12, wherein an upper surface of the pin and an upper surface of the chip are flush after the chip is mounted.

Description

Packaging structure and corresponding preparation method Technical Field The invention relates to the technical field of semiconductor packaging, and discloses a packaging structure and a corresponding preparation method. Background Fingerprint identification and other types of chips, referring to fig. 1, a glass 20 is required to be attached to a front sensing area of a chip 10, and two sides of the chip 10 are connected with pins 40 through bonding wires 30. However, because the arc height of the bonding wires 30 is required and the safety height is required to be reserved during packaging, the design has a large packaging thickness, and the heat dissipation is carried out by the carrier 50 alone, so that the heat dissipation efficiency is low, and the internal heat is difficult to be conducted out. Disclosure of Invention The invention aims to solve the problem of low heat dissipation efficiency of the existing fingerprint identification type chips, and provides a packaging structure and a corresponding preparation method. In order to achieve the above object, the present invention provides a package structure, comprising: a lead frame including a carrier and pins protruding from the carrier; a chip located on the carrier; the first conductive adhesive layer is respectively positioned in the outer side area of the upper surface of the chip and the upper surface of the pin; the two ends of the metal sheet are respectively adhered to the outer side area of the upper surface of the chip and the upper surface of the pin through the corresponding first conductive adhesive layers, so that the pin and the chip are electrically connected through the metal sheet; a glass sheet located in an area inside an upper surface of the chip; And the plastic package body is positioned on the surface of the lead frame and is coated with the chip, the metal sheet and the glass sheet, and the upper surface of the metal sheet and the upper surface of the glass sheet are exposed to the outside of the plastic package body. As an embodiment, the upper surface of the metal sheet is an exposed surface. As an implementation manner, the upper surface of the metal sheet is covered with a first insulating high temperature resistant film layer, and the upper surface of the first insulating high temperature resistant film layer is exposed to the outside of the plastic package body. As an implementation manner, the upper surface of the first insulating high-temperature resistant film layer is flush with the upper surface of the plastic package body. As an embodiment, further comprising: and the radiator is used for connecting the metal sheets. As one embodiment, the upper surface of the glass sheet is an exposed surface. As an embodiment, the lead frame has a plurality of pins, and the metal sheet corresponds to the number of pins. As an embodiment, the bottom surface of the glass sheet is adhered to the inner area of the upper surface of the chip through a first adhesive layer. As an embodiment, the first adhesive layer and the first conductive adhesive layer are made of the same material. As an implementation manner, the bottom surface of the chip is adhered to the carrier through a second adhesive layer. As an embodiment, the upper surface of the pins is flush with the upper surface of the chip. Correspondingly, the invention also provides a preparation method of the packaging structure, which comprises the following steps: Providing a lead frame, wherein the lead frame comprises a carrier and pins protruding from the carrier; Attaching a chip to the carrier; Dispensing the upper surface of the pin and the outer area of the upper surface of the chip to form a first conductive adhesive layer; The two ends of the metal sheet are respectively stuck to the outer side area of the upper surface of the chip and the upper surface of the pin through the corresponding first conductive adhesive layer, so that the pin and the chip are electrically connected through the metal sheet; And encapsulating the lead frame, the chip, the metal sheet and the glass sheet to form a plastic package body, and controlling the upper surface of the metal sheet and the upper surface of the glass sheet to be exposed to the outside of the plastic package body. As an implementation manner, the upper surface of the metal sheet is covered with a first insulating high-temperature resistant film layer. As one embodiment, controlling the upper surface of the metal sheet to be exposed to the outside of the plastic package body specifically includes controlling the upper surface of the first insulating high temperature resistant film layer to be exposed to the outside of the plastic package body so that the upper surface of the metal sheet is indirectly exposed to the outside of the plastic package body through the first insulating high temperature resistant film layer. As an embodiment, the upper surface of the glass sheet is covered with a second insulating high temperature