CN-122028771-A - Packaging structure and packaging method

CN122028771ACN 122028771 ACN122028771 ACN 122028771ACN-122028771-A

Abstract

The invention discloses a packaging structure and a packaging method, wherein the packaging structure comprises an inductance module, a first electrode and a second electrode, wherein the inductance module is provided with a first end part; the inductor comprises a first substrate, a first device layer and a first device layer, wherein the first substrate is provided with a containing groove, the inductor module is arranged in the containing groove, the first device layer comprises a first functional device and a sealing body for sealing the first functional device, and the first functional device is arranged on the first substrate and is electrically connected with the first end part. In the invention, the inductance module is arranged in the accommodating groove of the first substrate, and at least one first functional device on the first end part of the inductance module is electrically connected with the first end part, so that the electrical connection between the inductance module and at least one first functional device is realized, the first functional device can be directly integrated with the inductance module and then sealed, the circuit board between the existing controller and the inductance module is reduced, the circuit between the first functional device and the inductance module is reduced, the resistance of the packaging structure is reduced, and the manufacturing cost is reduced.

Inventors

GUO XIONGZHI
ZHANG YUNFAN

Assignees

深圳市铂科新材料股份有限公司
惠州铂科新感技术有限公司

Dates

Publication Date: 20260512
Application Date: 20241108

Claims (10)

1. A package structure, comprising: An inductance module having a first end; The first substrate is provided with a containing groove, and the inductance module is arranged in the containing groove; and a first device layer including a first functional device and a sealing body sealing the first functional device, the first functional device being disposed on the first substrate and electrically connected to the first end portion.
2. The package structure of claim 1 further comprising a first dielectric layer between the first substrate and the first device layer, the first dielectric layer including a first conductive via through which the first functional device is electrically connected to the first end.
3. The package structure of claim 1, wherein the inductor module has a second end, the second end and the first end being on a same side of the inductor module; The first device layer includes a second functional device electrically connected to the second end.
4. The package structure of claim 1, wherein the inductor module has a second end, the second end and the first end being located on opposite sides of the inductor module.
5. The package structure of claim 4, further comprising a second dielectric layer and a second device layer, the second dielectric layer being located between the first substrate and the second device layer, the second dielectric layer including a second conductive via, the second device layer including a second functional device, the second conductive via being through-connected to the second end, the second functional device being electrically connected to the second end through the second conductive via.
6. The package structure of claim 2, wherein the first end extends into the corresponding first conductive via.
7. The package structure of claim 1, wherein the inductance module comprises an inductance core, the inductance core being disposed within the receiving slot; The inductor magnetic core is provided with at least one groove on one side facing the first device layer, and the first end part is positioned in the groove of the inductor magnetic core.
8. The package structure of claim 7, wherein the first end portion is folded into the recess to form a first electrical connection surface, the first functional device including an input surface and an output surface facing away from each other, the output surface facing toward and electrically connected to the first end portion; The projection of the first functional device to the first end is located in the first electrical connection plane.
9. The package structure of claim 1, further comprising a third conductive via extending through at least the first substrate, the third conductive via electrically connecting the first functional device, the third conductive via and the receiving slot being spaced apart along a second direction, the second direction being perpendicular to the stacking direction of the first substrate.
10. A packaging method for manufacturing the packaging structure according to any one of claims 1 to 9, the packaging method comprising: providing a first substrate and an inductance module, wherein the first substrate is provided with a containing groove, and the inductance module is arranged in the containing groove; Forming a first functional device on the first substrate, the first functional device being electrically connected to the first end portion; a sealing body is formed that seals the first functional device.

Description

Packaging structure and packaging method Technical Field The present invention relates to the field of power devices, and in particular, to a packaging structure and a packaging method. Background In recent years, with the development of technologies such as data centers and artificial intelligence, the working speeds of Central Processing Units (CPUs), graphic Processing Units (GPUs) and various Integrated Chips (ICs) are faster, the integration level is higher, and the working current is higher. Accordingly, the requirements on power density, efficiency, dynamic response, etc. of the power converters applied in the above integrated circuits are becoming more and more stringent. At present, at least two circuit boards are generally adopted for assembling and stacking all modules in the power converter, so that the whole size is large, and the power converter needs to be further optimized and improved. Disclosure of Invention The invention provides a packaging structure and a packaging method, which are used for solving the problem of large volume of the traditional power converter. According to an aspect of the present invention, there is provided a package structure including: An inductance module having a first end; The first substrate is provided with a containing groove, and the inductance module is arranged in the containing groove; and a first device layer including a first functional device and a sealing body sealing the first functional device, the first functional device being disposed on the first substrate and electrically connected to the first end portion. According to another aspect of the present invention, there is provided a packaging method for manufacturing the packaging structure as described above, the packaging method comprising: providing a first substrate and an inductance module, wherein the first substrate is provided with a containing groove, and the inductance module is arranged in the containing groove; Forming a first functional device on the first substrate, the first functional device being electrically connected to the first end portion; a sealing body is formed that seals the first functional device. In the invention, the inductance module is arranged in the accommodating groove of the first substrate, the first device layer is arranged on the first end part of the inductance module, at least one first functional device in the first device layer is electrically connected with the first end part, thereby realizing the electrical connection between the inductance module and at least one first functional device, and finally the sealing body is packaged. In the invention, the first functional device can be directly integrated with the inductance module and then sealed, the volume is smaller, the circuit between the first functional device and the inductance module can be reduced, the reliability is increased, the resistance of the packaging structure is reduced, and the manufacturing cost is reduced. It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows. Drawings In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. FIG. 1 is a schematic diagram of a prior art power converter; FIG. 2 is a schematic diagram of the power converter of FIG. 1; FIG. 3 is a schematic diagram of a package structure according to an embodiment of the present invention; FIG. 4 is a schematic diagram of another package structure according to an embodiment of the present invention; FIG. 5 is a schematic diagram of yet another package structure according to an embodiment of the present invention; FIG. 6 is a schematic diagram of yet another package structure provided by an embodiment of the present invention; FIG. 7 is a schematic diagram of yet another package structure according to an embodiment of the present invention; FIG. 8 is a schematic diagram of yet another package structure provided by an embodiment of the present invention; FIG. 9 is a schematic diagram of yet another package structure provided by an embodiment of the present invention; FIG. 10 is a schematic diagram of yet another package structure provided by an embodiment of the present invention; FIG. 11 is a schematic diagram of yet another package structure provided by an embodiment of the present invention; Fig. 12 is a schematic diagram of a packaging method according to an embodiment of the present invention. Detailed Descriptio