Search

CN-122028779-A - Ceramic package device and reworking method

CN122028779ACN 122028779 ACN122028779 ACN 122028779ACN-122028779-A

Abstract

The application discloses a ceramic packaging device and a reworking method, wherein the ceramic packaging device comprises a metal cover plate, a ceramic tube shell, a solder piece and a chip, wherein the solder piece is arranged between the metal cover plate and the ceramic tube shell and welds the metal cover plate and the ceramic tube shell together, a containing cavity is arranged between the metal cover plate and the ceramic tube shell, and the chip is arranged in the containing cavity and is fixed with the ceramic tube shell. The reworking method includes separating the metal cover plate of ceramic package device with bad package from the ceramic tube shell to form old metal cover plate and old ceramic tube shell, providing new metal cover plate and new solder sheet, and welding the new metal cover plate and old ceramic tube shell together with the new solder sheet. The solder piece is designed between the metal cover plate and the ceramic tube shell, and the metal cover plate and the ceramic tube shell are welded together, so that the chip is conveniently packaged, the reworking method is also conveniently implemented, the packaging yield can be improved, and the loss of material cost is reduced.

Inventors

  • FENG XUE
  • YANG LEI
  • LI HAIBO
  • FAN HUIDONG

Assignees

  • 浙江清华柔性电子技术研究院
  • 清华大学

Dates

Publication Date
20260512
Application Date
20241106

Claims (10)

  1. 1. A reworking method of a ceramic packaging device, characterized in that a ceramic packaging device (10) with poor packaging is provided, the ceramic packaging device (10) comprises a metal cover plate (11), a ceramic tube shell (12), a solder piece (13) and a chip (14), the solder piece (13) is arranged between the metal cover plate (11) and the ceramic tube shell (12) and welds the metal cover plate (11) and the ceramic tube shell (12) together, a containing cavity (101) is arranged between the metal cover plate (11) and the ceramic tube shell (12), and the chip (14) is arranged in the containing cavity (101) and is fixed with the ceramic tube shell (12); The reworking method comprises the following steps: Separating the metal cover plate (11) of the ceramic packaged device (10) with poor packaging from the ceramic package (12) and forming an old metal cover plate (11) and an old ceramic package (12); -providing a new metal cover plate (11) and a new solder sheet (13), -welding the new metal cover plate (11) with the old ceramic envelope (12) by means of the new solder sheet (13).
  2. 2. The reworking method of a ceramic packaged device according to claim 1, wherein the step of separating the metal cover plate (11) of the poorly packaged ceramic packaged device (10) from the ceramic package case (12) comprises: and placing the ceramic packaged device (10) with poor packaging into a vacuum reflow furnace, and starting a separation operation procedure of the vacuum reflow furnace.
  3. 3. The reworking method of a ceramic packaged device according to claim 2, wherein the step of separating the metal cover plate (11) of the poorly packaged ceramic packaged device (10) from the ceramic package case (12) further comprises: providing a reworking jig, placing the ceramic packaging device (10) with poor packaging on the reworking jig, wherein the metal cover plate (11) of the ceramic packaging device (10) is contacted with the reworking jig.
  4. 4. A method of reworking a ceramic packaged device according to claim 1 wherein the step of welding the new metal cover plate (11) to the old ceramic package (12) comprises: and sandwiching a new solder sheet (13) between the new metal cover plate (11) and the old ceramic tube shell (12), putting the new solder sheet and the old ceramic tube shell into a vacuum reflow furnace together, and then starting a melting and sealing operation procedure of the vacuum reflow furnace.
  5. 5. The reworking method of a ceramic packaged device according to claim 4, wherein the step of welding the new metal cover plate (11) to the old ceramic package (12) further comprises: Providing a reworking jig, wherein a new metal cover plate (11), a new solder sheet (13) and an old ceramic tube shell (12) are mutually overlapped and then placed on the reworking jig, and the new metal cover plate (11) is contacted with the reworking jig.
  6. 6. The reworking method of a ceramic packaged device according to claim 4, wherein the step of welding the new metal cover plate (11) to the old ceramic package (12) further comprises: The new solder sheet (13) is firstly arranged on one side of the new metal cover plate (11), and then one side of the new metal cover plate (11) provided with the solder sheet (13) is attached to the old ceramic tube shell (12).
  7. 7. The method of reworking a ceramic packaged device according to any of claims 1 to 6, comprising: detecting the reworked ceramic packaging device (10); if the detection structure of the ceramic package device (10) after reworking is bad, repeating the reworking method of the ceramic package device according to any one of claims 1-6.
  8. 8. Ceramic package device characterized in that reworking is performed using the reworking method of the ceramic package device according to any of claims 1-7, the ceramic package device (10) comprising a metal cover plate (11), a ceramic package shell (12), a solder sheet (13) and a chip (14), the solder sheet (13) being provided between the metal cover plate (11) and the ceramic package shell (12) and welding the metal cover plate (11) and the ceramic package shell (12) together, a receiving cavity (101) being provided between the metal cover plate (11) and the ceramic package shell (12), the chip (14) being mounted in the receiving cavity (101) and being fixed with the ceramic package shell (12).
  9. 9. The ceramic packaged device according to claim 8, wherein the ceramic package (12) is provided with a groove (121), a first boss (122) and a second boss (123) facing the metal cover plate (11), the first boss (122) is located at the periphery of the groove (121), the second boss (123) is located at the periphery of the first boss (122), and the chip (14) is fixed in the groove (121); A plurality of first bonding pads (122 a) are arranged on the first boss (122), a plurality of second bonding pads (141) corresponding to the first bonding pads (122 a) are arranged on the chip (14), and the first bonding pads (122 a) and the second bonding pads (141) are electrically connected through bonding wires (15); and a connecting metal layer (123 a) is arranged on the second boss (123), and the connecting metal layer (123 a) is contacted with the solder sheet (13).
  10. 10. The ceramic packaged device according to claim 8, wherein the bottom wall of the recess (121) is provided with a first heat conductive metal layer (121 a), the side of the ceramic package (12) remote from the metal cover plate (11) is provided with a second heat conductive metal layer (124) and a third bonding pad (125) located at the periphery of the second heat conductive metal layer (124), and the third bonding pad (125) extends from the edge of the side of the ceramic package (12) remote from the metal cover plate (11) to the side of the ceramic package (12).

Description

Ceramic package device and reworking method Technical Field The invention relates to the technical field of ceramic packaging, in particular to a ceramic packaging device and a reworking method. Background Chip packaging is a critical step in the semiconductor manufacturing process that involves protecting bare semiconductor chips (die) for use in electronic devices. The chip package is generally packaged by adopting ceramic package, and the ceramic package has the characteristics of high reliability and the like, is widely applied to the markets of aviation, aerospace, automobiles and electronic consumer goods, and has relatively high cost of ceramic tube shells and chips in ceramic package products, so that the ceramic package products are required to have higher yield. However, in the process production of the ceramic package sealing cover, due to the reasons of material consistency difference, improper manual operation, equipment failure, abnormal factory air supply and the like, the defects of gold tin flash to the top of the cover plate, uneven flash, holes and the like (shown in fig. 1 and 2) can be caused, so that the whole product is directly scrapped. The conventional method is to discard the scrapped products directly, which causes the problems of product yield loss, material cost loss, customer satisfaction reduction, market competitiveness reduction and the like. Disclosure of Invention In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a ceramic packaging device and a reworking method, which are used for solving the problems of lower yield and higher cost of ceramic packaging in the prior art. The aim of the invention is achieved by the following technical scheme: The invention provides a reworking method of a ceramic packaging device, which provides a ceramic packaging device with poor packaging, wherein the ceramic packaging device comprises a metal cover plate, a ceramic tube shell, a solder piece and a chip, wherein the solder piece is arranged between the metal cover plate and the ceramic tube shell and welds the metal cover plate and the ceramic tube shell together, a containing cavity is arranged between the metal cover plate and the ceramic tube shell, and the chip is arranged in the containing cavity and is fixed with the ceramic tube shell; The reworking method comprises the following steps: Separating the metal cover plate of the ceramic packaging device with poor packaging from the ceramic tube shell, and forming an old metal cover plate and an old ceramic tube shell; Providing a new metal cover plate and a new solder sheet, and welding the new metal cover plate and the old ceramic tube shell together through the new solder sheet. Further, the step of separating the metal cover plate of the ceramic packaged device with poor packaging from the ceramic package case comprises the steps of: and placing the ceramic packaged device with poor packaging into a vacuum reflow furnace, and starting a separation operation procedure of the vacuum reflow furnace. Further, the step of separating the metal cover plate of the ceramic packaged device with poor packaging from the ceramic package shell further comprises: Providing a reworking jig, placing the ceramic packaging device with poor packaging on the reworking jig, wherein the metal cover plate of the ceramic packaging device is contacted with the reworking jig. Further, the step of welding the new metal cover plate to the old ceramic envelope comprises: and clamping the new solder sheet between the new metal cover plate and the old ceramic tube shell, putting the new solder sheet and the old ceramic tube shell into a vacuum reflow furnace together, and then starting a melting and sealing operation procedure of the vacuum reflow furnace. Further, the step of welding the new metal cover plate to the old ceramic envelope further comprises: Providing a reworking jig, and placing the new metal cover plate, the new solder sheet and the old ceramic tube shell on the reworking jig after being mutually overlapped, wherein the new metal cover plate is contacted with the reworking jig. Further, the step of welding the new metal cover plate to the old ceramic envelope further comprises: And firstly, arranging a new solder sheet on one side of the new metal cover plate, and then attaching one side of the new metal cover plate provided with the solder sheet to the old ceramic tube shell. Further, the reworking method includes: detecting the reworked ceramic packaging device; if the detection structure of the ceramic package device after reworking is bad, the reworking method of the ceramic package device is repeated. The application also provides a ceramic packaging device which is reworked by using the reworking method of the ceramic packaging device, wherein the ceramic packaging device comprises a metal cover plate, a ceramic tube shell, a solder piece and a chip, the solder piece is arranged between the