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CN-122028768-A - Semiconductor package and method of forming the same

CN122028768ACN 122028768 ACN122028768 ACN 122028768ACN-122028768-A

Abstract

A method for forming a semiconductor package includes providing a molded interposer module, wherein the molded interposer module includes an interposer having at least one central opening and a chip mounting region surrounding the at least one central opening, a plurality of semiconductor chips mounted on the chip mounting region, and a mold cover encapsulating the plurality of semiconductor chips, mounting the molded interposer module on a substrate via solder paste, wherein a flux material is formed around the solder paste, and the molded interposer module and the substrate together define a space to contain the solder paste and the space has side slots in communication with an external environment, reflowing the solder paste to form solder bumps, and spraying a flux chemical spray to the solder bumps through the at least one central opening and the side slots.

Inventors

  • LI ZHIXUAN
  • Meng Fanlie
  • An Ruizhi

Assignees

  • 星科金朋管理私人有限公司

Dates

Publication Date
20260512
Application Date
20241101

Claims (14)

  1. 1. A method for forming a semiconductor package, the method comprising: Providing a molded interposer module, wherein the molded interposer module comprises an interposer having at least one central opening therethrough and a chip mounting region surrounding the at least one central opening, a plurality of semiconductor chips mounted on the chip mounting region of the interposer, and a mold cap formed on the chip mounting region of the interposer to encapsulate the plurality of semiconductor chips; Mounting the molded interposer module on a substrate via solder paste, wherein a flux material is formed around the solder paste, and the molded interposer module and the substrate together define a space to contain the solder paste, and the space has side slots that fluidly connect the space to an external environment; Reflow the solder paste to form a plurality of solder bumps, and A flux chemical spray is sprayed through the at least one central opening of the interposer and the side slots toward the plurality of solder bumps.
  2. 2. The method of claim 1, wherein providing a molded interposer module comprises: Mounting the plurality of semiconductor chips on the chip mounting region of the interposer; forming the mold cap over the interposer to encapsulate the plurality of semiconductor chips; Attaching the mold cap to a carrier; Etching through the interposer and the mold cover to form the at least one central opening, thereby forming the molded interposer module, and The molded interposer module is separated from the carrier.
  3. 3. The method of claim 1, wherein mounting the molded interposer module on a substrate comprises: forming the solder paste on at least one of the substrate and the molded interposer module; Forming the flux material around the solder paste, and The molded interposer module is attached to the substrate via the plurality of solder bumps.
  4. 4. The method of claim 1, wherein after the step of mounting the molded interposer module on a substrate, the method further comprises: additional electronics are attached directly to the substrate around the molded interposer module.
  5. 5. The method of claim 4, wherein after the step of spraying a defluxing chemical spray onto the plurality of solder bumps, the method further comprises: The encapsulant layer is formed over the substrate to encapsulate the molded interposer module and the additional electronic device.
  6. 6. The method of claim 1, wherein after the step of spraying a defluxing chemical spray onto the plurality of solder bumps, the method further comprises: the at least one central opening of the interposer is filled by dispensing.
  7. 7. A semiconductor package, comprising: A substrate; an interposer mounted on the substrate and having at least one central opening therethrough and a chip mounting region surrounding the at least one central opening, and A plurality of semiconductor chips mounted on the chip mounting region of the interposer.
  8. 8. The semiconductor package of claim 7, wherein the semiconductor package further comprises: And a mold cover formed on the chip mounting region of the interposer to encapsulate the plurality of semiconductor chips.
  9. 9. The semiconductor package of claim 8, wherein the mold cap is further formed in the at least one central opening and between the plurality of semiconductor chips.
  10. 10. The semiconductor package of claim 7, wherein the substrate has at least one slot passing through the substrate and connected with the at least one central opening.
  11. 11. The semiconductor package of claim 7, wherein the plurality of semiconductor chips comprises at least three semiconductor chips, and each of the at least one central opening is aligned with a gap between two of the plurality of semiconductor chips.
  12. 12. The semiconductor package of claim 7, further comprising a plurality of solder bumps disposed between the interposer and the substrate for providing electrical connection therebetween.
  13. 13. The semiconductor package of claim 12, further comprising an underfill material formed between the interposer, the substrate, and each of the plurality of solder bumps.
  14. 14. A method for forming a semiconductor package, the method comprising: Providing an unmolded interposer module, wherein the unmolded interposer module comprises an interposer having at least one central opening therethrough and a chip mounting region surrounding the at least one central opening, a plurality of semiconductor chips mounted on the chip mounting region of the interposer; mounting the unmolded interposer module on a substrate via solder paste, wherein a flux material is formed around the solder paste, and the unmolded interposer module and the substrate together define a space to contain the solder paste, and the space has side slots that fluidly communicate the space with an external environment; Reflow the solder paste to form a plurality of solder bumps, and A flux chemical spray is sprayed through the at least one central opening of the interposer and the side slots toward the plurality of solder bumps.

Description

Semiconductor package and method of forming the same Technical Field The present application relates generally to semiconductor technology and, more particularly, to a semiconductor package and a method for forming a semiconductor package. Background The semiconductor industry has been faced with complex integration challenges as consumers desire their electronic products to be smaller, faster, and more capable, and to package more and more functionality into a single device. In some semiconductor packages, two or more integrated circuit (INTEGRATED CIRCUIT, IC) packages are combined together as an integrated device using a Package-in-Package (PiP) or Package-on-Package (PoP) process. The PiP or PoP devices can use space more efficiently and reduce the length of signal paths between packages. In a typical PiP or PoP device, one or more pre-molded semiconductor packages or semiconductor chips may be mounted to another semiconductor package or substrate by an interposer or other similar structure. It should be noted, however, that the number of semiconductor chips that need to be mounted on a substrate increases significantly, and that the placement of these semiconductor chips on a substrate is largely determined by the size of the interposer. However, in the case of Chip on Wafer (CoW) packages, also known as molded interposers (molded interposer), there are several process problems with such packages because of the large interposer size, one of which is that after a large CoW package (e.g., 30mm x 30mm or more) is attached to a substrate via solder bumps, the defluxing chemistry cannot penetrate the CoW package, leaving a flux residue between the CoW package and the substrate. Flux residue may degrade the performance and reliability of the device. Accordingly, there is a need for further improvements in semiconductor packages or devices having large CoW or similar large scale components. Disclosure of Invention An object of the present application is to provide a semiconductor package with improved reliability. According to an aspect of the present application, a method for forming a semiconductor package is provided. The method includes providing a molded interposer module, wherein the molded interposer module includes an interposer having at least one central opening therethrough and a chip mounting region surrounding the at least one central opening, a plurality of semiconductor chips mounted on the chip mounting region of the interposer, and a mold cap formed on the chip mounting region of the interposer to encapsulate the plurality of semiconductor chips, mounting the molded interposer module on a substrate via solder paste, wherein a flux material is formed around the solder paste, and the molded interposer module and the substrate together define a space to accommodate the solder paste, and the space has a side seam that fluidly communicates the space with an external environment, reflowing the solder paste to form a plurality of solder bumps, and chemically spraying a flux-removing chemical spray to the plurality of solder bumps through the at least one central opening and the side seam of the interposer. In accordance with another aspect of the present application, a semiconductor package is disclosed. The semiconductor package includes a substrate, an interposer mounted on the substrate and having at least one central opening therethrough and a chip mounting region surrounding the at least one central opening, a plurality of semiconductor chips mounted on the chip mounting region of the interposer, and a mold cover formed on the chip mounting region of the interposer to encapsulate the plurality of semiconductor chips. According to yet another aspect of the present application, a method for forming a semiconductor package is provided. The method includes providing an unmolded interposer module, wherein the unmolded interposer module includes an interposer having at least one central opening therethrough and a chip mounting area surrounding the at least one central opening, a plurality of semiconductor chips mounted on the chip mounting area of the interposer, mounting the unmolded interposer module on a substrate via solder paste, wherein a flux material is formed around the solder paste, and the unmolded interposer module and the substrate together define a space to accommodate the solder paste, and the space has a side seam that fluidly communicates the space with an external environment, reflowing the solder paste to form a plurality of solder bumps, and spraying a flux chemical spray to the plurality of solder bumps through the at least one central opening and the side seam of the interposer. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification,