CN-122028778-A - Semiconductor device with a semiconductor device having a plurality of semiconductor chips

Abstract

The present disclosure obtains a semiconductor device capable of preventing peeling of an insulating molding resin. A first metal plate (11) is provided on the upper surface of the insulating layer (10). A second metal plate (12) is provided on the lower surface of the insulating layer (10). The semiconductor element (14) is bonded to the first metal plate (11). An insulating molding resin (16) covers the insulating layer (10), the first metal plate (11), the side surfaces of the second metal plate (12), and the semiconductor element (14). A groove (18) is provided on the entire outer periphery of the lower surface of the second metal plate (12). An insulating molding resin (16) fills the inside of the groove (18).

Inventors

• Jing Jihe
• Nishimura Ikko
• Jiang Caoren
• WADA FUMIO
• Yi Benkuanzhi

Assignees

• 三菱电机株式会社

Dates

Publication Date

20260512

Application Date

20250801

Priority Date

20241106

Claims (11)

1. 1. A semiconductor device, characterized in that, The device is provided with: an insulating layer; A first metal plate disposed on an upper surface of the insulating layer; a second metal plate disposed on a lower surface of the insulating layer; a semiconductor element bonded to the first metal plate, and An insulating molding resin covering the insulating layer, the side surfaces of the first metal plate, the second metal plate, and the semiconductor element, A groove is provided on the entire circumference of the lower surface of the second metal plate, The insulating molding resin fills the inside of the groove.
2. 2. The semiconductor device according to claim 1, wherein, The groove has a plurality of key grooves provided along the outer periphery of the lower surface of the second metal plate, In the key groove, a width of an inner peripheral side of a lower surface of the second metal plate is wider than a width of an outer peripheral side of the lower surface of the second metal plate in a plan view.
3. 3. The semiconductor device according to claim 1, wherein, In the groove, the depth of the lower surface inner peripheral side of the second metal plate is deeper than the depth of the lower surface outer peripheral side of the second metal plate.
4. 4. The semiconductor device according to claim 1, wherein, The corner between the bottom surface of the groove and the side surface of the second metal plate has a first circular arc shape, and the corner between the bottom surface of the groove and the side surface of the groove has a second circular arc shape.
5. 5. The semiconductor device according to claim 4, wherein, The first arc shape has a radius of curvature of 0.05mm or more and 0.5mm or less, The radius of curvature of the second arc shape is more than 0.05mm and less than 0.5mm, The radius of curvature of the first circular arc shape is larger than that of the second circular arc shape.
6. 6. The semiconductor device according to claim 1, wherein, The insulating molding resin covers a portion inside the recess of the lower surface of the second metal plate in a plan view.
7. 7. The semiconductor device according to claim 1, wherein, The bottom surface of the groove is in a flat shape, The width of the groove is 0.45mm or more in plan view.
8. 8. The semiconductor device according to any one of claims 1 to 7, wherein, The corner of the portion of the lower surface of the second metal plate exposed from the insulating molding resin has a circular arc shape.
9. 9. The semiconductor device according to any one of claims 1 to 7, wherein, The depth of the groove is more than 1/3 of the thickness of the second metal plate.
10. 10. The semiconductor device according to any one of claims 1 to 7, wherein, The depth of the groove is less than 51% of the thickness of the second metal plate.
11. 11. The semiconductor device according to any one of claims 1 to 7, wherein, The semiconductor element is formed of a wide bandgap semiconductor.

Description

Semiconductor device with a semiconductor device having a plurality of semiconductor chips Technical Field The present disclosure relates to semiconductor devices. Background Patent document 1 discloses a structure in which a semiconductor element is mounted on an insulating substrate and sealed with an insulating mold resin, and a groove is provided on the lower surface of a lower surface electrode of the insulating substrate in order to suppress internal peeling. Patent document 1 International publication No. 2016/098431 In order to further improve heat dissipation and to extend the life, it is necessary to firmly seal the insulating substrate and the semiconductor element with an insulating molding resin without peeling. In patent document 1, as a countermeasure for relaxing stress of an insulating substrate caused by thermal stress, a groove is provided in a corner portion of a lower surface electrode of the insulating substrate. However, even if the grooves are provided only in the corners, the stress cannot be sufficiently relaxed, and peeling of the insulating molding resin cannot be prevented. Disclosure of Invention The present disclosure has been made to solve the above-described problems, and an object thereof is to obtain a semiconductor device capable of preventing peeling of an insulating mold resin. The semiconductor device according to the present disclosure includes an insulating layer, a first metal plate provided on an upper surface of the insulating layer, a second metal plate provided on a lower surface of the insulating layer, a semiconductor element bonded to the first metal plate, and an insulating mold resin covering the insulating layer, side surfaces of the first metal plate, the second metal plate, and the semiconductor element, wherein a groove is provided on an entire periphery of a lower surface of the second metal plate, and the insulating mold resin is filled in the groove. In the semiconductor device according to the present disclosure, the groove is provided on the entire outer periphery of the lower surface of the second metal plate, and the insulating mold resin is filled in the inside of the groove. This can prevent the insulating molding resin from peeling off. Drawings Fig. 1 is a cross-sectional view showing a semiconductor device according to embodiment 1. Fig. 2 is a bottom view showing an insulating substrate according to embodiment 1. Fig. 3 is a sectional view taken along I-II of fig. 2. Fig. 4 is a cross-sectional view showing the semiconductor device according to comparative example 1. Fig. 5 is an enlarged cross-sectional view of a part of the semiconductor device according to comparative example 1. Fig. 6 is a cross-sectional view showing a modification of the semiconductor device according to embodiment 1. Fig. 7 is an enlarged cross-sectional view of a part of the semiconductor device according to comparative example 2. Fig. 8 is a bottom view showing an insulating substrate of the semiconductor device according to embodiment 2. Fig. 9 is a sectional view taken along I-II of fig. 8. Fig. 10 is a bottom view showing a modification of the insulating substrate according to embodiment 2. Fig. 11 is a sectional view taken along I-II of fig. 10. Fig. 12 is a cross-sectional view showing a semiconductor device according to embodiment 3. Fig. 13 is a bottom view showing an insulating substrate according to embodiment 3. Fig. 14 is a sectional view taken along I-II of fig. 13. Fig. 15 is a cross-sectional view showing an insulating substrate of a semiconductor device according to embodiment 4. Fig. 16 is a cross-sectional view showing a semiconductor device according to embodiment 5. Fig. 17 is a bottom view showing an insulating substrate of the semiconductor device according to embodiment 6. Fig. 18 is a bottom view showing a semiconductor device according to embodiment 6. Description of the reference numerals The heat spreader includes an insulating layer, a first metal plate, a second metal plate, a first bonding material, a semiconductor element, a second bonding material, an insulating mold resin, a wiring member, a groove, a recess, a peel-off, a slit, a first arc shape, a second arc shape, a 30 insulating substrate, and a heat sink. Detailed Description Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Duplicate descriptions are appropriately simplified or omitted. In the drawings, like reference numerals designate like or corresponding parts throughout the several views. In the drawings, the relationship between the sizes of the constituent members may be different from the actual ones. The form of the constituent elements shown throughout the specification is merely an example, and is not limited to the form described in the specification. In particular, the combination of the constituent elements is not limited to the combination of the embodiments, but the constituent elements described in the o