CN-122029946-A - Housing for electronic components, device with housing and housing manufacturing method

Abstract

Housing (1) for receiving an electronic component, having a housing wall (2) and a heat-dissipating element (3), wherein the heat-dissipating element (3) is constructed in one piece with the housing wall (2), wherein the heat-dissipating element (3) and the housing wall (2) are produced by a multicomponent injection molding process, wherein the heat-dissipating element (3) is arranged such that heat generated in the electronic component can be transferred to the housing wall (2) by means of the heat-dissipating element (3), and wherein the heat-dissipating element (3) is designed and arranged such that the electronic component can be surface-contacted by means of the heat-dissipating element (3).

Inventors

• Michael Walterberg

Assignees

• 利萨·德雷克塞迈尔有限责任公司

Dates

Publication Date

20260512

Application Date

20240911

Priority Date

20231010

Claims (13)

1. 1. A housing (1) for receiving an electronic component, the housing having: A housing wall (2), and A heat-dissipating element (3), Wherein the heat dissipation element (3) is embodied in one piece with the housing wall (2), Wherein the heat dissipation element (3) and the housing wall (2) are obtained by means of a multi-component injection molding process, Wherein the heat dissipation element (3) is arranged such that heat generated within the electronic component can be transferred to the housing wall (2) through the heat dissipation element (3), and Wherein the heat dissipation element (3) is designed and arranged such that electronic components can be surface contacted by the heat dissipation element (3).
2. 2. The housing (1) according to claim 1, wherein the housing wall (2) forms a receiving area (4) for receiving an electronic component, and wherein the heat dissipating element (3) is arranged within the receiving area (4).
3. 3. The housing (1) according to claim 2, wherein the heat dissipation element (3) is arranged on the side of the housing wall (2) facing the receiving area (4).
4. 4. The housing (1) according to any of the preceding claims, wherein the heat dissipating element (3) has a contact surface for contacting an electronic component, wherein the contact surface is designed to be able to mate with a surface of an electronic component.
5. 5. The housing (1) according to claim 4, wherein the contact surface is designed with a negative shape of an electronic component.
6. 6. The housing (1) according to claim 4 or 5, wherein the contact surface is designed to fit onto a surface of the electronic component.
7. 7. The housing (1) according to any one of claims 4 to 6, wherein the contact surface has a three-dimensional contour.
8. 8. The housing (1) according to any of the preceding claims, wherein the heat dissipating element (3) has an elastomer.
9. 9. The housing (1) according to any of the preceding claims, wherein the heat dissipating element (3) is electrically insulating.
10. 10. The housing (1) according to any of the preceding claims, wherein the heat dissipating element (3) has a phase change material element.
11. 11. A device having a housing (1) according to any of the preceding claims and an electronic component, wherein the electronic component is mounted within the housing (1).
12. 12. The device according to claim 11, wherein the electronic component has at least one heat sink in contact with the heat dissipating element (3).
13. 13. A method for manufacturing a housing (1) according to any of the preceding claims, the method having the steps of: -providing a first material for manufacturing the housing wall (2); -providing a second material for manufacturing a heat dissipating element (3), and -Manufacturing the housing wall (2) and the heat dissipating element (3) integrally connected to the housing wall (2) by a multi-component injection molding process.

Description

Housing for electronic components, device with housing and housing manufacturing method Technical Field The invention relates to a housing for receiving an electronic component and a corresponding device having a housing. The invention further relates to a method for producing a housing. Background Electronic components, such as circuit boards on which MOSFETs or other semiconductors are mounted, generate a significant amount of heat during operation, which must be transferred from the electronic component to the environment. A housing that protects the electronic components from external influences may hinder the conduction of heat from the circuit board into the environment. Accordingly, a series of measures are known in the art to optimize the heat transfer of electronic components through the housing to the environment. Thus, for example, cooling ribs are often provided on the housing to increase the surface area of the housing and thus optimize the heat transfer of the housing to the environment. Furthermore, it is also known from the prior art to use a thermally conductive paste arranged between the electronic component and the housing and to achieve an optimized heat transfer from the electronic component to the housing. In particular, the thermal paste is applied to the housing before the electronic component is mounted in the housing, which means an additional mounting step when the electronic component is mounted in the housing. In addition, air bubbles are typically generated when the thermal paste is applied to the housing, which reduces the thermal conduction of the electronic component to the housing. Disclosure of Invention The object of the invention is to provide a housing for receiving electronic components, a corresponding device and a method for manufacturing, which allow particularly effective cooling of the components and at the same time a particularly short cycle time in the manufacture of the housing and in the installation of the electronic components in the housing, by using a structurally as simple a manner as possible. This object is solved by the object of the independent claims. Advantageous developments of the invention are given in the dependent claims, the description and the figures. According to a first aspect of the invention, this technical problem is solved by a housing for receiving an electronic component, the housing having a housing wall and a heat-dissipating element, wherein the heat-dissipating element is constructed in one piece with the housing wall, wherein the heat-dissipating element and the housing wall are manufactured by a multicomponent injection molding process (in particular by a two-component injection molding process), wherein the heat-dissipating element is arranged such that heat generated in the electronic component can be transferred through the heat-dissipating element to the housing wall, and wherein the heat-dissipating element is designed and arranged such that the electronic component can be surface-contacted by the heat-dissipating element. In other words, the heat dissipation element is constructed in one piece with the housing wall. That is to say that the heat-dissipating element and the housing wall are integrally connected to each other. In the sense of the present invention, the fact that two parts are integrally formed with one another means that the two parts are connected to one another in a material-bonded manner. According to the invention, this material-bonded connection is achieved by producing the two parts in a multicomponent injection molding process. A multicomponent injection molding process in the sense of the present invention may for example comprise a so-called overmolding process. This means that the multi-component injection molding process may comprise the steps of first manufacturing the housing wall as an injection molded part from a first component and then overmolding the housing wall or a part thereof with a second component that ultimately forms the heat dissipating element. A multi-component injection molding process in the sense of the present invention may also comprise, for example, simultaneous or sequential injection of a first component and a second component into the mold cavity, wherein the first component ultimately forms the housing wall and the second component ultimately forms the heat-dissipating element. The heat dissipating element and the housing wall may be made of different materials. The housing can be produced by a multicomponent injection molding process, in particular by a two-component injection molding process. The housing according to the invention allows an optimal transfer of heat generated in the electronic component from the housing to the environment by using a structurally as simple as possible. In particular, by constructing the heat-dissipating element as one piece with the housing wall, air inclusions in the form of air gaps or air bubbles between the housing wall and the he