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CN-122029708-A - Optical module and method for manufacturing optical module

CN122029708ACN 122029708 ACN122029708 ACN 122029708ACN-122029708-A

Abstract

The optical module (100, 200) of the present disclosure comprises a package (40), a carrier (1) housed in the package (40), a semiconductor laser device (2) disposed on the carrier (1), a lens (3) that converts a laser beam (15) emitted from the semiconductor laser device (2) into parallel light, a beam splitter (4) that branches the laser beam (15) transmitted through the lens (3) into a first laser beam (20 a) emitted to the outside and a second laser beam (20 b) reflected to the inside, a first light receiving element (5) that has a reflective film (30) formed on a light receiving surface, receives a part of the second laser beam (20 b), and reflects the remaining part (20 c) of the second laser beam, an etalon (6) that selects the wavelength of the incident remaining part (20 c) of the second laser beam, and a second light receiving element (7) that receives the laser beam of the wavelength selected by the etalon (6).

Inventors

  • SHINICHI KANEKO

Assignees

  • 三菱电机株式会社

Dates

Publication Date
20260512
Application Date
20231019

Claims (11)

  1. 1. An optical module, comprising: And (3) packaging: a carrier housed in the package; a semiconductor laser device disposed on the carrier; a lens that converts a laser beam emitted from the semiconductor laser device into parallel light; a beam splitter that splits the laser beam transmitted through the lens into a first laser beam emitted to the outside and a second laser beam reflected to the inside; A first light receiving element having a reflective film formed on a light receiving surface, the first light receiving element receiving a part of the second laser beam and reflecting the remaining part of the second laser beam; An etalon which selects the wavelength of the remaining portion of the incident second laser beam, and A second light receiving element that receives the laser beam of the wavelength selected by the etalon.
  2. 2. An optical module as claimed in claim 1, characterized in that, The semiconductor laser device is disposed at a position offset from a central axis of the carrier in a light emitting direction by a predetermined offset distance along a vertical direction of the central axis.
  3. 3. An optical module as claimed in claim 2, characterized in that, The lens is disposed at a position offset from the semiconductor laser device toward the central axis by a preset reverse offset distance.
  4. 4. An optical module as claimed in any one of claims 1 to 3, wherein, The reflectance of the reflective film is 30% or more and 70% or less.
  5. 5. An optical module as claimed in any one of claims 1 to 3, wherein, The reflectance of the reflective film is 40% or more and 60% or less.
  6. 6. The light module as recited in any one of claims 1-5, wherein, The package is a CAN package or a BOX package.
  7. 7. A method for manufacturing an optical module is characterized by comprising the following steps: a step of disposing the semiconductor laser device at a predetermined position on the carrier; A step of disposing a lens on the carrier at a position where the laser beam emitted from the semiconductor laser device is incident; a step of arranging a beam splitter on the carrier, and adjusting an angle of the beam splitter with respect to the laser beam, the beam splitter emitting a part of the laser beam converted into parallel light by the lens as a first laser beam to the outside and reflecting the remaining part of the laser beam as a second laser beam to the inside; A step of arranging a first light receiving element having a reflective film formed on a light receiving surface thereof on the carrier at a position where the first light receiving element receives a part of the second laser beam and reflects the remaining part of the second laser beam, and adjusting an angle of the first light receiving element with respect to the incident second laser beam; A step of disposing an etalon on the carrier at a position where the remaining part of the second laser beam is incident, and selecting a wavelength of the incident remaining part of the second laser beam by the etalon, and And a step of disposing a second light receiving element that receives the laser beam having the wavelength selected by the etalon on the carrier.
  8. 8. The method of manufacturing an optical module according to claim 7, The method further includes a step of controlling the temperature and the drive current of the semiconductor laser device so that the laser beam emitted from the semiconductor laser device has a predetermined wavelength and a predetermined light output.
  9. 9. The method for manufacturing an optical module according to claim 7 or 8, wherein, In the step of providing the lens, the position of the lens in the optical axis direction is adjusted so that the laser beam emitted from the semiconductor laser device is converted into parallel light, and the lens is moved in a direction perpendicular to the optical axis direction and in a direction parallel to the mounting surface, whereby the photocurrent of the second light receiving element is adjusted to a preset current value.
  10. 10. The method for manufacturing an optical module according to claim 7 or 8, wherein, When the semiconductor laser device is disposed on the carrier, the semiconductor laser device is disposed at a position offset from a central axis of the carrier in a light emitting direction by a predetermined offset distance along a vertical direction of the central axis.
  11. 11. The method of manufacturing an optical module according to claim 10, wherein, When the lens is disposed on the carrier, the lens is disposed at a position offset from the semiconductor laser device toward the central axis by a preset reverse offset distance.

Description

Optical module and method for manufacturing optical module Technical Field The present disclosure relates to an optical module and a method of manufacturing the optical module. Background With the popularization of networks, the increase in capacity of optical communication systems is advancing. As a large-capacity optical communication system, a dense wavelength division multiplexing transmission system (DENSE WAVELENGTH Division Multiplexing: DWDM) that multiplexes optical signals at a predetermined wavelength interval with high density, a digital coherence system that carries information in addition to intensity modulation in a phase and carries a plurality of pieces of information on one modulator, and the like have been introduced. In the DWDM system, in order to reduce filter loss of signals and reduce crosstalk between channels, it is necessary to control the wavelength of the light source to match a predetermined wavelength with high accuracy. In addition, in the digital coherence system, since the transmitted and received optical signals need to be made to coincide with the wavelength of the local light emission and interfere with each other, the wavelength of the light source needs to be controlled to coincide with a predetermined wavelength with high accuracy. On the other hand, a semiconductor Laser Device (LD) as a light source of an optical communication system has a characteristic that a wavelength of an emitted Laser beam changes according to an ambient temperature, a driving current, and the like. Therefore, a wavelength monitor for monitoring the oscillation wavelength of the laser beam emitted from the LD is incorporated in the optical module, thereby controlling the wavelength with high accuracy. In the light source device described in patent document 1, a beam splitter branches a laser beam emitted from an LD to a monitor PD1 side and a monitor PD2 side, and the monitor PD1 side monitors the light output of the laser beam emitted from the LD, and the monitor PD2 side is mounted on a front stage of the monitor PD2, and the laser beam emitted from the LD is controlled by monitoring the oscillation wavelength of the LD with an etalon that selects the wavelength of the incident laser beam. Patent document 1 Japanese patent No. 4255611 In a large-capacity optical communication system, a small-sized and low-priced optical module is required. The CAN-type optical module using the TO-CAN is advantageous in downsizing and cost reduction because of its small number of optical components and excellent mass productivity. However, the CAN package has a narrow internal space, and it is difficult to secure a space for mounting optical components such as a wavelength monitor. In particular, since the internal space in the direction perpendicular to the optical axis needs to be one turn smaller than the lead pins that are the electrical interface of the CAN package, there is a problem in that only a mounting space of about 2mm in diameter is required in the CAN package. In addition, although there is no limitation in the optical axis direction of the CAN package such as the vertical direction, it is desirable that the optical axis direction is also short in size. In the light source device described in patent document 1, since an optical system is arranged to branch light in a vertical direction with respect to the emitted light and to make the branched light enter each of the two photodetectors, there is a problem in that a wavelength monitor becomes large and the device is difficult to be miniaturized. Disclosure of Invention The present disclosure has been made to solve the above-described problems, and an object thereof is to obtain a miniaturized optical module with a built-in wavelength monitor and a method for manufacturing the optical module. The optical module of the present disclosure is provided with: And (3) packaging: a carrier housed in the package; a semiconductor laser device disposed on the carrier; a lens that converts a laser beam emitted from the semiconductor laser device into parallel light; a beam splitter that splits the laser beam transmitted through the lens into a first laser beam emitted to the outside and a second laser beam reflected to the inside; A first light receiving element having a reflective film formed on a light receiving surface, the first light receiving element receiving a part of the second laser beam and reflecting the remaining part of the second laser beam; An etalon which selects the wavelength of the remaining portion of the incident second laser beam, and A second light receiving element that receives the laser beam of the wavelength selected by the etalon. The method for manufacturing an optical module of the present disclosure comprises the steps of: a step of disposing the semiconductor laser device at a predetermined position on the carrier; A step of disposing a lens on the carrier at a position where the laser beam emitted from the semiconductor la