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CN-122029944-A - Modular system for manufacturing electronic devices and method for manufacturing electronic devices

CN122029944ACN 122029944 ACN122029944 ACN 122029944ACN-122029944-A

Abstract

The invention relates to a modular system for producing an electronic device (10), comprising a housing part (12) having a first side wall (26) and a second side wall (28) and an upper side (30) connecting the side walls (26, 28), a set of circuit boards (14), the circuit boards (14) being provided with different electrical connector means (16), and a set of separate side parts (18, 20), the side parts (18, 20) each having different recesses (38) corresponding to the different electrical connector means (16). Between the first side wall (26) and the second side wall (28) there is a receiving space (32) for receiving at least one circuit board (14) of the set of circuit boards (14). Optionally, at least one circuit board (14) of the set of circuit boards (14) is insertable into the receiving space (32) and a respective one of the set of discrete side members (18, 20) is connectable with the housing member (12) such that the first side wall (26) and the second side wall (28) form a continuous housing wall with the side members (18, 20) and the tab mechanism (16) arranged on the circuit board (14) is accessible through the recess (38) in the side members (18, 20). The invention also relates to a method for manufacturing an electronic device (10).

Inventors

  • SELLERER MARKUS
  • A von cage
  • W. Weitztein

Assignees

  • 德恩塞欧洲股份公司

Dates

Publication Date
20260512
Application Date
20241011
Priority Date
20231016

Claims (12)

  1. 1. A modular system for manufacturing an electronic device (10), the modular system having: A housing part (12) comprising a first side wall (26) and a second side wall (28), an upper side (30) connecting said side walls (26, 28); -a set of circuit boards (14), wherein the circuit boards (14) are provided with different electrical connector means (16); and a set of discrete side members (18, 20), wherein the side members (18, 20) each have a different recess (38) corresponding to a different electrical connector means (16), Wherein there is a receiving space (32) between the first side wall (26) and the second side wall (28) for receiving at least one circuit board (14) of the set of circuit boards (14), and Wherein optionally at least one circuit board (14) of the set of circuit boards (14) is insertable into the receiving space (32) and a respective one of the set of discrete side pieces (18, 20) is connectable with the housing piece (12) such that the first side wall (26) and the second side wall (28) together with the side pieces (18, 20) form a continuous housing wall and a joint mechanism (16) arranged on the circuit board (14) is accessible through a recess (38) in the side pieces (18, 20).
  2. 2. Modular system according to claim 1, characterized in that it comprises a set of different cover parts (24), wherein a recess (34) is present in the upper side (30) of the housing part, into which recess one of the different cover parts (24) can be selectively inserted.
  3. 3. Modular system according to claim 2, characterized in that the different cover parts (24) differ in their height.
  4. 4. A modular system according to claim 2 or 3, characterized in that on at least two opposite side edges of the cover part (24) there is at least one laterally projecting projection (46), respectively, which rests against the inner side of the housing part (12) in the inserted position in which the cover part (24) is inserted into the housing part (12).
  5. 5. Modular system according to any one of claims 2 to 4, characterized in that the cover part (24) is cuboid and has four side walls (40, 41, 42, 43) and one upper side (44), wherein at least two opposing side walls (40, 42) are configured to be elastically deformable and rest with their edges on the outside of the housing part (12) on the edges of the recess (34) in the inserted state into the housing part (12).
  6. 6. Modular system according to any one of the preceding claims, characterized in that on the inner side of the housing part (12) there is a guide (50) extending from the lower side to the upper side, along which guide the separate side parts (18, 20) can be pushed into the housing part (12) in a guided manner, in particular the guide (50) being provided on the first side wall (26) and/or the second side wall (28).
  7. 7. Modular system according to claim 6, characterized in that it has a bottom part (22) which can be fixed to the housing part (12), wherein the bottom part (22) in the fixed state rests against the side walls (26, 28) and the lower edge of the at least one side part (28, 20).
  8. 8. Modular system according to any one of the preceding claims, characterized in that the side parts (18, 20) each comprise at least one projection (52) protruding in the insertion direction, which projection overlaps the housing part (12) in the insertion direction in the final position of the side parts (18, 20).
  9. 9. Method for manufacturing an electronic device (12), wherein the electronic device (12) is manufactured, in particular by means of a modular system according to any of the preceding claims, the method comprising the steps of: -providing a housing part (12) comprising a first side wall (26) and a second side wall (28) and an upper side (30) connecting the side walls (26, 28); -providing a set of circuit boards (14), wherein the circuit boards (14) are provided with different electrical connector means (16), and Providing a set of separate side parts (18, 20), wherein the side parts (18, 20) each have a different recess (38) corresponding to a different electrical connector means (16), -Wherein at least one circuit board (14) is selected from the set of circuit boards (14) and a respective side member (18, 20) is selected from the set of side members (18, 20), and -Wherein the selected circuit board (14) is inserted into the receiving space (32) of the housing part (12) and the selected side part (18, 20) is connected to the housing part (12) such that the first side wall (26) and the second side wall (28) together with the side part (18, 20) form a continuous housing wall, and the connector means (16) arranged on the circuit board (14) are accessible through the recess (38) in the side part (18, 20).
  10. 10. The method according to claim 9, characterized in that the side parts (18, 20) are preassembled on the circuit board (14) before the circuit board (14) is inserted into the housing part (12).
  11. 11. Method according to claim 9 or 10, characterized in that before inserting the circuit board (14) into the housing part (12), one cover part (24) is selected from a group of different cover parts (24) and the cover part (24) is inserted into a recess (34) in the upper side (30) of the housing part (12) in a direction from the housing interior towards the outside.
  12. 12. Method according to any one of claims 9 to 11, characterized in that after the circuit board (14) and the side parts (18, 20) have been inserted into the housing part (12), a bottom part (22) is fitted onto the housing (12), which bottom part in the fastened state rests against the lower edges of the side parts (18, 20).

Description

Modular system for manufacturing electronic devices and method for manufacturing electronic devices Technical Field The present invention relates to a modular system for manufacturing an electronic device and a method for manufacturing an electronic device. The electronic device is for example an intelligent device. Background Such electronic devices typically include a housing, components (e.g., electronic components and joint mechanisms) disposed in the housing, and at least one circuit board as a wiring carrier for the components (i.e., the electronic components and joint mechanisms). Electronic devices are available in different configurations. For manufacturing, therefore, different components, in particular housings or circuit boards of different sizes, are required. This is disadvantageous in terms of manufacturing costs, since the own mould must be manufactured for the different components. The large part diversity is also disadvantageous in terms of logistics, since the different parts for manufacturing have to be registered and stored separately, which is finally reflected in the manufacturing aspects as well. Disclosure of Invention It is therefore an object of the present invention to provide an electronic device which can be produced cost-effectively. According to the invention, this object is achieved by a modular system for producing electronic devices, comprising a housing part, which comprises a first side wall and a second side wall and an upper side connecting the side walls, a set of circuit boards, which are provided with different electrical connector means, and a set of separate side parts, which each have different recesses corresponding to different electrical connector means. Between the first side wall and the second side wall there is a receiving space for receiving at least one circuit board of the set of circuit boards. Optionally, at least one circuit board of the set of circuit boards can be inserted into the receiving space and a respective one of the set of discrete side parts can be connected with the housing part such that the first and second side walls together with the side part form a continuous housing wall and the connector means arranged on the circuit board is accessible through a recess in the side part. In particular, the connector means arranged on the circuit board are externally accessible, so that, for example, a plug connector can be connected to the connector means from the outside. The component diversity of the individual components is reduced by the modular system according to the invention. In particular, the same housing part can be used for producing different variants of the electronic device. The housing is personalized as required by connecting separate side parts with the housing parts. In this way, the electronic device can be manufactured particularly cost-effectively. The mould for manufacturing the variable member, in particular the side member, is smaller and less complex and thus more cost-effective than the mould for manufacturing the complete housing. Larger and geometrically more complex molds for manufacturing the housing parts have to be manufactured only once for the modular system. The relative mold cost per component is also reduced because the housing parts are manufactured in a large number compared to the individual side parts. The circuit boards and the side parts are in particular present in pairs, that is to say for each circuit board of the set of circuit boards, the associated side part of the set of side parts is present. For example, separate side members can be connected to the first side wall, the second side wall and/or the upper side. In the assembled state, the housing therefore has a plurality of side walls, which are formed by the side walls of the housing parts, i.e. the first and second side walls, and at least one separate side part. Optionally, there is additionally a set of separate second side parts, which can likewise be connected to the housing part. The set of separate second side members comprises in particular the same side members as the set of separate first side members. For example, two identical or two different side parts may be connected to the housing part. In another alternative embodiment, the housing part may have a third side wall, so that only one discrete side part can be connected with the housing part. The one discrete side part thus constitutes four side walls of the housing with the side walls in the assembled state. The housing part is, for example, hood-shaped. The sidewalls may be parallel to each other. The side members are for example plate-shaped. The circuit boards of the above-described group can additionally differ in their size in addition to the different connector mechanisms. The housing part is of overall modular design, since it can be coupled to a plurality of different side parts. In principle, the modular system also ensures that it is possible to retrofit, for example t