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CN-122028765-A - Press fitting device and bonding equipment

CN122028765ACN 122028765 ACN122028765 ACN 122028765ACN-122028765-A

Abstract

The application relates to a pressing device and bonding equipment, wherein the pressing device comprises a support, a pressing assembly and a balancing module, the support is provided with an accommodating cavity, the accommodating cavity is used for communicating a positive pressure generator, the pressing assembly comprises a connecting seat and a pressing head arranged on the connecting seat, the connecting seat is movably connected with the support so as to drive the pressing head to press and bond downwards, and the balancing module is arranged in the accommodating cavity and connected with the connecting seat, and when driven, the balancing module lifts the pressing assembly in the direction opposite to the bonding direction so as to balance the dead weight of the pressing assembly.

Inventors

  • ZHOU XUHUI
  • HUANG TIESHENG

Assignees

  • 镭神技术(深圳)股份有限公司

Dates

Publication Date
20260512
Application Date
20260414

Claims (10)

  1. 1. A bonding apparatus, characterized in that the bonding apparatus comprises; the support is provided with a containing cavity which is used for communicating with the positive pressure generator; the pressing assembly comprises a connecting seat and a pressing head arranged on the connecting seat, and the connecting seat is movably connected with the support so as to drive the pressing head to press and bond; the balancing module is arranged in the accommodating cavity and connected with the connecting seat, and when driven, the balancing module lifts the pressing assembly in the direction opposite to the bonding direction so as to balance the dead weight of the pressing assembly.
  2. 2. The pressing device according to claim 1, wherein the connecting seat comprises a supporting portion, a mounting frame and a connecting arm, the supporting portion and the mounting frame are respectively located at two opposite sides of the accommodating cavity in the bonding direction, the connecting arm is connected between the supporting portion and the mounting frame, the balancing module is abutted to the supporting portion along the direction opposite to the bonding direction, and the pressing head is arranged on the mounting frame.
  3. 3. The pressing device according to claim 2, wherein the balancing module comprises a pushing member and a bottom support member, and the bottom support member is located at a side of the pushing member away from the supporting portion in the bonding direction; the support is also provided with a balance flow passage, the bottom support is provided with a communication hole, one end of the communication hole is communicated with the positive pressure generator through the balance flow passage, and the other end of the communication hole is communicated with the area where the pushing piece is located.
  4. 4. A pressing apparatus according to claim 3, wherein the communication holes are uniformly arranged in a circumferential direction around a central axis of the pushing member, and/or The shoe has a support surface facing the abutment, the support surface being rotationally symmetrical about a central axis of the abutment, and/or The bottom support piece is provided with a supporting surface facing the pushing piece, when the supporting surface is abutted against the pushing piece, a part area of the supporting surface is provided with a gap with the pushing piece, the communication hole is communicated with the gap, and/or The pushing member is configured in any one of a sphere, a cylinder, a cone, a truncated cone, a pyramid, a truncated pyramid, and an ellipsoid.
  5. 5. The pressing device according to claim 2, wherein at least two of the connecting arms are disposed at intervals and respectively connected between the supporting portion and the mounting frame to form a receiving hole in a surrounding manner; The support comprises a first vertical plate and a first transverse plate, the first transverse plate is connected with the side part of the first vertical plate and extends in the direction away from the first vertical plate, the first transverse plate penetrates through the accommodating hole, and the accommodating cavity is formed in the first transverse plate; the mounting frame comprises a second vertical plate and a second transverse plate, the second transverse plate is connected with the side part of the second vertical plate and extends in the direction away from the second vertical plate, and the pressing head is arranged on the second transverse plate; wherein the first vertical plate and the second vertical plate are in sliding fit in the bonding direction, and the first transverse plate and the second transverse plate are arranged at intervals and side by side in the bonding direction.
  6. 6. The bonding apparatus according to claim 2, wherein, with reference to an abutting portion of the balancing module and the abutting portion, distances from the connecting arms located on opposite sides of the abutting portion in a direction perpendicular to the bonding direction to the abutting portion are equal.
  7. 7. The pressing device according to claim 1, wherein the holder is adapted to be connected to an external driving device, the connection holder being in sliding engagement with the holder in the bonding direction; The pressing assembly further comprises a pressure maintaining component, the pressure maintaining component comprises a first executing piece and a second executing piece, the first executing piece is arranged on the support, the second executing piece is arranged on the connecting seat, one of the first executing piece and the second executing piece is provided with an inner cavity, the other one of the first executing piece and the second executing piece penetrates through the inner cavity and is in sealing fit with the cavity wall of the inner cavity, and the inner cavity is used for communicating the airflow generator.
  8. 8. The compression device of claim 7, wherein the first actuator is configured as a piston rod and the second actuator is configured as a cylinder and has the inner cavity; The pressure maintaining component further comprises a flow dividing piece, the flow dividing piece is arranged in the inner cavity and is provided with a flow dividing channel, one end of the flow dividing channel is used for being communicated with the airflow generator, a plurality of airflow holes are formed in the other end of the flow dividing channel, and the airflow holes are uniformly distributed at intervals in the circumferential direction around the central axis of the first executing piece.
  9. 9. The pressing device according to claim 8, wherein the connection base is provided with a mounting hole penetrating in the bonding direction, the pressing assembly further comprises an adapter base connected with the pressure maintaining component, the adapter base penetrates through the mounting hole and is in running fit with the mounting hole, and the pressing head is arranged on the adapter base; The press-fit assembly further includes: The rotation compensation component is arranged on the connecting seat and connected with the pressing head and is used for driving the pressing head to rotate relative to the connecting seat around an axis parallel to the bonding direction and/or The parallelism adjusting part is arranged on the connecting seat and connected with the pressing head and is used for driving the pressing head to rotate around at least one axis in a plane perpendicular to the bonding direction.
  10. 10. A bonding apparatus, characterized in that the bonding apparatus comprises a press-fit device according to any one of claims 1 to 9.

Description

Press fitting device and bonding equipment Technical Field The present application relates to the field of chip bonding technology, and in particular, to a pressing device and a bonding apparatus. Background The chip bonding technology is a key process for realizing three-dimensional integration and high-performance packaging of semiconductor devices. In conventional bonding apparatuses, the driving module is generally used to pick up a chip by the bonding head, and the driving module conveys the chip to a predetermined position and performs a bonding operation. The bond head is used as a core execution component, and the pick-up, alignment and hot pressing operations of the chip are required to be completed simultaneously. At present, the bonding equipment generally improves the bonding precision and the interface connection strength by adding various functional modules. For example, by configuring a multi-axis fine adjustment mechanism, additional heating and pressure control systems, etc., for ensuring alignment stability. However, the above manner makes the overall structure of the bonding apparatus bulky and complex, the load increases significantly, the sensitivity of the driving response is affected, and the bonding effect is adversely affected. Disclosure of Invention Based on this, it is necessary to provide a pressing device and a bonding apparatus in view of the above-described problems. The application provides a pressing device which comprises a support, a pressing assembly and a balancing module, wherein the support is provided with an accommodating cavity which is used for communicating a positive pressure generator, the pressing assembly comprises a connecting seat and a pressing head which is arranged on the connecting seat, the connecting seat is movably connected with the support so as to drive the pressing head to press downwards for bonding, the balancing module is arranged in the accommodating cavity and connected with the connecting seat, and the balancing module is driven to lift and pull the pressing assembly in the direction opposite to the bonding direction so as to balance the dead weight of the pressing assembly. In one embodiment, the connecting seat comprises a supporting part, a mounting frame and a connecting arm, wherein the supporting part and the mounting frame are respectively positioned on two opposite sides of the accommodating cavity in the bonding direction, the connecting arm is connected between the supporting part and the mounting frame, the balancing module is in supporting connection with the supporting part along the opposite direction of the bonding direction, and the pressing head is arranged on the mounting frame. In one embodiment, the balancing module comprises a pushing part and a bottom support part, wherein the bottom support part is positioned on one side of the pushing part, which is away from the pushing part, in the bonding direction, the support is also provided with a balancing flow passage, the bottom support part is provided with a communication hole, one end of the communication hole is communicated with the positive pressure generator through the balancing flow passage, and the other end of the communication hole is communicated with the area where the pushing part is positioned. In one embodiment, the plurality of communication holes are uniformly arranged in a circumferential direction around the center axis of the push member. In one embodiment, the shoe has a support surface facing the abutment, the support surface being rotationally symmetrical about a central axis of the abutment. In one embodiment, the bottom support has a supporting surface facing the pushing member, and when the supporting surface is pushed against the pushing member, a part of the supporting surface has a gap with the pushing member, and the communication hole is communicated with the gap. In one embodiment, the pushing member is configured as any one of a sphere, a cylinder, a cone, a truncated cone, a pyramid, a truncated pyramid, and an ellipsoid. In one embodiment, the at least two connecting arms are arranged at intervals and are respectively connected between the supporting part and the mounting frame to form an accommodating hole in a surrounding mode, the support comprises a first vertical plate and a first transverse plate, the first transverse plate is connected with the side part of the first vertical plate and extends in the direction away from the first vertical plate, the first transverse plate penetrates through the accommodating hole, the accommodating cavity is formed in the first transverse plate, the mounting frame comprises a second vertical plate and a second transverse plate, the second transverse plate is connected with the side part of the second vertical plate and extends in the direction away from the second vertical plate, the pressing head is arranged on the second transverse plate, the first vertical plate and the second vertical plate ar