CN-122029312-A - Copper-plated austenitic stainless steel coil

Abstract

According to the present invention, there is provided a copper-plated austenitic stainless steel coil comprising an austenitic stainless steel coil base material, and a copper-plated layer formed on an outer surface of the base material, wherein an average thickness of the copper-plated layer is 1 μm to 100 μm or less, and a ratio of the average thickness of the copper-plated layer to the thickness of the austenitic stainless steel coil base material is 0.2 or less.

Inventors

• Jiang Hengqiu
• LIU HANZHEN
• JIN ZHENXI

Assignees

• 浦项股份有限公司

Dates

Publication Date

20260512

Application Date

20241216

Priority Date

20231218

Claims (10)

1. 1. A copper-plated austenitic stainless steel coil, comprising: Austenitic stainless steel coil base material, and A copper plating layer formed on the outer surface of the base material, Wherein the copper plating layer has an average thickness of 1 μm to 100 μm or less, The ratio of the average thickness of the copper plating layer to the thickness of the austenitic stainless steel coil base material is 0.2 or less.
2. 2. The copper-plated austenitic stainless steel coil according to claim 1, wherein the austenitic stainless steel coil base material has a film index expressed as (Si+2Al)/Mn of 1.2 or less, Wherein Si, al and Mn represent the content of each element.
3. 3. The copper-plated austenitic stainless steel coil according to claim 1, wherein the composition of the austenitic stainless steel coil base material comprises, in weight%, 0.005-0.080% of C, 0.1-1.0% of Si, 0.1-1.5% of Mn, 0.05-0.5% of Cu, 8-13% of Ni, 16-20% of Cr, 0.05-2.5% of Mo, and 0.001-0.2% of Al.
4. 4. The copper-plated austenitic stainless steel coil according to claim 1, wherein the area ratio of the copper plating layer is 95% or more in an area of 100 x 100mm 2 on the surface.
5. 5. The copper-plated austenitic stainless steel coil according to claim 1, wherein the copper plating layer contains 75% or more of copper in weight%.
6. 6. The copper-plated austenitic stainless steel coil according to claim 1, wherein a nickel plating layer is further included between the austenitic stainless steel coil base material and the copper plating layer.
7. 7. A method for producing a copper-plated austenitic stainless steel coil, comprising the steps of: Preparing an austenitic stainless steel coil base material, and Immersing in a solution comprising 10g/L to 500g/L of a solution composed of CuSO 4 ·5H 2 O, 10g/L to 500g/L of H 2 SO 4 and the balance of water, and applying a current density of 1A/dm 2 to 50A/dm 2 for 1-150 seconds to perform copper plating.
8. 8. The method for producing a copper-plated austenitic stainless steel coil according to claim 7, wherein the austenitic stainless steel coil base material has a film index expressed by (Si+2Al)/Mn of 1.2 or less, Wherein Si, al and Mn represent the content of each element.
9. 9. The method for producing a copper-plated austenitic stainless steel coil stock according to claim 7, wherein the austenitic stainless steel coil stock comprises, in weight%, 0.005-0.080% of C, 0.1-1.0% of Si, 0.1-1.5% of Mn, 0.05-0.5% of Cu, 8-13% of Ni, 16-20% of Cr, 0.05-2.5% of Mo, and 0.001-0.2% of Al.
10. 10. The method for producing a copper-plated austenitic stainless steel coil according to claim 7, wherein the method comprises a step of immersing in sulfuric acid having a concentration of 5g/L to 200g/L or a mixed acid of nitric acid and hydrofluoric acid having a concentration of 1g/L to 20g/L for 1 sec to 120 sec before copper plating.

Description

Copper-plated austenitic stainless steel coil Technical Field The present invention relates to a copper-plated austenitic stainless steel coil. Background Copper can be used for braze bonding by utilizing the property of copper that has a lower melting point than stainless steel when copper is plated on the stainless steel surface. However, it is difficult to find a case of copper plating on the surface of stainless steel coil. In addition, from the plating point of view, there are cases where nickel is plated in order to improve the surface conductivity, and there are cases where aluminum is plated in order to improve the brine corrosion resistance. However, it is still difficult to find a copper plating case on stainless steel coils. In addition, there is a method of laminating copper by cladding in order to improve the conductivity of the stainless steel surface, but it is also difficult to find a case of plating copper on the stainless steel coil surface by plating. Stainless steel generally forms a passivation film to impart corrosion resistance. Since the passivation film is mainly composed of a compound of chromium and oxygen and is uniformly and densely distributed on the surface, even if copper plating is attempted, it is difficult to adhere a plating layer well, and even if copper plating is successful, there is a problem that the copper plating layer is easily peeled off when a copper-plated stainless steel product is molded. In the present invention, it is intended to solve the above-mentioned copper plating problem caused by the passivation film of the stainless steel coil. Disclosure of Invention First, the technical problem to be solved The invention provides a method for manufacturing a product plated with copper on the surface of a stainless steel coil. (II) technical scheme A copper-plated austenitic stainless steel coil according to an embodiment of the present invention includes an austenitic stainless steel coil base material, and a copper plating layer formed on an outer surface of the base material, wherein an average thickness of the copper plating layer is 1 μm to 100 μm or less, and a ratio of the average thickness of the copper plating layer to the thickness of the austenitic stainless steel coil base material is 0.2 or less. Further, in the copper-plated austenitic stainless steel coil according to an embodiment of the present invention, a film index expressed as (si+2al)/Mn of the austenitic stainless steel coil base material may satisfy 1.2 or less. (wherein Si, al and Mn represent the content of each element) Further, in the copper-plated austenitic stainless steel coil according to an embodiment of the present invention, the composition of the austenitic stainless steel coil base material may include, in weight%, 0.005 to 0.080% of C, 0.1 to 1.0% of Si, 0.1 to 1.5% of Mn, 0.05 to 0.5% of Cu, 8 to 13% of Ni, 16 to 20% of Cr, 0.05 to 2.5% of Mo, and 0.001 to 0.2% of Al. Further, the copper-plated austenitic stainless steel coil according to an embodiment of the present invention may have an area ratio of the copper plating layer of 95% or more in an area of 100×100mm 2 of the surface. Further, in the copper-plated austenitic stainless steel coil according to an embodiment of the present invention, the copper-plated layer may contain 75% or more of copper in weight%. A method for producing a copper-plated austenitic stainless steel coil according to another embodiment of the present invention comprises the steps of preparing an austenitic stainless steel coil base material, and immersing in a solution comprising 10g/L to 500g/L of a solution composed of CuSO 4·5H2 O, 10g/L to 500g/L of H 2SO4 and the balance of water, and applying a current density of 1A/dm 2 to 50A/dm 2 for 1-150 seconds to perform copper plating. In the method for producing a copper-plated austenitic stainless steel coil according to one embodiment of the present invention, the austenitic stainless steel coil base material may have a film index expressed by (si+2al)/Mn of 1.2 or less. (wherein Si, al and Mn represent the content of each element) In addition, in the method for producing a copper-plated austenitic stainless steel coil according to one embodiment of the present invention, the composition of the austenitic stainless steel coil base material may include, in weight%, 0.005 to 0.080% of C, 0.1 to 1.0% of Si, 0.1 to 1.5% of Mn, 0.05 to 0.5% of Cu, 8 to 13% of Ni, 16 to 20% of Cr, 0.05 to 2.5% of Mo, and 0.001 to 0.2% of Al. Further, the method for manufacturing a copper-plated austenitic stainless steel coil according to an embodiment of the present invention may include a step of immersing in sulfuric acid having a concentration of 5g/L to 200g/L or a mixed acid of nitric acid and hydrofluoric acid having a concentration of 1g/L to 20g/L for 1 second to 120 seconds before copper plating. (III) beneficial effects The copper-plated austenitic stainless steel according to the present invention has excel