CN-122028772-A - Packaging structure

Abstract

The invention provides a packaging structure and a method for manufacturing the same. The package structure includes a curved flexible carrier, a first component, and a flexible encapsulant layer. The first component is disposed on the curved flexible carrier. The flexible encapsulant encapsulates the first component and the curved flexible carrier.

Inventors

• ZHANG WEIHAO
• LI WEIJUN

Assignees

• 日月光半导体制造股份有限公司

Dates

Publication Date

20260512

Application Date

20250317

Priority Date

20241108

Claims (20)

1. 1.A package structure, comprising: Bending the flexible carrier; A first component disposed on the curved flexible carrier, and A flexible encapsulation layer encapsulating the first component and the curved flexible carrier.
2. 2. The package structure of claim 1, wherein the curved flexible carrier comprises a flat portion, wherein in a cross-sectional view the flexible encapsulation layer has four outer sides and the flat portion extends in a direction non-parallel to the four outer sides.
3. 3. The package structure of claim 2, wherein the direction is not perpendicular to the four outer sides.
4. 4. The package structure according to claim 2, wherein the first member has a first surface facing the flat portion and inclined to the four outer sides.
5. 5. The package structure of claim 1, wherein the curved portion of the curved flexible carrier is formed by bending a flat portion of the package structure.
6. 6. The package structure of claim 1, wherein the first curved portion of the curved flexible carrier has a curved profile in a cross-sectional view.
7. 7. The package structure according to claim 6, wherein the first curved portion has a zigzag shape in a top view.
8. 8. The package structure of claim 6, wherein, in a cross-sectional view, the first curved portion and the second curved portion of the curved flexible carrier form a multi-circular profile between the plurality of flat portions of the curved flexible carrier.
9. 9. The package structure of claim 1, wherein the curved flexible carrier has a substantially uniform thickness.
10. 10. A package structure, comprising: A flexible carrier comprising a first planar portion and a plurality of curved portions; A first component disposed on the first flat portion, and A flexible encapsulant layer encapsulating the flexible carrier and the first component, Wherein the first component is located between the curved portions.
11. 11. The package structure of claim 10, wherein the curved portion is configured to change when a deforming force is applied to the package structure.
12. 12. The package structure of claim 11, wherein a first curvature of at least one of the curved portions is configured to change when the deforming force is applied to the package structure.
13. 13. The package structure of claim 12, wherein a second curvature of at least one of the curved portions is configured to change when the deforming force is applied to the package structure, and wherein the first curvature increases and the second curvature decreases.
14. 14. The package structure of claim 10, further comprising a second component disposed on a first surface of the first planar portion, the first surface opposite a second surface on which the first component is disposed.
15. 15. The package structure of claim 14, wherein the second component is located between the curved portions.
16. 16. The package structure of claim 10, further comprising a stiffener disposed on a first surface of the first planar portion, the first surface opposite a second surface on which the first component is disposed.
17. 17. A package structure, comprising: A flexible carrier comprising a first planar portion and a second planar portion spaced apart from the first planar portion; A first component disposed on the first planar portion; a second component disposed on the second flat portion, and A flexible encapsulation layer encapsulating the flexible carrier, the first component and the second component, Wherein the relative position of the first component is configured to be adjustable relative to the second component during deformation of the package structure.
18. 18. The package structure of claim 17, wherein the package structure has a ring structure.
19. 19. The package structure of claim 18, wherein the ring structure has an inner surface, and a length of the inner surface varies in response to deformation of the flexible encapsulation layer.
20. 20. The package structure of claim 18, wherein the ring structure has an outer surface and the flexible carrier includes a curved portion between the first flat portion and the second flat portion, and in a radial direction, the curved portion is closer to the outer surface than the first component.

Description

Packaging structure Technical Field The present disclosure relates to a packaging module and a method of manufacturing a packaging module. Background Flexible electronics are widely used in wearable devices. However, the characteristics of the carrier of these electronic devices may be irreparably damaged after stretching. Disclosure of Invention In some embodiments, a packaging module includes a curved flexible carrier, a first component, and a flexible packaging layer. The first component is disposed on the curved flexible carrier. The flexible encapsulant encapsulates the first component and the curved flexible carrier. In some embodiments, a packaging module includes a flexible carrier, a first component, and a flexible packaging layer. The flexible carrier includes a first flat portion and a plurality of curved portions. The first component is disposed on the first planar portion. The flexible encapsulant layer encapsulates the flexible carrier and the first component. The first component is located between the curved portions. In some embodiments, a packaging module includes a flexible carrier, a first component, a second component, and a flexible packaging layer. The flexible carrier includes a first planar portion and a second planar portion spaced apart from the first planar portion. The first component is disposed on the first planar portion. The second component is disposed on the second planar portion. The flexible encapsulant layer encapsulates the flexible carrier, the first component, and the second component. The relative position of the first component is configured to be adjustable relative to the second component during deformation of the package structure. Drawings Aspects of some embodiments of the present disclosure are readily understood from the following detailed description when read in connection with the accompanying drawings. It should be noted that the various structures may not be drawn to scale and that the dimensions of the various structures may be arbitrarily increased or decreased for clarity of discussion. Fig. 1 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 1A is a cross-sectional view of a package structure to which a deforming force is applied, according to some embodiments of the present disclosure. Fig. 1B is an enlarged cross-sectional view of a curved portion of a package structure to which a deforming force is applied, according to some embodiments of the present disclosure. Fig. 2 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 3A, 3B, and 3C illustrate one or more stages of an example of a method for fabricating a package structure according to some embodiments of the present disclosure. Fig. 4 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 5 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 6 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 7 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 8 is a cross-sectional view of a package structure to which a deforming force is applied, according to some embodiments of the present disclosure. Fig. 8A is an enlarged cross-sectional view of a curved portion of a package structure to which a deforming force is applied, according to some embodiments of the present disclosure. Fig. 9 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 10 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 11 is a top view of a package structure according to some embodiments of the present disclosure. Fig. 12 is a cross-sectional view of a package structure to which a deforming force is applied, according to some embodiments of the present disclosure. Fig. 12A is an enlarged cross-sectional view of a curved portion of a package structure to which a deforming force is applied, according to some embodiments of the present disclosure. Fig. 13 is a cross-sectional view of a package structure according to some embodiments of the present disclosure. Fig. 14 is a top view of a package structure according to some embodiments of the present disclosure. Detailed Description Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. Embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described belo