CN-122029938-A - Circuit board and semiconductor package including the same

CN122029938ACN 122029938 ACN122029938 ACN 122029938ACN-122029938-A

Abstract

One embodiment of the invention discloses a circuit board comprising a glass layer and an insulating layer surrounding at least a portion of the glass layer, wherein an outer surface of the glass layer comprises a first surface lying on the same plane as an outer surface of the insulating layer and a second surface covered by the insulating layer.

Inventors

SUN RONGHAO
JIN WUCHENG
Han Zhengen

Assignees

LG伊诺特有限公司

Dates

Publication Date: 20260512
Application Date: 20240909
Priority Date: 20231011

Claims (10)

1. A circuit board, comprising: Glass layer, and An insulating layer surrounding at least a portion of the glass layer, Wherein the outer side surface of the glass layer includes a first surface disposed coplanar with the outer side surface of the insulating layer and a second surface covered by the insulating layer.
2. The circuit board of claim 1, wherein the outer side surface of the glass layer comprises: A first outer side surface disposed in a first horizontal direction; A second outer side surface disposed in a second horizontal direction; a first groove surface which is stepped in the second horizontal direction and is provided in the second horizontal direction in a region where the first outer side surface is adjacent to the second outer side surface, and A second groove surface that is in contact with the second outer side surface and is provided in a region of the first outer side surface stepped in the second horizontal direction in the first horizontal direction, and The glass layer includes a first protrusion located between the first groove surface and the second groove surface.
3. The circuit board of claim 2, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other, and The first protrusion extends along a third horizontal direction having a predetermined angle with respect to the first horizontal direction and the second horizontal direction.
4. The circuit board of claim 2, wherein the first tab comprises an outwardly extending sub-tab, The sub-projection further includes a first sub-outer side surface disposed along the first horizontal direction, and The first sub-outer side surface is disposed coplanar with an outer side surface of the insulating layer.
5. The circuit board according to claim 4, wherein the first sub-outer side surface of the sub-protrusion is disposed at a position outside of the first outer side surface or the second outer side surface.
6. The circuit board of claim 4, wherein a separation distance in the second horizontal direction between the first sub-outer side surface and the first outer side surface of the sub-protrusion is equal to a thickness of the insulating layer in the second horizontal direction.
7. The circuit board of claim 4, wherein the sub-tab comprises: A first sub-protrusion extending from the first protrusion in the second horizontal direction, and A second sub-projection extending from the first projection in the first horizontal direction.
8. The circuit board of claim 7, wherein a first sub-outer side surface of the first sub-protrusion is disposed spaced apart from the first outer side surface in the second horizontal direction, and The first sub-outer side surface of the second sub-protrusion is disposed to be spaced apart from the second outer side surface in the second horizontal direction.
9. The circuit board according to claim 7, wherein a first sub-outer side surface of the first sub-protrusion is provided at a position outside the first outer side surface, and The first sub-outer side surface of the second sub-protrusion is disposed at a position outside the second outer side surface.
10. The circuit board of claim 7, wherein the insulating layer comprises a first insulating layer disposed on the glass layer and a second insulating layer disposed outside the glass layer, and The first insulating layer is disposed on the second insulating layer.

Description

Circuit board and semiconductor package including the same Technical Field Embodiments in accordance with the present invention relate to a circuit board and a semiconductor package. Background As the performance of electrical/electronic products has advanced, techniques for attaching a large number of packages to a limited-sized substrate have been proposed and studied. However, since the general package is based on mounting a single semiconductor chip, there is a limit in obtaining desired performance. The general circuit board or package substrate has a form in which a processor package having a processor chip provided therein and a memory package having a memory chip attached thereto are connected as one body. Such a package substrate has advantages in that by manufacturing the processor chip and the memory chip as a single integrated package, the mounting area of the chip can be reduced, and high-speed signal transmission can be achieved through a shortened path. Due to such advantages, the above-described package substrate is widely used in mobile devices and the like. On the other hand, in recent years, as electronic devices such as mobile apparatuses become higher in specification and employ High Bandwidth Memory (HBM), package sizes have increased. In addition, as the functions required for the application processor increase, it is necessary to form a separate processor chip for each function and provide a circuit board on which the processor chip can be mounted. In this case, even when the application processor is divided into two processor chips for each function, the number of (input/output) terminals provided in each processor chip is increasing. Further, the number of power lines and signal lines has increased due to 5G, internet of things (IoT), higher display resolution, increased communication speed, and the like, and thus the number of terminals of the processor chip has tended to increase. Therefore, the area and thickness of the circuit board and the density of the circuit pattern are also increasing. When the area or thickness of the circuit board increases, problems such as difficulty in miniaturization of the product, reliability problems such as warpage of the circuit board, and increase in cost of the product may occur. Therefore, increasing the density of the circuit pattern instead of increasing the area or thickness of the circuit board is more advantageous in terms of product cost, reliability problems (e.g., warpage), and product miniaturization. Therefore, finer circuit patterns and through electrodes are required. In particular, as circuit boards become thinner, deformations such as warpage and distortion occurring during the manufacture of the circuit boards increase. In order to prevent this, a glass core structure in which a glass plate is formed in a core portion of a circuit board has been proposed. Disclosure of Invention Technical problem Embodiments of the present invention provide a circuit board that suppresses crack occurrence and crack propagation by a glass layer structure, and a semiconductor package including the circuit board. Further, the embodiment can provide a circuit board whose reliability is further improved by disposing a glass layer and an insulating layer provided on the outer side of the glass layer, and a semiconductor package including the circuit board. Further, the embodiment can provide a circuit board that suppresses a warpage phenomenon by using a glass layer having high rigidity and a low thermal expansion coefficient, and a semiconductor package including the circuit board. The object to be solved by the embodiments is not limited to the above-described object, and the above-described object will include objects and effects that can be clarified by a solution to the object and the embodiments described below. Technical proposal A circuit board according to an embodiment of the present invention includes a glass layer and an insulating layer surrounding at least a portion of the glass layer, wherein an outer side surface of the glass layer includes a first surface that is coplanar with an outer side surface of the insulating layer and a second surface that is covered by the insulating layer. The outer side surface of the glass layer may include a first outer side surface disposed in a first horizontal direction, a second outer side surface disposed in a second horizontal direction, a first groove surface stepped in the second horizontal direction and disposed in the second horizontal direction in a region where the first outer side surface is adjacent to the second outer side surface, and a second groove surface in contact with the second outer side surface and disposed in the first horizontal direction in a region where the first outer side surface is stepped in the second horizontal direction, and the glass layer may include a first protrusion located between the first groove surface and the second groove surface. The first horizontal dire