CN-122029240-A - Resist coating comprising a polymeric sealant and resist particles

Abstract

The component includes a body and a coating deposited on a surface of the body. The coating comprises a porous ceramic. The coating further includes a polymeric sealant. The coating further includes a plurality of particles disposed in the polymeric sealant.

Inventors

• G.E-H.Jin

Assignees

• 应用材料公司

Dates

Publication Date

20260512

Application Date

20241008

Priority Date

20231010

Claims (20)

1. 1. A component, the component comprising: A main body A coating deposited on a surface of the metal body, the coating comprising: A porous ceramic; Polymer sealants A plurality of particles disposed in the polymeric sealant.
2. 2. The component of claim 1, wherein the plurality of particles comprise metal oxide nanoparticles.
3. 3. The component of claim 1, wherein the porous ceramic comprises one or more of: Alumina; Yttria; Yttrium oxyfluoride; zirconium oxide; Magnesium oxide or Silicon carbide.
4. 4. The component of claim 1, wherein the plurality of particles comprises one or more of: Yttrium oxyfluoride; Yttrium fluoride; Alumina; Magnesium oxide or Yttria.
5. 5. The component of claim 1, wherein the component comprises: A process chamber liner; Slit door liners; a plasma screen; Cathode sleeve, or A spray header.
6. 6. The component of claim 1, wherein the polymeric sealant impregnates the surface of the porous ceramic to a depth of 10 μιη to 500 μιη.
7. 7. The component of claim 1, wherein the polymeric sealant comprises a first portion and a second portion, wherein a distance between the surface of the metal body and the first portion of the polymeric sealant is less than a distance between the surface of the metal body and the second portion of the polymeric sealant, wherein a concentration of particles disposed in the polymeric sealant is such that the second portion of the polymeric sealant is greater than the first portion of the polymeric sealant.
8. 8. A method, the method comprising: forming a porous ceramic coating on a first surface of the body; Disposing a polymeric sealant precursor comprising a plurality of particles within one or more pores of the porous ceramic coating, and The polymer sealant precursor is cured to produce a polymer sealant.
9. 9. The method of claim 8, wherein the body comprises a component of a substrate chamber, the component comprising: A process chamber liner; Slit door liners; a plasma screen; Cathode sleeve, or A spray header.
10. 10. The method of claim 8, wherein forming the porous ceramic coating on the first surface comprises performing one or more of: Electrolytic oxidation by plasma; Thermal spraying; plasma spraying, or Physical vapor deposition.
11. 11. The method of claim 8, wherein the plurality of particles comprises one or more of: Yttrium oxyfluoride; Yttrium fluoride; Alumina; Magnesium oxide or Yttria.
12. 12. The method of claim 8, wherein forming the polymer sealant precursor comprises one or more of: Impregnating the porous ceramic coating in the polymeric sealant precursor; Spraying the polymer sealant precursor onto the porous ceramic coating, or The polymeric sealant precursor is brushed onto the porous ceramic coating.
13. 13. The method of claim 8, wherein forming the polymer sealant precursor comprising the plurality of particles comprises: applying the polymeric sealant precursor to the porous ceramic coating; applying the plurality of particles to the polymer sealant precursor applied to the porous ceramic coating, and The plurality of particles are impregnated into the polymeric sealant precursor.
14. 14. The method of claim 8, wherein forming the polymeric sealant comprising the plurality of particles comprises: Applying a first portion of the polymeric sealant precursor to the porous ceramic coating, wherein the first portion of the polymeric sealant precursor comprises a first particle concentration, and After providing the first portion of the polymeric sealant precursor, a second portion of the polymeric sealant precursor is applied, wherein the second portion of the polymeric sealant precursor comprises a second particle concentration, the second particle concentration being higher than the first particle concentration.
15. 15. A substrate processing chamber comprising a component, wherein the component comprises: metal body A coating deposited on a surface of the metal body, the coating comprising: A porous ceramic; Polymer sealants A plurality of particles disposed in the polymeric sealant.
16. 16. The substrate processing chamber of claim 15, wherein the porous ceramic comprises one or more of: Alumina; Yttria; Yttrium oxyfluoride; zirconium oxide; Magnesium oxide or Silicon carbide.
17. 17. The substrate processing chamber of claim 15, wherein the plurality of particles comprise one or more of: Yttrium oxyfluoride; Yttrium fluoride; Alumina; Magnesium oxide or Yttria.
18. 18. The substrate processing chamber of claim 15, wherein the polymeric sealant comprises a first portion and a second portion, wherein a distance between the surface of the metal body and the first portion of the polymeric sealant is less than a distance between the surface of the metal body and the second portion of the polymeric sealant, wherein a concentration of particles disposed in the polymeric sealant is such that the second portion of the polymeric sealant is greater than the first portion of the polymeric sealant.
19. 19. The substrate processing chamber of claim 15, wherein the component comprises: A process chamber liner; Slit door liners; a plasma screen; Cathode sleeve, or A spray header.
20. 20. The substrate processing chamber of claim 15, wherein the plurality of particles have a diameter of 10 to 500 nm a.

Description

Resist coating comprising a polymeric sealant and resist particles Technical Field Embodiments of the present invention relate to a resistant coating. In particular, embodiments of the present invention relate to a resistant coating comprising a polymeric sealant and a resistant particle. Background Chambers are used for a wide variety of processing system types. Examples of chambers include etch chambers, deposition chambers, annealing chambers, metrology chambers, and the like. Generally, a substrate, such as a semiconductor wafer, is placed on a substrate support within a chamber and then operated to advance substrate processing. Treating the substrate may include exposing the substrate to a corrosive environment. Various components of the process chamber, processing system, manufacturing system, etc. may also be exposed to corrosive environments. Providing one or more components with a coating may protect the components from corrosive environments. Disclosure of Invention The following presents a simplified summary of the disclosure in order to provide a basic understanding of some aspects of the invention. This summary is not an extensive overview of the disclosure. It is intended to neither identify key or critical elements of the invention nor delineate any scope of the particular embodiments of the invention or any scope of the claims. It is merely to present some concepts of the invention in a simplified form as a prelude to the more detailed description that is presented later. In some aspects of the invention, a component includes a body and a coating deposited on a surface of the body. The coating comprises a porous ceramic. The coating further includes a polymeric sealant. The coating further includes a plurality of particles disposed in the polymeric sealant. In some aspects of the invention, the method includes forming a porous ceramic coating on a first surface of the body. The method further includes disposing a polymeric sealant precursor comprising a plurality of particles within one or more pores of the porous ceramic coating. The method further includes curing the polymeric sealant precursor to produce the polymeric sealant. In some aspects of the invention, the substrate processing chamber includes a component. The component includes a metal body. The component further includes a coating deposited on the surface of the metal body. The coating comprises a porous ceramic. The coating further includes a polymeric sealant. The coating further includes a plurality of particles disposed in the polymeric sealant. Drawings The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements. It should be noted that individual references to "an" or "one" embodiments of the present disclosure do not necessarily refer to the same embodiment, meaning at least one. FIG. 1 is a top view of an example processing system, according to some embodiments. FIG. 2 is a cross-sectional view of a process chamber having one or more chamber components that may be coated with a resistant coating, according to some embodiments. Fig. 3A illustrates a coated object having a body and a coating, according to some embodiments. Fig. 3B depicts a coated object including a body and several coatings, according to some embodiments. Fig. 4 illustrates an example configuration of a deposition system for aerosol or thermal spray deposition, according to some embodiments. Fig. 5 depicts an apparatus for performing Plasma Electrolytic Oxidation (PEO), according to some embodiments. Fig. 6 a-b illustrate mechanisms and apparatus for using energetic particles to perform deposition techniques, according to some embodiments. Fig. 7 depicts a schematic diagram of a plasma spray deposition apparatus for a spray deposition technique, according to some embodiments. Fig. 8 is a flow chart of a method for producing a coating comprising a polymeric sealant and resistant particles, according to some embodiments. Detailed Description Methods, systems, apparatus, etc. are described herein relating to providing a resistant coating for use in manufacturing components of a system, such as a substrate manufacturing system, semiconductor wafer manufacturing equipment, etc. The resistant coating described herein may include a porous coating, such as a ceramic layer, which includes features that provide migration of molecules into regions within the resistant coating. The resistant coating described herein can include a sealant disposed within the pores of the porous coating. The resistant coating described herein may further include resistant particles disposed in the sealant within the pores of the porous coating. The substrate is processed and/or manufactured in one or more processing chambers. The processing chamber may be configured to distinguish between a processing environment (e.g., a spatial region in which a substrate i