CN-122029417-A - System and method for recovering organic contaminants from semiconductor wafers

Abstract

Systems and methods for collecting and combining multiple scanned samples from a surface of a semiconductor wafer are described. System embodiments include, but are not limited to, a scanning nozzle configured to introduce a first scanning solution to a surface of a semiconductor wafer to remove impurities from the surface to provide a first scanning sample and retrieve the first scanning sample, the scanning nozzle further configured to introduce a second scanning solution to the surface of the semiconductor wafer to remove residual impurities from the surface to provide a second scanning sample and retrieve the second scanning sample, and a collection container in fluid communication with the scanning nozzle, the collection container configured to receive each of the first scanning sample and the second scanning sample from the nozzle and mix the first scanning sample with the second scanning sample to provide a combined scanning sample.

Inventors

• J. Winestar
• B. Dufick
• D, R, Vader
• S Kate Ka Er
• A. SCHULTZ
• K - W - Meyer Ewell
• MATTER BENJAMIN A.

Assignees

• 基础科学公司

Dates

Publication Date

20260512

Application Date

20240827

Priority Date

20230901

Claims (20)

1. 1. A system for collecting and combining a plurality of scanned samples from a surface of a semiconductor wafer, comprising: A scanning nozzle configured to direct a first scanning solution to a surface of a semiconductor wafer to remove impurities from the surface to provide a first scanning sample and retrieve the first scanning sample, the scanning nozzle further configured to direct a second scanning solution to a surface of a semiconductor wafer to remove residual impurities from the surface to provide a second scanning sample and retrieve the second scanning sample, and A collection container in fluid communication with the scanning nozzle, the collection container configured to receive each of the first and second scan samples from the nozzle and mix the first and second scan samples to provide a combined scan sample.
2. 2. The system of claim 1, further comprising an analysis system fluidly coupled to the collection container, the analysis system configured to receive the combined scanned sample from the collection container for performing an analytical assay on one or more components of the combined scanned sample.
3. 3. The system of claim 2, wherein the analysis system comprises at least one of a time of flight (TOF) mass spectrometer, a triple quadrupole (triple quadrupole or QQQ) mass spectrometer, a gas chromatography-mass spectrometry (GC-MS) system, or a gas chromatography-flame ionization detector (GC-FID).
4. 4. The system of claim 2, wherein the analysis system comprises at least one of an inductively coupled plasma mass spectrometer (ICP/ICP-MS) or an inductively coupled plasma atomic emission spectrometer (ICP-AES).
5. 5. The system of claim 2, wherein the analysis system comprises at least one of a time of flight (TOF) mass spectrometer, a triple quadrupole (triple quadrupole or QQQ) mass spectrometer, a gas chromatography-mass spectrometry (GC-MS) system, a gas chromatography-flame ionization detector (GC-FID), an inductively coupled plasma mass spectrometer (ICP/ICP-MS), or an inductively coupled plasma atomic emission spectrometer (ICP-AES).
6. 6. The system of claim 2, further comprising a valve fluidly coupled between a collection container and an analysis system, the valve configured to selectively permit or restrict flow of the combined scanning sample from the collection container to the analysis system.
7. 7. The system of claim 1, wherein the first scanning solution has a different composition than the second scanning solution.
8. 8. The system of claim 1, wherein the first scanning solution has the same composition as the second scanning solution.
9. 9. The system of claim 1, wherein the collection vessel comprises a vent port configured to allow exchange of gas between an interior of the collection vessel and an ambient environment in which the collection vessel is located.
10. 10. The system of claim 1, wherein the collection container comprises an angled bottom portion through which the combined scan sample is configured to pass.
11. 11. A method for collecting and combining a plurality of scanned samples from a surface of a semiconductor wafer, comprising: Directing a first scanning fluid onto a surface of the semiconductor wafer via a nozzle to allow interaction between the first scanning fluid and one or more contaminants present on the surface of the semiconductor wafer; removing a first scanning fluid containing at least a portion of one or more contaminants from a surface of the semiconductor wafer via the nozzle to provide a removed first scanning fluid; directing the removed first scanning fluid to a collection vessel; directing a second scanning fluid onto the surface of the semiconductor wafer via the nozzle to allow interaction between the second scanning fluid and one or more residual contaminants present on the surface of the semiconductor wafer after removal of the first scanning fluid; Removing a second scanning fluid containing at least a portion of one or more residual contaminants from a surface of the semiconductor wafer via the nozzle to provide a removed second scanning fluid, and The removed second scanning fluid is directed to the collection container to allow the received mixture of second scanning fluid and removed first scanning fluid to provide a combined scanned sample.
12. 12. The method of claim 11, further comprising transmitting the combined scanned sample to an analysis system fluidly coupled to the collection container for performing an analytical assay on one or more components of the combined scanned sample.
13. 13. The method of claim 12, wherein the analysis system comprises at least one of a time of flight (TOF) mass spectrometer, a triple quadrupole (triple quadrupole or QQQ) mass spectrometer, a gas chromatography-mass spectrometry (GC-MS) system, or a gas chromatography-flame ionization detector (GC-FID).
14. 14. The method of claim 12, wherein the analysis system comprises at least one of inductively coupled plasma mass spectrometry (ICP/ICP-MS) or inductively coupled plasma atomic emission spectrometry (ICP-AES).
15. 15. The system of claim 12, wherein the analysis system comprises at least one of a time of flight (TOF) mass spectrometer, a triple quadrupole (triple quadrupole or QQQ) mass spectrometer, a gas chromatography-mass spectrometry (GC-MS) system, a gas chromatography-flame ionization detector (GC-FID), an inductively coupled plasma mass spectrometer (ICP/ICP-MS), or an inductively coupled plasma atomic emission spectrometer (ICP-AES).
16. 16. The system of claim 12, wherein transferring the combined scanned sample to an analysis system fluidly coupled to the collection container for performing an analytical assay on one or more components of the combined scanned sample comprises: The combined scanned sample is transferred to the analysis system for analytical determination of one or more components of the combined scanned sample through a valve fluidly coupled between the collection container and the analysis system.
17. 17. The method of claim 11, wherein the first scanning fluid has a different composition than the second scanning fluid.
18. 18. The method of claim 11, wherein the first scanning fluid has the same composition as the second scanning fluid.
19. 19. The method of claim 11, further comprising exchanging one or more gases between the interior of the collection vessel and an ambient environment in which the collection vessel is located via a vent port.
20. 20. The method of claim 11, wherein the collection container comprises an angled bottom portion through which the combined scan sample is configured to pass.

Description

System and method for recovering organic contaminants from semiconductor wafers Cross Reference to Related Applications The present application claims priority from U.S. provisional application No.63/536,194, titled "SYSTEMS AND METHODS FOR RECOVERY AND IDENTIFICATION OF ORGANIC CONTAMINANTS AND RESIDUE ON SEMICONDUCTOR WAFER SURFACES", U.S. provisional application No.63/585,787, titled "COLLECTION AND COMBINATION OF MULTIPLE SCAN SAMPLES FOR SEMICONDUCTOR WAFER ANALYSIS", U.S. provisional application No.63/585,805, titled "INLINE GENERATION OF ORGANIC SOLVENT SCAN SOLUTION FOR SEMICONDUCTOR WAFER ANALYSIS", and U.S. provisional application No.63/585,805, titled "SYSTEMS AND METHODS FOR RECOVERING ORGANIC CONTAMINANTS FROM SEMICONDUCTING WAFERS", titled "2023, 9, 27, 35, and U.S. provisional application No.63/585,810, titled" 2023, 9, 27, according to clause 119 (e) of the American code 35. U.S. provisional application Ser. Nos. 63/536,194, 63/585,787, 63/585,805 and 63/585,810 are incorporated herein by reference in their entireties. Background Mass spectrometry is an analytical technique for determining trace amounts of impurities (e.g., elements, organics, or other impurities) in a liquid or gas sample. A sample introduction system may be used to introduce a fluid sample into various analytical instruments. The sample introduction system may transport an aliquot of the liquid sample to a nebulizer that converts the sample into a polydisperse aerosol suitable for ionization in a mass spectrometry instrument. Inductively Coupled Plasma (ICP) ionization sources are used for elemental impurities, while electrospray, atmospheric Pressure Chemical Ionization (APCI) or other ionization sources are used for organic impurities. These ionization sources are coupled to a mass spectrometer, such as a quadrupole mass spectrometer, a time-of-flight mass spectrometer, an ion trap mass spectrometer, or the like. Disclosure of Invention Systems and methods for collecting and combining multiple scanned samples from a surface of a semiconductor wafer are described. System embodiments include, but are not limited to, a scanning nozzle configured to introduce a first scanning solution to a surface of a semiconductor wafer to remove impurities from the surface to provide a first scanning sample and retrieve the first scanning sample, the scanning nozzle further configured to introduce a second scanning solution to the surface of the semiconductor wafer to remove residual impurities from the surface to provide a second scanning sample and retrieve the second scanning sample, and a collection container in fluid communication with the scanning nozzle, the collection container configured to receive each of the first scanning sample and the second scanning sample from the nozzle and mix the first scanning sample with the second scanning sample to provide a combined scanning sample. In one aspect, a method for collecting and combining a plurality of scan samples from a surface of a semiconductor wafer includes, but is not limited to, directing a first scan fluid onto the surface of the semiconductor wafer via a nozzle to allow interaction between the first scan fluid and one or more contaminants present on the surface of the semiconductor wafer, removing a first scan fluid containing at least a portion of the one or more contaminants from the surface of the semiconductor wafer via the nozzle to provide a removed first scan fluid, directing the removed first scan fluid onto a collection container, directing a second scan fluid onto the surface of the semiconductor wafer via the nozzle to allow interaction between the second scan fluid and one or more residual contaminants present on the surface of the semiconductor wafer after removal of the first scan fluid, removing a second scan fluid containing at least a portion of the one or more residual contaminants from the surface of the semiconductor wafer via the nozzle to provide a removed second scan fluid, and directing the removed second scan fluid onto the surface of the semiconductor wafer to provide a combination of the removed first scan fluid and the collected sample. This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. Drawings The detailed description is described with reference to the accompanying drawings. The same reference numbers in different examples in the description and the figures may identify similar or identical elements. Fig. 1A is an isometric view of a system for recovering organic contaminants from a semiconductor wafer in accordance with an embodiment of the invention. Figure 1B is an isometric view of the system of figure 1A wherein a semiconductor wafer is positioned w