CN-122029216-A - Polyhydroxy amide compound, negative photosensitive resin composition, dry film, cured product, and electronic component

Abstract

The invention provides a polyhydroxy amide compound, which can obtain a novel negative photosensitive resin composition without containing resin components which can be a limiting object of PFAS. A polyhydroxy amide compound comprising a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2) is provided. [ chemical formula 1] (wherein R 1 is an organic group having a valence of 2.) [ chemical formula 2] (wherein R 2 is an organic group having a valence of 2.)

Inventors

• SHIBASAKI KAHO
• Xingsen Daigui
• JING SHANGHAO
• Ayano Okuda
• SUGITA Kenyu
• ISHIKAWA NOBUKATSU

Assignees

• 太阳控股株式会社

Dates

Publication Date

20260512

Application Date

20241023

Priority Date

20231107

Claims (6)

1. 1. A polyhydroxy amide compound comprising a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2), Wherein R 1 is a 2-valent organic group, Wherein R 2 is a 2-valent organic group.
2. 2. The polyhydroxy amide compound of claim 1, wherein the ratio [ n 1 /(n 1 +n 2 ) ] of the number n 1 of the structural units represented by the formula (1) to the total of the number n 1 of the structural units represented by the formula (1) and the number n 2 of the structural units represented by the formula (2) is 0.35 to 0.80.
3. 3. A negative photosensitive resin composition comprising the polyhydroxyamide compound according to claim 1.
4. 4. A dry film comprising a resin layer formed from the negative photosensitive resin composition according to claim 3.
5. 5. A cured product comprising the negative photosensitive resin composition according to claim 3 or the resin layer of the dry film according to claim 4.
6. 6. An electronic component having the cured product according to claim 5.

Description

Polyhydroxy amide compound, negative photosensitive resin composition, dry film, cured product, and electronic component Technical Field The invention relates to a polyhydroxy amide compound, a negative photosensitive resin composition, a dry film, a cured product and an electronic component. Background Photosensitive resin compositions containing polyimide precursors are widely used as insulating films in various fields such as semiconductors and electronic parts because they exhibit excellent properties such as insulation, heat resistance and mechanical strength. Conventionally, with the increase in performance and miniaturization of electronic components and electric devices, high integration of semiconductor elements has been demanded. In order to meet this demand, techniques for improving performance and miniaturizing in the field of semiconductor device packaging such as wafer level packaging have been developed. In an insulating film used for a rewiring layer, excellent resolution is required for miniaturization of pattern formation. Patent document 1 discloses a photosensitive resin composition containing a polybenzoxazole precursor, a compound that generates an acid by irradiation of active light in a specific wavelength region, a crosslinkable or polymerizable compound, and a compound that generates an acid by heat. According to the disclosure of patent document 1, a negative photosensitive resin composition exhibiting good sensitivity, resolution, chemical resistance, heat resistance, and mechanical properties is provided. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2012-203359 Disclosure of Invention Problems to be solved by the invention However, in recent years, restrictions on the use of perfluoroalkyl compounds (PFAS) have been studied internationally for reasons such as the correlation between permanently remaining chemical substances (Forever Chemicals) and health hazards. From the viewpoints of light transmittance and developability, the negative photosensitive resin composition of patent document 1 may contain a perfluoroalkyl group in a polybenzoxazole precursor, and may be subject to PFAS limitation. In the future, a negative photosensitive resin composition capable of coping with PFAS restrictions and having characteristics equivalent to those of a conventional negative photosensitive resin composition is demanded. The present invention has been made in view of the above problems, and an object of the present invention is to provide a polyhydroxy amide compound which can provide a novel negative photosensitive resin composition free from a resin component which can be subject to PFAS restrictions. Further, the object is to provide a dry film having a resin layer formed from the negative photosensitive resin composition, a cured product formed from the negative photosensitive resin composition or the resin layer of the dry film, and an electronic component having the cured product. Solution for solving the problem One embodiment of the present invention is a polyhydroxy amide compound. The polyhydroxy amide compound is a polyhydroxy amide compound comprising a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2). (Wherein R 1 is a 2-valent organic group.) (Wherein R 2 is a 2-valent organic group.) In the polyhydroxyamide compound of the above embodiment, the ratio [ n 1/(n1+n2) ] of the number n 1 of the structural units represented by the above formula (1) to the total of the number n 1 of the structural units represented by the above formula (1) and the number n 2 of the structural units represented by the above formula (2) is preferably 0.35 to 0.80. In the negative photosensitive resin composition of the above embodiment, the weight average molecular weight of the polyhydroxy amide compound is preferably 2,000 to 20,000. Another embodiment of the present invention is a negative photosensitive resin composition. The negative photosensitive resin composition contains the polyhydroxy amide compound in the above manner. Another mode of the invention is a dry film. The dry film includes a resin layer formed from the negative photosensitive resin composition of the above embodiment. Another embodiment of the present invention is a cured product. The cured product is formed from the negative photosensitive resin composition of the above embodiment or the resin layer of the dry film of the above embodiment. Other aspects of the invention are electronic components. The electronic component has the cured product of the above-described embodiment. ADVANTAGEOUS EFFECTS OF INVENTION The present invention can provide a polyhydroxy amide compound which can provide a novel negative photosensitive resin composition free from a resin component which can be a subject of PFAS restriction. Further, a dry film having a resin layer formed from the negative photosensitive resin composi