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CN-122029490-A - Photosensitive resin laminate, method for forming resist pattern, and method for forming wiring board

CN122029490ACN 122029490 ACN122029490 ACN 122029490ACN-122029490-A

Abstract

A photosensitive resin laminate excellent in developability of a photosensitive resin layer, adhesion of a resist pattern obtained, and resolution is provided. A photosensitive resin laminate comprising a support film and a photosensitive resin layer comprising a photosensitive resin composition comprising (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein the (A) component comprises (A-1) a copolymer comprising a structural unit derived from a hydroxyalkyl (meth) acrylate and having a weight average molecular weight of 25000 or less, and the content of the structural unit derived from a compound having an aromatic ring in the (A) component is 50 mass% or more based on the total mass of all monomer components.

Inventors

  • UNO DAISUKE
  • MATSUO YUTAKA

Assignees

  • 旭化成株式会社

Dates

Publication Date
20260512
Application Date
20240930
Priority Date
20231002

Claims (20)

  1. 1. A photosensitive resin laminate comprising a support film and a photosensitive resin layer comprising a photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) Alkali-soluble polymer, (B) A compound having an ethylenically unsaturated bond, (C) A photopolymerization initiator is used as a raw material, The component (A) comprises the following components: (A-1) a copolymer comprising structural units derived from hydroxyalkyl (meth) acrylate and having a weight average molecular weight of 25000 or less, The content of the structural unit derived from the compound having an aromatic ring in the component (A) is 50% by mass or more based on the total mass of all the monomer components.
  2. 2. The photosensitive resin laminate according to claim 1, wherein the proportion of the (a-1) copolymer in the (a) component is 50 mass% or more.
  3. 3. The photosensitive resin laminate according to claim 1, wherein the (B) component comprises the following components: (b1) The concentration of the ethylenic unsaturated bond is 0.0020 mol/g or more and 1 molecule of the compound having 2 ethylenic unsaturated bonds.
  4. 4. The photosensitive resin laminate according to claim 3, wherein the concentration of the ethylenic unsaturated bonds in the component (b 1) is 0.0024 mol/g or more.
  5. 5. The photosensitive resin laminate according to claim 3, wherein the concentration of the ethylenic unsaturated bonds in the component (b 1) is 0.0040 mol/g or more.
  6. 6. The photosensitive resin laminate according to claim 3, wherein the component (b 1) is a di (meth) acrylate having a bisphenol a structure.
  7. 7. The photosensitive resin laminate according to claim 3, wherein the content of the component (B1) is 75 mass% or more based on the total amount of the component (B).
  8. 8. The photosensitive resin laminate according to claim 3, wherein the content of the component (B1) is 90 mass% or more based on the total amount of the component (B).
  9. 9. The photosensitive resin laminate according to claim 3, wherein the component (B) contains a compound represented by the following general formula (III) as the component (B1): Wherein R 2 is a methyl group or a hydrogen atom, X 2 O is an oxyethylene group, and m3+m4 is an integer of 2 to 10.
  10. 10. The photosensitive resin laminate according to claim 1 or 2, wherein the weight average molecular weight of the (a-1) copolymer is 10.000 to 21000.
  11. 11. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the structural unit having an aromatic ring in the component (a) is 60 mass% or more.
  12. 12. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the structural unit having an aromatic ring in the component (a) is 65 mass% or more.
  13. 13. The photosensitive resin laminate according to claim 1 or 2, wherein the mass ratio of the photosensitive resin composition, i.e., the content of the entire (a) component/(the content of the entire (B) component) is 1.30 or more.
  14. 14. The photosensitive resin laminate according to claim 1 or 2, wherein the mass ratio of the photosensitive resin composition, i.e., the content of the entire (a) component/(the content of the entire (B) component) is 1.40 or more.
  15. 15. The photosensitive resin laminate according to claim 1 or 2, wherein the mass ratio of the photosensitive resin composition, i.e., the content of the entire (a) component/(the content of the entire (B) component) is 1.80 or more.
  16. 16. The photosensitive resin laminate according to claim 1 or 2, wherein a protective film is provided on a side of the photosensitive resin layer opposite to the support.
  17. 17. The photosensitive resin laminate according to claim 1 or 2, wherein the thickness of the photosensitive resin layer is 1 to 20 μm.
  18. 18. The photosensitive resin laminate according to claim 1 or 2, wherein the thickness of the photosensitive resin layer is 3 to 15 μm.
  19. 19. The photosensitive resin laminate according to claim 1 or 2, wherein the photosensitive resin layer has a thickness of 5 to 10 μm.
  20. 20. A method of forming a resist pattern, comprising: a step of laminating the photosensitive resin laminate according to any one of claims 1 to 9 on a substrate; exposing the laminated photosensitive resin layer of the photosensitive resin laminate to light, and And developing the photosensitive resin layer after exposure.

Description

Photosensitive resin laminate, method for forming resist pattern, and method for forming wiring board Technical Field The invention relates to a photosensitive resin laminate, a method for forming a resist pattern, and a method for forming a wiring board. Background In electronic devices such as printed wiring boards, wiring patterns are generally manufactured using a photolithography process. In recent years, with miniaturization and higher density of electronic devices, it has been demanded to form finer wirings than ever before for photolithography processes. As a method for manufacturing a wiring board, for example, MSAP (Modified SEMI ADDITIVE Process) and SAP (SEMI ADDITIVE Process) are often used. Patent document 1 proposes a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene sensitizer, wherein the binder polymer has a hydroxyalkyl (meth) acrylate unit and a styrene or styrene derivative unit, and the content of the styrene or styrene derivative unit is 40 mass% or more. Patent document 1 reports that a resist pattern excellent in adhesion and resolution can be formed by using the photosensitive resin composition. Prior art literature Patent literature Patent document 1 International publication No. 2021/193232 Disclosure of Invention Problems to be solved by the invention In the photolithography process, in addition to the adhesion and resolution of the resist pattern, there is a need for excellent developability of the photosensitive resin layer. However, in patent document 1, there is room for improvement from the viewpoint of obtaining balance between developability of the photosensitive resin layer and adhesion and resolution of the obtained resist pattern, and satisfying these characteristics. Accordingly, an object of the present invention is to provide a photosensitive resin laminate excellent in developability of a photosensitive resin layer, adhesion of a resist pattern obtained, and resolution. The present invention also provides a method for forming a resist pattern and a method for forming a wiring board using the photosensitive resin laminate. Solution for solving the problem One embodiment of the present invention is as follows. [ File name ] scope of claims [1] A photosensitive resin laminate comprising a support film and a photosensitive resin layer comprising a photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) Alkali-soluble polymer, (B) A compound having an ethylenically unsaturated bond, (C) A photopolymerization initiator is used as a raw material, The component (A) comprises the following components: (A-1) a copolymer comprising structural units derived from hydroxyalkyl (meth) acrylate and having a weight average molecular weight of 25000 or less, The content of the structural unit derived from the compound having an aromatic ring in the component (A) is 50% by mass or more based on the total mass of all the monomer components. [2] The photosensitive resin laminate according to item 1, wherein the proportion of the (A-1) copolymer in the (A) component is 50% by mass or more. [3] The photosensitive resin laminate according to item 1 or 2, wherein the (B) component comprises the following components: (b1) The concentration of the ethylenic unsaturated bond is 0.0020 mol/g or more and 1 molecule of the compound having 2 ethylenic unsaturated bonds. [4] The photosensitive resin laminate according to item 3, wherein in the component (b 1), the concentration of the ethylenic unsaturated bond is 0.0024 mol/g or more. [5] The photosensitive resin laminate according to item 3, wherein in the component (b 1), the concentration of the ethylenic unsaturated bonds is 0.0040 mol/g or more. [6] The photosensitive resin laminate according to item 3, wherein the component (b 1) is a di (meth) acrylate having a bisphenol A structure. [7] The photosensitive resin laminate according to item 3 or 4, wherein the content of the component (B1) is 75 mass% or more based on the total amount of the component (B). [8] The photosensitive resin laminate according to any one of items 3 to 7, wherein the content of the component (B1) is 90 mass% or more based on the total amount of the component (B). [9] The photosensitive resin laminate according to any one of items 3 to 8, wherein the component (B) contains a compound represented by the following general formula (III) as the component (B1): (wherein R 2 is a methyl group or a hydrogen atom, X 2 O is an oxyethylene group, and m3+m4 is an integer of 2 to 10.). [10] The photosensitive resin laminate according to any one of items 1 to 9, wherein the weight average molecular weight of the copolymer (A-1) is 10.000 to 21000. [11] The photosensitive resin laminate according to any one of items 1 to 10, wherein the content of the structural unit having an aromatic ring in the component (A) is 60 mass% or more. [1